Adaptable electronic storage apparatus

• US 7,405,470 B2
• Filed: 03/29/2005
• Issued: 07/29/2008
• Est. Priority Date: 03/26/1998
• Status: Expired due to Fees

• Current Assignee: Toshiba Memory Corporation (Kioxia Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Iwasaki, Hiroshi
• Primary Examiner(s): Williams; Alexander O
• Application Number:
  US11/091,773
• Publication Number:
  US 20050167809A1
• Time in Patent Office: 1,218 Days
• Field of Search: 257/E23.064, 257/E23.125, 257/E23.061, 257/E23.124, 257/E21.504, 257/681, 257/688, 257/698, 257/783, 257/774, 257/679, 257/396, 257/390, 257/209, 257/415, 257/680, 257/315, 438/116, 365/202
• US Class Current: 257/679
• CPC Class Codes: G06K 19/07739 comprising a first part capable of functioning as a record carrier on its own and a second part being only functional as a form factor changing part, e.g. SIM cards type ID 0001, removably attached to a regular smart card form factor
• CPC Class Codes: G06K 19/07743 External electrical contacts
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/4847 the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
• CPC Class Codes: H01L 2224/48472 the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15165 Monolayer substrate
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/207 : Diameter ranges

Abstract

A storage apparatus 10 is disclosed, that comprises a wiring substrate 11 having a first surface and a second surface, a flat type external connection terminal 12a disposed on the first surface of the wiring substrate 11, a semiconductor device 14 disposed on the second surface of the wiring substrate 11 and having a connection terminal 14a connected to the flat type external connection terminal 12a, a molding resin 15 for coating the semiconductor device 14 on the second surface of the wiring substrate 11, a card type supporting frame 10a having a concave portion or a hole portion fitting the wiring substrate 11, the semiconductor device 14, and the molding resin 15 in such a manner that the flat type external connection terminal 12a is exposed to the first surface of the wiring substrate 11, and adhesive resin a adhering integrally the flat type external connection terminal 12a, the wiring substrate 11, the semiconductor device 14, the molding resin 15, and the card type supporting frame 10a. In addition, the storage apparatus 10 can be combined with a card type supporting means 21 that supports detachably with the flat type external connection terminal 12a exposed to one of the surfaces so as to be used as a card type storage apparatus 20 having bigger size.

Claims

1. A storage apparatus, comprising:

a wiring substrate having a first surface and a second surface;

a flat type external connection terminal disposed on the first surface of said wiring substrate;

a semiconductor device disposed on the second surface of said wiring substrate and having a substrate connection terminal connected to said flat type external connection terminal through said wiring substrate;

molding resin which coats said semiconductor device and the second surface of said wiring substrate; and

a supporting frame which supports the semiconductor device and has a concave portion or a hole portion, the concave portion or the hole portion fitting said wiring substrate and said molding resin in such a manner that said flat type external connection terminal is exposed while the semiconductor device is supported by the supporting frame.

2. The storage apparatus as set forth in claim 1, wherein

the second surface of the wiring substrate has a first area and a second area, the first area being unsymmetrically located with respect to a perimeter of said wiring substrate;

said semiconductor device is disposed on the first area of the second surface of said wiring substrate; and

said molding resin coats said semiconductor device and the first area of the second surface of said wiring substrate so as to render the second area of the second surface uncovered.

3. The storage apparatus as set forth in claim 1, wherein

the second surface of the wiring substrate has a first area and a second area, the first area deviating along a longer side of said wiring substrate;

said semiconductor device is disposed on the first area of the second surface of said wiring substrate; and

said molding resin coats said semiconductor device and the first area of the second surface of said wiring substrate so as to render the second area of the second surface uncovered.

4. The storage apparatus as set forth in claim 2, further comprising:

adhesive resin filled between said supporting frame and at least one of said wiring substrate and said molding resin.

5. The storage apparatus as set forth in claim 3, further comprising:

adhesive resin filled between said supporting frame and at least one of said wiring substrate and said molding resin.

6. The storage apparatus as set forth in claim 2,

wherein said supporting frame is a card type, and the concave portion or the hole portion is formed on at least one surface of said supporting frame.

7. The storage apparatus as set forth in claim 3,

wherein said supporting frame is a card type, and the concave portion or the hole portion is formed on at least one surface of said supporting frame.

8. The storage apparatus as set forth in claim 4,

wherein said adhesive resin is so filled as to integrally adhere said flat external connection terminal, said wiring substrate, said semiconductor device, said molding resin, and said supporting frame.

9. The storage apparatus as set forth in claim 5,

wherein said adhesive resin is so filled as to integrally adhere said flat external connection terminal, said wiring substrate, said semiconductor device, said molding resin, and said supporting frame.

10. The storage apparatus as set forth in claim 2,

wherein the area of said supporting frame is the half or less of the area of said flat type external connection terminal.

11. The storage apparatus as set forth in claim 2,

wherein said semiconductor device is a serial access type semiconductor.

12. The storage apparatus as set forth in claim 2,

wherein said semiconductor device is a flash memory.

13. The storage apparatus as set forth in claim 2,

wherein said semiconductor device is a NAND type EEPROM or an AND type EEPROM.

14. The storage apparatus as set forth in claim 2,

wherein said flat type external connection terminal is composed of a conductor layer disposed on the first surface of said wiring substrate and having a slit for separating the first surface into a plurality of areas.

15. The storage apparatus as set forth in claim 14,

wherein a pattern of the silt connects any two points of the outer periphery of the conductor layer as a curved line or a bent line.

16. The storage apparatus as set forth in claim 3,

wherein the area of said supporting frame is the half or less of the area of said flat type external connection terminal.

17. The storage apparatus as set forth in claim 3,

wherein said semiconductor device is a serial access type semiconductor.

18. The storage apparatus as set forth in claim 3,

wherein said semiconductor device is a flash memory.

19. The storage apparatus as set forth in claim 3,

wherein said semiconductor device is a NAND type EEPROM or an AND type EEPROM.

20. The storage apparatus as set forth in claim 3,

wherein said flat type external connection terminal is composed of a conductor layer disposed on the first surface of said wiring substrate and having a slit for separating the first surface into a plurally of areas.

21. The storage apparatus as set forth in claim 20,

wherein a pattern of the slit connects any two points of the outer periphery of the conductor layer as a curved line or a bent line.

22. An electronic apparatus, comprising:

the storage apparatus as set forth in claim 1, said supporting frame having the concave portion or the hole portion formed on at least one surface of said supporting frame, the concave portion or the hole portion fitting said wiring substrate, and said molding resin in such a manner that said flat type external connection terminal is exposed to the first surface of said wiring substrate;

adhesive resin filled in a supporting space formed among said flat type external connection terminal, said wiring substrate, said molding resin, and said card type supporting frame so as to integrally adhere said flat type external connection terminal, said wiring substrate, said molding resin, and said card type supporting frame;

supporting means for supporting said storage apparatus;

a connection electrode that is contacted to said flat type connection terminal when said storage apparatus is supported by said supporting means; and

a driving circuit for accessing said semiconductor device through said connection electrode and said flat type external connection terminal.

23. The electronic apparatus as set forth in claim 22, wherein said driving circuit serially accesses said semiconductor device.