Component testing and recovery
First Claim
1. A system comprising:
- a first device component including a plurality of circuits configured for storing test data generated through testing of the first device component, the test data including an identity of a defective circuit within the first device;
a second device component including an excess circuit configurable to replace the defective circuit of the first device component;
a third device component configured for reading the test data stored in the first device component and replacing the defective circuit with the excess circuit; and
an electronic device packaging incorporating the first device component, the second device component, and the third device component.
4 Assignments
0 Petitions
Accused Products
Abstract
Disclosed are systems and methods of producing electronic devices. These electronic devices include excess circuits to be used as replacements for circuits that are found to be defective within the electronic device. The excess circuits are included in a different device component than the circuits that are found to be defective. The replacement process occurs after the excess circuits and defective circuits are included in an electronic device including the different device components. Identification of the defective circuits may occur before or after the defective circuits are incorporated in the electronic device. In some embodiments, systems and methods of the invention result in improved manufacturing yields as compared with the prior art.
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Citations
12 Claims
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1. A system comprising:
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a first device component including a plurality of circuits configured for storing test data generated through testing of the first device component, the test data including an identity of a defective circuit within the first device; a second device component including an excess circuit configurable to replace the defective circuit of the first device component; a third device component configured for reading the test data stored in the first device component and replacing the defective circuit with the excess circuit; and an electronic device packaging incorporating the first device component, the second device component, and the third device component. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method comprising:
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testing a first device component to generate test data, the first device component including a plurality of circuits; storing the test data in one or more of the plurality of circuits, the test data including an identity of a defective circuit within the plurality of circuits; incorporating the first device component in an electronic device packaging after storing the test data; incorporating a second device component in the electronic device packaging, the second device component including an excess circuit configurable to replace the defective circuit of the first device component; and reading the test data stored in the first device component and substituting the excess circuit for the defective circuit using the read test data. - View Dependent Claims (9, 10, 11, 12)
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Specification