Self-coplanarity bumping shape for flip-chip
First Claim
1. A method of interconnecting a semiconductor device to a substrate, comprising:
- providing a semiconductor device having a surface;
providing a substrate having a non-planar surface and a plurality of interconnect pads formed on the non-planar surface, each interconnect pad having a top surface which resides at a different level with respect to top surfaces of other interconnect pads due to the non-planar surface of the substrate, the interconnect pads of the substrate having a maximum range of noncoplanarity;
forming a plurality of interconnect bumps on the surface of the semiconductor device by,(a) forming a base portion on the surface of the semiconductor device using a nickel or copper wirebonding process, the base portion having a flattened spheroidal shape, and(b) forming a stem portion extending from the base portion using a solder material, the stem portion having a conical frustum shape and a first end adjacent to the base portion and a distal end with a transverse planar surface, the first end and the distal end of the stem portion being narrower than the base portion, the stem portion being more compliant than the base portion and the height of the stem portion being greater than the maximum range of noncoplanarity of the interconnect pads of the substrate;
apposing the semiconductor device and substrate such that the interconnect bumps align with the interconnect pads; and
bringing the distal end of the stem portion of each interconnect bump in contact with a corresponding interconnect pad on the non-planar surface by deforming the stem portions as necessary to accommodate the non-planar surface, the step of deforming the stem portions including using heat treatment to connect the stem portions of the interconnect bumps to the corresponding interconnect pads, the heat treatment using a temperature sufficient to deform the stem portions of the interconnect bumps while preventing deformation of the base portions.
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Accused Products
Abstract
A stud bump structure for electrical interconnection between a pair of members includes a base portion, and a stem portion. The base portion is affixed to a pad or trace in one of the pair of members to be interconnected (such as an integrated circuit chip), and the stem end is configured to contact a metal pad on the other member (such as a printed circuit board) to complete the interconnect. According to the invention, the stem end is truncated to form a transverse plane, and the stem is more compliant than the base. Also, a method for forming a stud bump on a contact surface, includes forming a bump base portion on the surface, drawing out a generally conical tail from a top of the base, and truncating the tail to form a stem portion having a planar transverse top surface and having a length from the top of the base portion to the top surface. In some embodiments the tail portion, at least, of the stud bump is formed using a wire bonding tool. Also, a method for forming an interconnect between a first member and a second member of an electronic package includes providing one of the members with the stud bumps of the invention and then bringing the corresponding bumps and pads together in a bonding process, the compliance of the stems portions of the bumps accommodating the variance from coplanarity of the pad surfaces.
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Citations
20 Claims
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1. A method of interconnecting a semiconductor device to a substrate, comprising:
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providing a semiconductor device having a surface; providing a substrate having a non-planar surface and a plurality of interconnect pads formed on the non-planar surface, each interconnect pad having a top surface which resides at a different level with respect to top surfaces of other interconnect pads due to the non-planar surface of the substrate, the interconnect pads of the substrate having a maximum range of noncoplanarity; forming a plurality of interconnect bumps on the surface of the semiconductor device by, (a) forming a base portion on the surface of the semiconductor device using a nickel or copper wirebonding process, the base portion having a flattened spheroidal shape, and (b) forming a stem portion extending from the base portion using a solder material, the stem portion having a conical frustum shape and a first end adjacent to the base portion and a distal end with a transverse planar surface, the first end and the distal end of the stem portion being narrower than the base portion, the stem portion being more compliant than the base portion and the height of the stem portion being greater than the maximum range of noncoplanarity of the interconnect pads of the substrate; apposing the semiconductor device and substrate such that the interconnect bumps align with the interconnect pads; and bringing the distal end of the stem portion of each interconnect bump in contact with a corresponding interconnect pad on the non-planar surface by deforming the stem portions as necessary to accommodate the non-planar surface, the step of deforming the stem portions including using heat treatment to connect the stem portions of the interconnect bumps to the corresponding interconnect pads, the heat treatment using a temperature sufficient to deform the stem portions of the interconnect bumps while preventing deformation of the base portions. - View Dependent Claims (2, 3, 4)
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5. A method of interconnecting a semiconductor device to a substrate, comprising:
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providing a semiconductor device having a surface; forming a plurality of interconnect bumps on the surface of the semiconductor device by, (a) forming a base portion on the surface of the semiconductor device, the base portion having a flattened spheroidal shape, and (b) forming a stem portion extending from the base portion, the stem portion having a conical frustum shape and a first end adjacent to the base portion and a distal end, the stem portion being more compliant than the base portion; providing a substrate having a non-planar surface and a plurality of interconnect pads formed on the non-planar surface; and bringing the distal end of the stem portion of each interconnect bump in contact with a corresponding interconnect pad on the non-planar surface by deforming the stem portions as necessary to accommodate the non-planar surface, the step of deforming the stem portions including using heat treatment to connect the stem portions of the interconnect bumps to the corresponding interconnect pads, the heat treatment using a temperature sufficient to deform the stem portions of the interconnect bumps while preventing deformation of the base portions. - View Dependent Claims (6, 7, 8, 9, 10, 11, 12)
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13. A method of interconnecting a semiconductor device to a substrate, comprising:
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providing a semiconductor device having a surface; forming a plurality of interconnect bumps on the surface of the semiconductor device by, (a) forming a base portion on the surface of the semiconductor device, and (b) forming a stem portion extending from the base portion; providing a substrate having a non-planar surface and a plurality of interconnect pads formed on the non-planar surface; and bringing the stem portion of each interconnect bump in contact with a corresponding interconnect pad on the non-planar surface by deforming the stem portions as necessary to accommodate the non-planar surface, the step of deforming the stem portions including using heat treatment to connect the stem portions of the interconnect bumps to the corresponding interconnect pads, the heat treatment using a temperature sufficient to deform the stem portions of the interconnect bumps while preventing deformation of the base portions. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20)
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Specification