Inductor and method of forming the same

• US 7,405,643 B2
• Filed: 05/17/2007
• Issued: 07/29/2008
• Est. Priority Date: 01/03/2005
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Jeong, Joo-Hyun, Chung, Chul-Ho
• Primary Examiner(s): Nguyen; Tuyen T.
• Application Number:
  US11/804,320
• Publication Number:
  US 20070216510A1
• Time in Patent Office: 439 Days
• Field of Search: 336/65, 336/83, 336/200, 336206-208, 336/232, 257/531
• US Class Current: 336/200
• CPC Class Codes: H01F 17/0006 Printed inductances printed coils for dynamo-electric machines H02K3/26; printed circuits H05K
• CPC Class Codes: H01F 2017/0046 with a conductive path having a bridge
• CPC Class Codes: H01F 2017/0073 with a special conductive pattern, e.g. flat spiral
• CPC Class Codes: H01F 27/34 Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
• CPC Class Codes: H01F 41/041 Printed circuit coils apparatus or processes for manufacturing printed circuits in general H05K3/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

An inductor pattern is formed on a substrate. A conductive pattern having a concave-convex structure is formed on the inductor pattern to increase a surface area of the inductor pattern. An insulation layer is formed on the inductor pattern. After a groove is formed such that the insulation layer is removed to expose the inductor pattern, a conductive pattern is conformally formed on the groove and the insulation layer. Thus, a surface area of the inductor pattern as well as a thickness of an inductor increases to obtain an inductor of a high quality factor.

Claims

1. A method for forming an inductor, comprising:

forming an inductor pattern on a substrate;

forming an insulation layer on the substrate including the inductor pattern;

patterning the insulation layer to form a groove along the inductor pattern, the groove exposing a top and a sidewall of the inductor pattern; and

conformally forming a conductive pattern in the groove, on the top surface and sidewall of the inductor pattern and on the insulation layer.

2. The method as recited in claim 1, wherein a width of the groove is greater than that of the inductor pattern.

3. The method as recited in claim 1, wherein the inductor pattern comprises at least one of copper and aluminum.

4. The method as recited in claim 1, wherein the conductive pattern comprises aluminum.

5. The method as recited in claim 1, wherein the groove exposes both sidewalls of the inductor pattern.

6. The method as recited in claim 1, wherein a thickness of the conductive pattern is greater than that of the inductor pattern.

7. The method as recited in claim 6, wherein the conductive pattern comprises aluminum and the inductor pattern comprises at least one of copper and aluminum.