Metal and electronically conductive polymer transfer

• US 7,410,825 B2
• Filed: 09/15/2005
• Issued: 08/12/2008
• Est. Priority Date: 09/15/2005
• Status: Active Grant

• Current Assignee: Eastman Kodak Company
• Original Assignee: Eastman Kodak Company
• Inventors: Majumdar, Debasis, Tutt, Lee W., Irvin, Glen C. Jr., Freedman, Gary S., Kress, Robert J., Madathil, Joseph K.
• Primary Examiner(s): Geyer; Scott B.
• Application Number:
  US11/227,591
• Publication Number:
  US 20070059901A1
• Time in Patent Office: 1,062 Days
• Field of Search: None
• US Class Current: 438/106
• CPC Class Codes: H01G 11/48 Conductive polymers
• CPC Class Codes: H01G 11/56 Solid electrolytes, e.g. gels; Additives therein
• CPC Class Codes: H01L 2221/68359 used as a support during manufacture of interconnect decals or build up layers
• CPC Class Codes: H01L 2221/68363 used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
• CPC Class Codes: H01L 2221/6839 using peeling wedge or knife or bar
• CPC Class Codes: H10K 71/18 using non-liquid printing techniques, e.g. thermal transfer printing from a donor sheet
• CPC Class Codes: H10K 71/611 using printing deposition, e.g. ink jet printing
• CPC Class Codes: H10K 71/621 Providing a shape to conductive layers, e.g. patterning or selective deposition
• CPC Class Codes: H10K 85/113 Heteroaromatic compounds comprising sulfur or selene, e.g. polythiophene
• CPC Class Codes: H10K 85/1135 Polyethylene dioxythiophene [PEDOT]; Derivatives thereof
• CPC Class Codes: Y02E 60/13 Energy storage using capacitors

Abstract

The invention relates to a donor laminate comprising in order, a substrate, an electronically conductive polymer layer in contact with said substrate, and a metal layer.

Claims

1. A donor laminate comprising in order, a substrate, an electronically conductive polymer layer in contact with said substrate, and a metal layer, wherein said electronically conductive polymer layer has a peel force of less than 100 grams per inch for separation from said substrate at room temperature.

2. The donor laminate of claim 1 wherein said substrate is transparent.

3. The donor laminate of claim 1 wherein said substrate comprises a surface that is a release material.

4. The donor laminate of claim 1 wherein said electronically conductive polymer layer comprises an electronically conductive polymer in a cationic form and a polyanion.

5. The donor laminate of claim 4 wherein said electronically conductive polymer in a cationic form comprises polythiophene.

6. The donor laminate of claim 4 wherein said electronically conductive polymer in a cationic form comprises polyethylenedioxythiophene.

7. The donor laminate of claim 4 wherein said polyanion comprises polystyrene sulfonate.

8. The donor laminate of claim 1 wherein said electronically conductive polymer layer consists of at least one member selected from the group consisting of substituted or unsubstituted pyrrole-containing, substituted or unsubstituted thiophene-containing polymers and substituted or unsubstituted aniline-containing polymers.

9. The donor laminate of claim 1 wherein said electronically conductive polymer layer further comprises a binder.

10. The donor laminate of claim 1 wherein said metal layer comprises a silver layer.

11. The donor laminate of claim 10 wherein said silver has a thickness of between 5 nanometers and 50 micrometers.

12. The donor laminate of claim 1 wherein said metal layer consists of at least one metal selected from the group consisting of gold, silver, platinum, palladium, copper, aluminum and mixtures thereof.

13. The donor laminate of claim 1 wherein said metal layer has a sheet resistance of between 0.001 and 25 ohm/square.

14. The donor laminate of claim 1 wherein said electronically conductive polymer layer in contact with said substrate, and said metal layer are in a pattern.

15. The donor laminate of claim 1 wherein said metal layer is in a pattern.

16. The donor laminate of claim 1 wherein said electronically conductive polymer layer is in a pattern.

17. The donor laminate of claim 1 wherein said substrate comprises triacetylcellulose.

18. The donor laminate of claim 1 wherein said substrate comprises a flexible polymer sheet.

19. The donor laminate of claim 1 wherein said electronically conductive polymer layer has a thickness of between 5 nanometer and 1 micrometer.

20. The donor laminate of claim 1 wherein said electronically conductive polymer layer has a peel force of less than 50 grams per inch for separation from said substrate.

21. The donor laminate of claim 1 wherein said laminate further comprises an adhesive layer on the side of the metal layer opposite to the substrate.

22. The donor laminate of claim 1 wherein said electronically conductive polymer layer has an FOM less than or equal to 100 wherein FOM is defined as the slope of the plot of 1n (1/T) versus (1/Rs) and wherein

T=visual light transmission

Rs=sheet resistance in ohms per square

FOM=figure of merit and wherein the Rs has a value of less than or equal to 1000 ohms per square.

23. The donor laminate of claim 1 wherein said electronically conductive polymer layer further comprises epoxy silane.

24. The donor laminate of claim 1 wherein said electronically conductive polymer layer is coated utilizing a conductivity enhancing agent.

25. A method of forming a conductive element comprising providing a donor laminate comprising in order, a substrate, an electronically conductive polymer layer in contact with said substrate, and a metal layer, wherein said electronically conductive polymer layer has a peel force of less than 100 grams per inch for separation from said substrate at room temperature, bringing a receiver sheet into contact with said donor laminate, and transferring said metal layer and electronically conductive polymer layer to said receiver sheet.

26. The method of claim 25 wherein said transferring is carried out by heat.

27. The method of claim 25 wherein said transferring is carried out by pressure.

28. The method of claim 27 wherein said pressure is applied by a patterned roller.

30. The method of claim 25 wherein said transferring is carried out utilizing a radiation source.

31. The method of claim 25 wherein said transferring is carried out by thermal resistive head.

32. The method of claim 25 wherein said receiver sheet comprises a flexible polymer sheet.

33. The method of claim 25 wherein said receiver comprises glass.

34. The method of claim 25 wherein said transferring is in a pattern.

35. The method of claim 25 wherein the surface of said substrate in contact with said electronically conductive polymer layer comprises a release material.

36. The method of claim 25 wherein transferring utilizes an adhesive between said metal layer and said receiver element.

29. The method of Cairn 27 wherein said pressure is applied by acoustic or mechanical force.