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Vertical system integration

  • US 7,402,897 B2
  • Filed: 08/08/2003
  • Issued: 07/22/2008
  • Est. Priority Date: 08/08/2002
  • Status: Expired due to Fees
First Claim
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1. A method of making a stacked integrated circuit comprising:

  • providing a design library comprising a plurality of physical IC designs of fabricated circuit layers, wherein a circuit layer is from the group of an integrated circuit and a stacked integrated circuit; and

    using at least one circuit layer from the design library to fabricate the stacked integrated circuit, wherein said circuit layer is designed with interconnections that are completed during fabrication of the stacked integrated circuit and said interconnections pass through said circuit layer forming independent signal paths.

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