Producing method of producing a solid pickup device

• US 7,404,248 B2
• Filed: 01/11/2006
• Issued: 07/29/2008
• Est. Priority Date: 04/24/2002
• Status: Expired due to Fees

• Current Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: Fujifilm Corporation (Fujifilm Holdings Corporation)
• Inventors: Misawa, Atsushi, Misawa, Takeshi, Yamazaki, Akihisa
• Primary Examiner(s): Kim; Paul D
• Application Number:
  US11/329,180
• Publication Number:
  US 20060117550A1
• Time in Patent Office: 930 Days
• Field of Search: 294/17, 295/921, 295/95, 369/125, 438/68
• US Class Current: 29/595
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 27/14685 Process for coatings or optical elements
• CPC Class Codes: H01L 27/14687 Wafer level processing
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/0232 Optical elements or arrangements associated with the device H01L31/0236 takes precedence; for photovoltaic cells H01L31/054; for photovoltaic modules H02S40/20
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/49007 Indicating transducer
• CPC Class Codes: Y10T 29/4908 Acoustic transducer
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49798 Dividing sequentially from leading end, e.g., by cutting or breaking
• CPC Class Codes: Y10T 29/49826 Assembling or joining
• CPC Class Codes: Y10T 29/49904 Assembling a subassembly, then assembling with a second subassembly
• CPC Class Codes: Y10T 29/5313 Means to assemble electrical device
• CPC Class Codes: Y10T 29/53174 Means to fasten electrical component to wiring board, base, or substrate
• CPC Class Codes: Y10T 29/53265 with work-holder for assembly

Abstract

A producing method of producing a solid state pickup device is provided. Imaging elements are formed on a wafer in a matrix form. Each of the imaging elements has a light receiving surface and plural contact points. Receiving surface border portions are formed on a glass plate to protrude therefrom in a matrix form by etching. The receiving surface border portions are attached to the wafer to surround the light receiving surface in each of the receiving surface border portions. The light receiving surface is spaced from the glass plate. The glass plate is diced outside respectively the receiving surface border portions, to form shield glass for covering the light receiving surface. The wafer is diced for each of the imaging elements, to obtain the solid state pickup device having the shield glass and one of the imaging elements.

Claims

1. A producing method of producing a solid state pickup device, comprising steps of:

forming plural light receiving surfaces on a wafer, each of said light receiving surfaces being adapted to convert incident light of an image to an electric signal;

forming first and second grooves in a shield glass plate substantially in parallel with each other;

attaching said shield glass plate to said wafer by opposing said first and second grooves to positions offset from said light receiving surface, wherein ends of said first and second grooves appear externally;

attaching a reinforcing glass plate to said wafer on a side opposite to said shield glass plate;

dicing said wafer, said shield glass plate and said reinforcing glass plate together for each of said light receiving surfaces, to obtain said solid state pickup device;

inserting first and second projections into end openings of said first and second grooves, said first and second projections projecting from a first auxiliary panel, whereby said first auxiliary panel is connected with said solid state pickup device; and

inserting third and fourth projections into end openings of said first and second grooves, said third and fourth projections projecting from a second auxiliary panel, whereby said second auxiliary panel is connected with said solid state pickup device, said first and second auxiliary panels being adapted to attachment to an electronic camera.

2. The producing method as defined in claim 1, wherein said solid state pickup device is positioned in an optical axis direction thereof and in a first direction crosswise to said optical axis direction by engagement of said first and second grooves with said first to fourth projections;

said solid state pickup device is positioned in a second direction crosswise to said optical axis direction by engagement of said shield glass plate with said first and second auxiliary panels.

3. The producing method as defined in claim 2, wherein in said groove forming step, plural pairs of said first and second grooves are formed in said shield glass plate.

4. The producing method as defined in claim 3, wherein said first and second auxiliary panels have holes with which said first and second auxiliary panels are fixed to a lens holder of said electronic camera.

5. The producing method as defined in claim 4, wherein screws are used for fixation with said holes.

6. The producing method as defined in claim 4, further comprising a step of applying a coating to surfaces of said first and second grooves in said shield glass plate, for preventing adhesive agent from being stuck.

7. The producing method as defined in claim 6, further comprising a step of forming a positioning indicia on said shield glass plate at a portion of said first and second grooves, said positioning indicia being adapted for positioning said shield glass plate on said wafer.

8. The producing method as defined in claim 6, wherein said first and second grooves have a triangular shape as viewed in section.

9. The producing method as defined in claim 6, wherein said first and second grooves have a trapezoidal shape as viewed in section.