System and method for cooling electronic devices

• US 7,405,932 B2
• Filed: 07/19/2004
• Issued: 07/29/2008
• Est. Priority Date: 07/19/2004
• Status: Expired due to Fees

• Current Assignee: Hewlett Packard Enterprise Development LP (Hewlett-Packard Enterprise Company)
• Original Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Inventors: Volkmann, Art, Franz, John, Vinson, Wade
• Primary Examiner(s): LEA EDMONDS, LISA S
• Application Number:
  US10/894,215
• Publication Number:
  US 20060012955A1
• Time in Patent Office: 1,471 Days
• Field of Search: 361/695, 165/80.3
• US Class Current: 361/695
• CPC Class Codes: H05K 7/20727 within server blades for removing heat from heat source

Abstract

In accordance with certain embodiments, a computer system having an electronic component, a heat sink having a contact surface disposed against the electronic component, and at least one blower embedded within fins of the heat sink.

Claims

1. A computer system, comprising:

an electronic component;

a heat sink having a contact surface disposed against the electronic component; and

at least one blower embedded within fins of the heat sink, wherein the at least one blower is configured to intake air in a first direction and output air in a second direction generally transverse to the first direction.

2. The computer system of claim 1, wherein the electronic component comprises at least one processor.

3. The computer system of claim 1, wherein the fins comprise first fins extending to a first level and second fins extending to a second level, the second level being relatively higher than the first level.

4. The computer system of claim 3, wherein the at least one blower is disposed on the first fins.

5. The computer system of claim 4, wherein the fins comprise at least one blower receptacle having the first fins at a base of the blower receptacle.

6. The computer system of claim 5, wherein the second fins are disposed around sides of the at least one blower.

7. The computer system of claim 1, wherein the heat sink comprises an elongated structure having a first member disposed at a first tier and a second member disposed at a second tier, the second tier being relatively higher than the first tier, wherein the fins are disposed on the first and second members.

8. The computer system of claim 1, wherein the fins are disposed on opposite faces of an elongated member, the contact surface being disposed on one of the faces adjacent the fins.

9. The computer system of claim 1, wherein the heat sink comprises at least one chamber having a fluid that vaporizes to absorb heat at one region and that condenses to release heat at another region away from the first region.

10. The computer system of claim 1, wherein the heat sink comprises a top mount portion disposed over the electronic component and a lateral extension portion disposed laterally next to the electronic component.

11. The computer system of claim 1, wherein the at least one blower comprise a housing having a base opening and a side opening, the base opening being mounted to the fins at a first level and the side opening being directed toward fins at a second level, wherein the second level is relatively higher than the first level.

12. The computer system of claim 1, wherein the at least one blower comprises an inlet facing a first portion of the fins and an outlet facing a second portion of the fins.

13. The computer system of claim 1, comprising a server having the component, the heat sink, and the at least one blower.

14. The computer system of claim 13, comprising a rack mount computer system including the server.

15. The computer system of claim 1, comprising a plurality of blowers embedded within fins of the heat sink.

16. A heat sink for a computer, comprising:

an elongated member having a first portion, a second portion adjacent the first portion, and a component mounting surface disposed on a face of the second portion; and

a plurality of convective members disposed on the first and second portions, wherein the plurality of convective members extend outwardly from the elongated member to at least first and second levels, the second level being higher than the first level, wherein the plurality of convective members at the first level are adapted to receive at least one blower, wherein the at least one blower is configured to intake air in a first direction and output air in a second direction generally transverse to the first direction.

17. The heat sink of claim 16, wherein a portion of the convective members is configured to feed air to an inlet of the at least one blower and another portion of the convective members is configured to receive air from an exit of the at least one blower.

18. The heat sink of claim 16, wherein the plurality of convective members comprise fins that are oriented parallel and lengthwise along the elongated member.

19. The heat sink of claim 16, comprising at least one blower mounting region that is recessed within the plurality of convective members from the second level to the first level.

20. The heat sink of claim 16, wherein the plurality of convective members extending to the first level are disposed on the first portion, and the plurality of convective members extending to the second level are disposed on the second portion.

21. The heat sink of claim 16, wherein the plurality of convective members are disposed on opposite faces of the first portion.

22. The heat sink of claim 16, further comprising the at least one blower, the at least one blower having a base opening and a side opening, the base opening facing the plurality of convective members at the first level and the side opening facing the plurality of convective members at the second level.

23. A method of operating an electronic device, comprising:

transferring heat from an electronic component along an elongated member disposed across and extended away from the electronic component;

transferring heat from the elongated member through convective members to first and second levels; and

forcing an airflow through the convective members and lengthwise along the elongated member from at least one blower disposed substantially between the first and second levels, wherein forcing the airflow comprises pulling air in a first direction from a portion of the convective members into the at least one blower and pushing the air in a second direction from the at least one blower into another portion of the convective members, wherein the second direction is crosswise to the first direction.

24. The method of claim 23, wherein transferring heat from the electronic component comprises conducting heat away from a plurality of processors.

25. The method of claim 23, wherein transferring heat comprises transferring heat through at least one circulating vapor chamber extending along the elongated member.

26. The method of claim 23, wherein transferring heat from the elongated member through convective members comprises dissipating heat through convective members disposed on opposite faces of the elongated member.

27. The method of claim 23, wherein forcing the airflow comprises blowing air through bottom and side openings of the at least one blower, the bottom opening facing the convective members at the first level and the side opening facing the convective members at the second level.

28. The method of claim 23, wherein forcing the airflow through the convective members comprises channeling the airflow between a plurality of fins.

29. A electronic device, comprising:

means for transferring heat from an electronic component along an elongated member disposed across and extended away from the electronic component;

means for transferring heat from the elongated member through convective members to first and second levels; and

means for forcing an airflow through the convective members and lengthwise along the elongated member from at least one blower region substantially between the first and second levels, wherein the means for forcing air is configured to intake air in a first direction and output air in a second direction generally transverse to the first direction.

30. A method of manufacturing an electronic device, comprising:

providing a heat sink comprising an elongated member having a first portion, a second portion adjacent the first portion, and a component mounting surface disposed on a side of the second portion, the heat sink further comprising a plurality of convective members extending from the elongated member to at least first and second levels, the plurality of convective members adapted to support at least one blower substantially between the first and second levels, wherein the at least one blower is configured to intake air in a first direction and output air in a second direction generally transverse to the first direction.

31. The method of claim 30, comprising providing the at least one blower in a position to intake air from a portion of the convective members and to exhaust air into another portion of the convective members.

32. The method of claim 30, comprising embedding the at least one blower within a blower receptacle in the plurality of convective members between the first and second levels.

33. The method of claim 30, comprising mounting the heat sink to position the component mounting surface against a mating surface of at least one electronic component.

34. The method of claim 30, comprising assembling components of the electronic device, the components including the heat sink and the at least one blower.

35. The method of claim 30, wherein providing the heat sink comprises providing at least one circulating vapor chamber along the elongated member.

36. A computer system, comprising:

an electronic component;

a heat sink having a contact surface disposed against the electronic component, wherein the heat sink comprises at least one chamber having a fluid that vaporizes to absorb heat at one region and that condenses to release heat at another region away from the first region; and

at least one blower embedded within fins of the heat sink.