Liquid cooled heat sink

• US 7,404,433 B1
• Filed: 01/31/2007
• Issued: 07/29/2008
• Est. Priority Date: 01/31/2007
• Status: Active Grant

• Current Assignee: Man Zai Industrial Co., Ltd.
• Original Assignee: Man Zai Industrial Co., Ltd.
• Inventors: Sun, Tsung-Ching, Hu, Jen-Lu, Lin, Hao-Hui
• Primary Examiner(s): Flanigan; Allen J
• Application Number:
  US11/701,293
• Publication Number:
  US 20080179045A1
• Time in Patent Office: 545 Days
• Field of Search: 165/80.4, 165/104.33, 361/699
• US Class Current: 165/80.4
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A liquid cooled heat sink includes: a casing defining an inner space and provided with a partitioning wall dividing the inner space into upper and lower chambers and formed with a fluid passage in fluid communication with the upper and lower chambers, the casing being formed with a fluid inlet in fluid communication with the upper chamber and adapted to be connected to an external cooling device; a fin unit provided in the lower chamber; and a pump mounted on the casing and having a suction end disposed in the upper chamber, extending through the partitioning wall, and in fluid communication with the lower chamber, and a discharging end disposed in the upper chamber and adapted to be connected to an external cooling device.

Claims

1. A liquid cooled heat sink adapted to be attached to an electronic component, said liquid cooled heat sink comprising:

a casing defining an inner space and provided with a partitioning wall that divides said inner space into upper and lower chambers, said partitioning wall being formed with a fluid passage in fluid communication with said upper and lower chambers, said casing being formed with a fluid inlet that is in fluid communication with said upper chamber and that is adapted to be connected to an external cooling device;

a fin unit provided in said lower chamber; and

a pump mounted on said casing and having a suction end disposed in said upper chamber, extending through said partitioning wall, and in fluid communication with said lower chamber for withdrawing fluid from said lower chamber, and a discharging end disposed in said upper chamber and adapted to be connected to a connecting pipe for discharging the fluid from said lower chamber into the external cooling device so as to circulate the fluid through said upper and lower chambers and the external cooling device.

2. The liquid cooled heat sink as claim in claim 1, wherein said casing has a top wall and a bottom wall that is formed with an attaching protrusion adapted to be attached to the electronic component, said top wall being formed with a recess defined by a recess-defining wall, said pump being mounted on said top wall and extending into said recess, said suction end of said pump extending through said recess-defining wall.