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Semiconductor sensor

  • US 7,406,870 B2
  • Filed: 12/14/2005
  • Issued: 08/05/2008
  • Est. Priority Date: 01/06/2005
  • Status: Expired due to Fees
First Claim
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1. A semiconductor sensor comprising:

  • a proof mass;

    a frame that is arranged around the proof mass;

    a beam that is arranged at a surface side of the frame and is configured to support the proof mass;

    a plurality of piezo-resistive elements arranged on the beam;

    an insulating film arranged on the surface side of said frame and beam supporting said proof mass of said semiconductor sensor, and said insulating film having through-holes corresponding to edge positions of the piezo-resistive elements;

    a plurality of metal wiring patterns and a plurality of pad electrodes arranged on the insulating film, said metal wiring patterns passing through said through-holes of said insulating film to electrically connect to the piezo-resistive elements;

    a cover plate that is fixed to the surface side of the frame via the insulating flim and is arranged to be spaced apart from the proof mass and the beam; and

    a cover plate fixing region for fixing the cover plate to the surface side of the frame, the cover plate fixing region including a formation region for the metal wiring patterns.

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