Substrate processing apparatus

• US 7,404,407 B2
• Filed: 12/26/2006
• Issued: 07/29/2008
• Est. Priority Date: 07/16/2001
• Status: Expired due to Fees

• Current Assignee: Tokyo Electron Limited
• Original Assignee: Tokyo Electron Limited
• Inventors: Kuroda, Osamu, Orii, Takehiko
• Primary Examiner(s): Stinson; Frankie L
• Application Number:
  US11/616,075
• Publication Number:
  US 20070105379A1
• Time in Patent Office: 581 Days
• Field of Search: 134/200, 134/902
• US Class Current: 134/94.1
• CPC Class Codes: C03C 23/0075 Cleaning of glass specially adapted to plate glass B08B11/00
• CPC Class Codes: H01L 21/67028 for cleaning followed by drying, rinsing, stripping, blasting or the like
• CPC Class Codes: H01L 21/67051 using mainly spraying means, e.g. nozzles
• CPC Class Codes: H01L 21/67178 vertical arrangement
• CPC Class Codes: Y10S 134/901 Contact lens
• CPC Class Codes: Y10S 134/902 Semiconductor wafer

Abstract

The substrate processing apparatus has an enclosure structure enclosing a substrate support member to define a processing space. The enclosure structure has an opening closed by a shutter. A processing fluid supply unit, which supplies processing fluid, such as chemical liquid, is accommodated in a housing. The processing fluid supply unit accommodated in the housing is advanced into the processing space through the opening of the enclosure structure to feed the processing fluid onto the substrate supported by the substrate support member.

Claims

1. A substrate processing apparatus comprising:

a substrate support member that supports a substrate arranged in a processing space;

a first processing fluid supply unit including a first nozzle for supplying a first processing fluid onto a substrate supported by the substrate support member, and a first arm holding the first nozzle;

a second processing fluid supply unit including a second nozzle for supplying a second processing fluid onto a substrate supported by the substrate support member, and a second arm holding the second nozzle;

a first housing defining a first room adapted to accommodate the first processing fluid supply unit;

a second housing defining a second room adapted to accommodate the second processing fluid supply unit;

a first shutter disposed between the processing space and the first room, the first shutter being configured to open to allow the first nozzle held by the first arm to move into the processing space, and confirmed to close to separate the first room accommodating the first processing fluid supply unit from the processing space; and

a second shutter disposed between the processing space and the second room, the second shutter being configured to open to allow the second nozzle held by the second arm to move into the processing space, and configured to close to separate the second room accommodating the second processing fluid supply unit from the processing space.

2. The apparatus according to claim 1 further comprising an enclosure structure defining the processing space in which the substrate support member is arranged.

3. The apparatus according to claim 1 further comprising;

a first cleaning unit disposed in the first room to clean the first processing fluid supply unit; and

a second cleaning unit disposed in the second room to clean the second processing fluid supply unit.

4. The apparatus according to claim 1, wherein the first processing fluid supply unit is configured to supply a chemical liquid, and the second processing fluid supply unit is configured to supply a rinse liquid.