Backlight module structure for LED chip holder

• US 7,406,228 B2
• Filed: 12/23/2005
• Issued: 07/29/2008
• Est. Priority Date: 11/11/2005
• Status: Expired due to Fees

• Current Assignee: CPT Technology (Group) Co., Ltd.
• Original Assignee: Chunghwa Picture Tubes Limited (Tatung Co., Ltd.)
• Inventors: Chiu, Tien-Lung, Ting, Chu-Chi, Lo, Wei-Yu, Tseng, Wei-Yang
• Primary Examiner(s): Connelly-Cushwa; M. R.
• Assistant Examiner(s): Prince; Kajli
• Application Number:
  US11/315,235
• Publication Number:
  US 20070116424A1
• Time in Patent Office: 949 Days
• Field of Search: 385/39
• US Class Current: 385/39
• CPC Class Codes: G02B 6/0021 for housing at least a part of the light source, e.g. by forming holes or recesses
• CPC Class Codes: G02B 6/0028 Light guide, e.g. taper
• CPC Class Codes: G02B 6/0031 Reflecting element, sheet or layer

Abstract

The present invention provides a backlight module for a light emitting device (LED) chip holder. The backlight module includes a top guide-light board, a bottom guide-light board, a chip holder with an inclined plane thereon, and a light emitting diode chip. One side of the top guide-light board and the bottom guide-light board has a reflective sheet, and the light emitting diode chip is located on the inclined surface of the chip holder, and further the light emitting diode chip is embedded in the bottom guide-light. When the light emitting diode chip emits incident light, the light produces the total reflection on the bottom guide-light board to reflect to the reflective mirror. Then, the light is reflected to the top guide-light board by the reflective sheet, and is emitted out from the top guide-light board to be a light source for the backlight module.

Claims

1. A light emitting diode chip backlight module, comprising:

a top guide-light board;

a bottom guide-light board located under said top guide-light board;

a chip holder having a flat plane and a inclined plane, wherein said flat plane is disposed under said bottom light-guide board to decrease the thickness of the backlight module, and said inclined plane bends toward an inclined side of said bottom guide-light board, having an angle between said flat plane and said inclined plane, said angle being larger than 90 degrees and less than 180 degrees;

a light emitting diode chip disposed on said bent plane; and

a reflective mirror located on the other side of said bottom guide-light board and a side of said top guide-light board, wherein said reflective mirror reflects light from said bottom guide-light board to said top guide-light board.

2. The light emitting diode chip backlight module according to claim 1, wherein said top guide-light board comprises a plurality of marks therein.

3. The light emitting diode chip backlight module according to claim 1, wherein said chip holder comprises a metal substrate.

4. The light emitting diode chip backlight module according to claim 1, wherein said light emitting diode chip comprises a red, green, and blue (RGB) light emitting diode chip.

5. The light emitting diode chip backlight module according to claim 1, wherein said light emitting diode chip comprises a white light emitting diode chip.

6. The light emitting diode chip backlight module according to claim 1, further comprising a first reflective sheet, a second reflective sheet, and a third reflective sheet, said first reflective sheet located between said top guide-light board and said bottom guide-light board, said second reflective sheet located between said first reflective sheet and said bottom guide-light board, and said third reflective sheet located under said bottom guide-light board.

7. The light emitting diode chip backlight module according to claim 1, further comprising an epoxy resin covering said light emitting diode chip.

8. The light emitting diode chip backlight module according to claim 1, wherein said light emitting diode chip is embedded in said bottom guide-light board.

11. The light emitting diode chip backlight module according to claim 1, wherein said chip holder comprises a metal substrate.

9. A light emitting diode chip backlight module, comprising:

a top guide-light board;

a bottom guide-light board having a cave therein, and said bottom guide-light board being located under said top guide-light board;

a chip holder located on a side of said cave of said bottom guide-light board, said chip holder having a flat plane and a inclined plane, wherein said flat plane is disposed under said bottom guide-light board to decrease the thickness of the backlight module, and said inclined plane bends toward said side of said cave of said bottom guide-light board, having an angle between said flat plane and said inclined plane, said angle being larger than 90 degrees and less than 180 degrees;

a light emitting diode chip disposed on said bent plane; and

a reflective mirror located on the other side of both said bottom guide-light board and one side of said top guide-light board, wherein said reflective mirror reflects light from said bottom guide-light board to said top guide-light board.

10. The light emitting diode chip backlight module according to claim 9, wherein said top guide-light board comprises a plurality of marks therein.

12. The light emitting diode chip backlight module according to claim 9, wherein said light emitting diode chip is embedded into said bottom guide-light board.

13. The light emitting diode chip backlight module according to claim 9, further comprising a first reflective sheet, a second reflective sheet, and a third reflective sheet, said first reflective sheet located between said top guide-light board and said bottom guide-light board, said second reflective sheet located between said first reflective sheet and said bottom guide-light board, and said third reflective sheet located under said bottom guide-light board.

14. The light emitting diode chip backlight module according to claim 9, wherein said light emitting diode chip comprises a red, green, and blue (RGB) light emitting diode chip.

15. The light emitting diode chip backlight module according to claim 9, wherein said light emitting diode chip comprises a white light emitting diode chip.