Wide and narrow trench formation in high aspect ratio MEMS

• US 7,405,099 B2
• Filed: 07/27/2005
• Issued: 07/29/2008
• Est. Priority Date: 07/27/2005
• Status: Expired due to Fees

• Current Assignee: North Star Innovations Inc. (Wi-LAN Inc.)
• Original Assignee: Freescale Semiconductor, Inc. (NXP Semiconductors NV)
• Inventors: Gogoi, Bishnu P.
• Primary Examiner(s): Toledo, Fernando L.
• Assistant Examiner(s): Lee, Jae
• Application Number:
  US11/192,198
• Publication Number:
  US 20070026636A1
• Time in Patent Office: 1,098 Days
• Field of Search: 438 50- 53, 257/414, 257/415, 257/417, 257/E29.324
• US Class Current: 438/50
• CPC Class Codes: B81B 2201/0242 Gyroscopes
• CPC Class Codes: B81C 1/00063 Trenches
• CPC Class Codes: G01C 19/5719 using planar vibrating masses driven in a translation vibration along an axis

Abstract

Methods have been provided for forming both wide and narrow trenches on a high-aspect ratio microelectromechanical (MEM) device on a substrate including a substrate layer (126), an active layer (128), and a first sacrificial layer (130) disposed at least partially therebetween. The method includes the steps of forming a first trench (154), a second trench (156), and a third trench (152) in the active layer (128), each trench (154, 156, 152) having an opening and sidewalls defining substantially equal first trench widths, depositing oxide and sacrificial layers thereover and removing the oxide and sacrificial layers to expose the third trench (152) and form a fourth trench (190) in the active layer (128) from the first and the second trench (154, 156), the fourth trench (190) having sidewalls defining a second trench width that is greater than the first trench width.

Claims

1. A method of forming a high-aspect ratio microelectromechanical (MEM) device on a substrate including a substrate layer, an active layer, and a first sacrificial layer disposed at least partially therebetween, the method comprising the steps of:

forming a first trench, a second trench, and a third trench in the active layer, each trench having an opening and sidewalls defining substantially equal first trench widths;

forming a second sacrificial layer over a surface of the active layer and the sidewalls of each of the trenches;

forming a third sacrificial layer over the second sacrificial layer and sealing the openings of each of the trenches with the third sacrificial layer;

forming an etch hole in the second sacrificial layer and the third sacrificial layer between the first trench and the second trench to expose a portion of the active layer;

removing material from the active layer between the first trench and the second trench to form a cavity having sidewalls and an opening;

forming a fourth sacrificial layer over the third sacrificial layer and the sidewalls of the cavity and sealing the cavity and its opening with the fourth sacrificial layer; and

removing the second sacrificial layer, the third sacrificial layer, and the fourth sacrificial layer to expose the third trench and form a fourth trench in the active layer from the first and the second trench, the fourth trench having sidewalls defining a second trench width that is greater than the first trench width.

2. The method of claim 1, wherein the step of forming the first trench, the second trench, and the third trench comprises etching the active layer using a deep reactive ion etch process.

3. The method of claim 1, wherein the steps of forming the second sacrificial layer and forming the third sacrificial layer are combined and the second sacrificial layer and the third sacrificial layer are a single layer.

4. The method of claim 1, wherein the third and fourth trenches have substantially equal trench depths.

5. The method of claim 1, wherein the third sacrificial layer and fourth sacrificial layer comprise the same material.

6. The method of claim 1, wherein the step of forming the third sacrificial layer comprises:

depositing a sacrificial material over a portion of the second sacrificial layer overlying the surface of the active layer; and

reflowing the sacrificial material to coat a portion of the second sacrificial layer overlying the sidewalls of the trenches and to seal the openings of the trenches.

7. The method of claim 1, wherein the step of forming the hole comprises:

depositing photoresist over the third sacrificial layer in a pattern, wherein the pattern includes a protected portion and an unprotected portion; and

etching the second sacrificial layer and third sacrificial layer of the unprotected portion to form the hole exposing the active layer.

8. The method of claim 1, wherein the step of removing material from the active layer between the first trench and the second trench comprises:

performing a gas phase etch on the active layer material between the first trench and the second trench.

9. The method of claim 1, wherein the step of removing material from the active layer between the first trench and the second trench comprises:

performing a wet etch on the active layer material between the first trench and the second trench.

10. The method of claim 1, further comprising:

forming a first contact opening and a second contact opening through the second sacrificial layer, the third sacrificial layer, and the fourth sacrificial layer, after the step of forming the fourth sacrificial layer; and

depositing an interconnect material over the third sacrificial layer and filling the first contact opening and second contact opening with the interconnect material to form an interconnect.

11. The method of claim 1, further comprising:

forming a fifth trench adjacent the third trench, the fifth trench having an opening and sidewalls defining a width substantially equal to the first trench width; and

removing a portion of the first sacrificial layer proximate the third trench and the fifth trench to form a suspension element from material of the active layer between the third trench and the fifth trench.

12. A method of forming a wide trench and a narrow trench on a substrate including an active layer disposed over a first sacrificial layer, the active layer having a surface, the method comprising the steps of:

etching a first trench and a second trench through the active layer to expose a surface of the first sacrificial layer, each trench having an opening, sidewalls defining a first trench width, and substantially equal and uniform first trench widths;

oxidizing the surface of the active layer and the sidewalls of the first trench and second trench;

depositing a sacrificial material over the oxidized surfaces to form a second sacrificial layer;

sealing the openings of the trenches with at least a portion of the second sacrificial layer;

etching a hole through a portion of the second sacrificial layer and the oxidized surface to expose a portion of the active layer;

removing material from the active layer between the first trench and the second trench to form a cavity having sidewalls;

depositing another sacrificial material over the second sacrificial layer and the sidewalls of the cavity to form a third sacrificial layer;

sealing the cavity with at least a portion of the third sacrificial layer; and

removing the second sacrificial layer, the third sacrificial layer, and material from the oxidized surface of the active layer to form a third trench in the active layer from the first and the second trenches, the third trench having sidewalls defining a second trench width that is greater than the first trench width.

13. The method of claim 12, further comprising:

forming a first contact opening and a second contact opening through the second sacrificial material, the third sacrificial material, and the oxidized surface, after the step of depositing another sacrificial material; and

depositing an interconnect material over the third sacrificial material and filling the first contact opening and second contact opening with the interconnect material to form an interconnect.

14. The method of claim 12, further comprising:

etching a fourth trench through the active layer, the fourth trench having an opening, sidewalls defining a width that is substantially equal to the width of the first trench;

oxidizing the surface of the sidewalls of the fourth trench; and

removing the second sacrificial layer, the third sacrificial layer, and material from the oxidized surface of the active layer over the fourth trench and exposing a sidewall of the fourth trench that defines a second trench width that is substantially equal to the first trench width.

15. The method of claim 12, further comprising:

forming a fifth trench adjacent the fourth trench, the fifth trench having an opening and sidewalls defining a width substantially equal to the first trench width; and

removing a portion of the first sacrificial layer under the active layer between the fourth trench and the fifth trench to form a suspension element.

16. The method of claim 12, wherein the step of etching the first trench and the second trench comprises etching the active layer using a deep reactive ion etch process.

17. The method of claim 12, wherein the step of removing material from the active layer between the first trench and the second trench comprises:

performing a gas phase etch on the active layer material between the first trench and the second trench.

18. The method of claim 12, wherein the step of removing material from the active layer between the first trench and the second trench comprises:

performing a wet etch on the active layer material between the first trench and the second trench.

19. A method of forming a wide trench and a narrow trench on a substrate including an active layer disposed over a first sacrificial layer, the active layer having a surface, the method comprising the steps of:

forming a first trench, a second trench, and a third trench in the active layer, each trench having an opening and sidewalls defining substantially equal first trench widths;

oxidizing the surface of the active layer and the sidewalls of the first trench, the second trench, and the third trench to form a second sacrificial layer;

depositing a sacrificial material over the second sacrificial layer to form a third sacrificial layer;

sealing the openings of the trenches with at least a portion of the third sacrificial layer;

etching a hole through a portion of the second sacrificial layer and the third sacrificial layer to expose a portion of the active layer;

removing material from the active layer between the first trench and the second trench to form a cavity having sidewalls;

depositing another sacrificial material over the third sacrificial layer and the sidewalls of the cavity to form a fourth sacrificial layer;

sealing the cavity with at least a portion of the fourth sacrificial layer; and

removing the second sacrificial layer, the third sacrificial layer, and fourth sacrificial layer to expose the third trench and form a fourth trench in the active layer from the first and the second trenches, the fourth trench having sidewalls defining a second trench width that is greater than the first trench width.