×

Semiconductor mechanical sensor

  • US 7,407,827 B2
  • Filed: 08/23/2005
  • Issued: 08/05/2008
  • Est. Priority Date: 08/21/1992
  • Status: Expired due to Fees
First Claim
Patent Images

1. A method of manufacturing a mechanical force sensing semiconductor device being provided with:

  • a substrate;

    a movable portion which is disposed on said substrate and movably formed with respect to the substrate; and

    an upper structural member which is formed at least on said movable portion and spaced therefrom via a space, wherein the method comprising;

    a first step of filling a filling material at least on the upper surface of said movable portion being defined on said substrate;

    a second step of forming layers to obtain said upper structural member on said filling material;

    a third step of forming a window portion in said upper structural member; and

    a fourth step of removing said filling material by etching achieved through said window portion to obtain said space at least between said movable portion and said upper structural member.

View all claims
  • 0 Assignments
Timeline View
Assignment View
    ×
    ×