Power module structure and solid state relay using same
First Claim
1. A power module structure comprising:
- a heat plate for contacting a heat sink;
an insulating plate soldered to said heat plate;
a terminal soldered to said insulating plate; and
a semiconductor chip having contact point corresponding to said terminal so as to contact said terminal through said contact point;
wherein said terminal is provided with a shock absorbing part that serves to weaken a force generated due to the difference in coefficient of thermal expansion between said terminal and said insulating plate; and
wherein said terminal has a force restricting part that serves to restrict said force and is locally formed as a soldering area through which said terminal is soldered to said insulating plate.
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Accused Products
Abstract
A power module structure has a heat plate for contacting a heat sink, an insulating plate soldered to the heat plate, a terminal soldered to the insulating plate and a semiconductor chip having a contact point corresponding to the terminal so as to contact the terminal through this contact point. The terminal is provided with a shock absorbing part that serves to weaken the force generated due to the difference in coefficient of thermal expansion between the terminal and the insulating plate. The terminal has a force restricting part that serves to restrict this force and is locally formed as a soldering area through which the terminal is soldered to the insulating plate. Such a structure is contained inside a base and makes a surface-contact with a heat sink to form a solid state relay.
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Citations
16 Claims
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1. A power module structure comprising:
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a heat plate for contacting a heat sink; an insulating plate soldered to said heat plate; a terminal soldered to said insulating plate; and a semiconductor chip having contact point corresponding to said terminal so as to contact said terminal through said contact point; wherein said terminal is provided with a shock absorbing part that serves to weaken a force generated due to the difference in coefficient of thermal expansion between said terminal and said insulating plate; and wherein said terminal has a force restricting part that serves to restrict said force and is locally formed as a soldering area through which said terminal is soldered to said insulating plate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A solid state relay comprising:
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a heat sink; a base attached to an end surface of said heat sink; and a power module structure which is contained in said base and makes a surface-contact with said heat sink, said power module structure comprising; a heat plate contacting said heat sink; an insulating plate soldered to said heat plate; a terminal soldered to said insulating plate; and a semiconductor chip having a contact point corresponding to said terminal so as to contact said terminal through said contact point; wherein said terminal is provided with a shock absorbing part that serves to weaken a force generated due to the difference in coefficient of thermal expansion between said terminal and said insulating plate; and wherein said terminal has a force restricting part that serves to restrict said force and is locally formed as a soldering area through which said terminal is soldered to said insulating plate. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16)
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Specification