Optical waveguide type iontophoresis sensor chip and method for packaging sensor chip

• US 7,410,614 B2
• Filed: 07/26/2004
• Issued: 08/12/2008
• Est. Priority Date: 07/26/2004
• Status: Expired due to Fees

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Hirata, Masami, Tono, Ichiro, Okada, Naotada, Uematsu, Ikuo, Uchiyama, Kenichi, Oomiya, Kayoko, Eto, Hideo, Kishimoto, Isao
• Primary Examiner(s): Smith; Duane
• Assistant Examiner(s): CLEMENTE, ROBERT ARTHUR
• Application Number:
  US10/899,264
• Publication Number:
  US 20060063984A1
• Time in Patent Office: 1,478 Days
• Field of Search: 422/82.11, 385/12, 356/300, 600/309, 600/310
• US Class Current: 422/82.11
• CPC Class Codes: A61B 5/14514 using means for aiding extraction of interstitial fluid, e.g. microneedles or suction
• CPC Class Codes: A61B 5/14532 for measuring glucose, e.g. by tissue impedance measurement
• CPC Class Codes: A61B 5/1455 using optical sensors, e.g. spectral photometrical oximeters

Abstract

An optical waveguide type iontophoresis sensor chip has a substrate having a first hinged plate and a second hinged plate, an optical waveguide plate connected to the first hinged plate and positioned over a first opening delineated in the first hinged plate, and a gel layer fixed on the second hinged plate and covering a second opening delineated in the second hinged plate and configured to contact with the optical waveguide plate through the first opening in case that the substrate is folded.

Claims

1. An optical waveguide type iontophoresis sensor chip comprising:

a substrate having a first hinged plate and a second hinged plate;

an optical waveguide plate connected to the first hinged plate and positioned over a first opening delineated in the first hinged plate; and

a gel layer fixed on the second hinged plate and covering a second opening delineated in the second hinged plate and configured to contact with the optical waveguide plate through the first opening in case that the substrate is folded.

2. The optical waveguide type iontophoresis sensor chip of claim 1, further comprising a pair of protection plates having an interval for light transmission and disposed on an opposite surface of the optical waveguide plate to a contact surface on the substrate.

3. The optical waveguide type iontophoresis sensor chip of claim 2, wherein the pair of the protection plate contains a desiccating agent.

4. The optical waveguide type iontophoresis sensor chip of claim 1, further comprising a hinge groove along a boundary between the first hinged plate and the second hinged plate.

5. The optical waveguide type iontophoresis sensor chip of claim 1, further comprising;

a first sealed cell that is formed by pasting a packaging sheet on a peripheral region of the first hinged plate and seals in the optical waveguide plate;

a gel holding portion formed by the packaging sheet and fixing the both ends of the gel layer on the substrate; and

a second sealed cell that is formed by pasting the packaging sheet on a peripheral region of the second hinged plate and seals in the gel layer.

6. The optical waveguide type iontophoresis sensor chip of claim 5, wherein the gel holding portion is left on the substrate in case that the packaging sheet is opened.