Ion trap in a semiconductor chip

• US 7,411,187 B2
• Filed: 05/23/2006
• Issued: 08/12/2008
• Est. Priority Date: 05/23/2005
• Status: Active Grant

• Current Assignee: National Security Agency, Board of Regents of the University of Michigan (University of Michigan)
• Original Assignee: Board of Regents of the University of Michigan (University of Michigan)
• Inventors: Monroe, Christopher, Schwab, Keith, Stick, Daniel, Madsen, Martin, Hensinger, Winfried
• Primary Examiner(s): Berman; Jack I.
• Assistant Examiner(s): Sahu; Meenakshi S
• Application Number:
  US11/419,955
• Publication Number:
  US 20070040113A1
• Time in Patent Office: 812 Days
• Field of Search: 250/290, 250/281, 250/282, 250/283, 250/288, 250/214.R, 250/207, 257/14, 257/12, 257/13, 257/15, 257/17, 257/31, 257/33, 703/11, 708/403, 708/191, 700/1, 706/14, 706/12, 706/45, 709/201, 435/6, 435/287.2, 712/34
• US Class Current: 250/290
• CPC Class Codes: B82Y 10/00 Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
• CPC Class Codes: G04F 5/14 using atomic clocks
• CPC Class Codes: G06N 10/00 Quantum computing, i.e. information processing based on quantum-mechanical phenomena
• CPC Class Codes: H01J 49/0018 Microminiaturised spectrometers, e.g. chip-integrated devices, Micro-Electro-Mechanical Systems [MEMS]
• CPC Class Codes: H01J 49/422 Two-dimensional RF ion traps ion guides without mass selection H01J49/062

Abstract

A micrometer-scale ion trap, fabricated on a monolithic chip using semiconductor micro-electromechanical systems (MEMS) technology. A single 111Cd+ ion is confined, laser cooled, and the heating measured in an integrated radiofrequency trap etched from a doped gallium arsenide (GaAs) heterostructure. Single 111Cd+ qubit ions are confined in a radiofrequency linear ion trap on a semiconductor chip by applying a combination of static and oscillating electric potentials to integrated electrodes. The electrodes are lithographically patterned from a monolithic semiconductor substrate, eliminating the need for manual assembly and alignment of individual electrodes. The scaling of this structure to hundreds or thousands of electrodes is possible with existing semiconductor fabrication technology.

Claims

1. An ion trap device, comprising:

a semiconductor chip, including;

a first substrate portion;

a first insulator layer disposed on the first substrate portion;

a first electrode layer disposed on the first insulator layer, wherein a first electrode system is formed on a surface thereof;

a second substrate portion spaced and opposed to the first substrate portion so as to define a first aperture formed therebetween;

a second insulator layer disposed on the second substrate portion spaced and opposed to the first insulator layer so as to define a second aperture formed therebetween;

a second electrode layer disposed on the second insulator layer, wherein a second electrode system is formed on a surface thereof, wherein the second electrode layer is spaced and opposed to the first electrode layer so as to define a third aperture formed therebetween;

a third insulator layer disposed on the first electrode layer;

a third electrode layer disposed on the third insulator layer, wherein a third electrode system is formed on a surface thereof;

a fourth insulator layer disposed on the second electrode layer spaced and opposed to the third insulator layer so as to define a fourth aperture formed therebetween; and

a fourth electrode layer disposed on the fourth insulator layer, wherein a fourth electrode system is formed on a surface thereof, wherein the fourth electrode layer is spaced and opposed to the third electrode layer so as to define a fifth aperture formed therebetween;

wherein the first, second, third, fourth, and fifth apertures are substantially axially aligned so as to define the at least one ion trapping region selectively operable to receive at least one ion introduced therein;

wherein the first, second, third and fourth electrode systems are selectively operable to form the ion trap in the ion trapping region when a voltage is selectively applied to the first, second, third and fourth electrode systems.

2. The invention according to claim 1, wherein the first and second substrate portions each include an angled wedge portion extending from a bottom surface to a top surface thereof, wherein the angled wedge portions are spaced and opposed to one another.

3. The invention according to claim 1, wherein the first, second, third and fourth electrode layers are in a cantilevered arrangement with the first, second, third and fourth insulator layers, respectively, wherein the cantilevered arrangements are in proximity to the at least one ion trapping region.

4. The invention according to claim 1, wherein the first and third electrode layers are in a cantilevered arrangement with the first substrate portion and the second and fourth electrode layers are in a cantilevered arrangement with the second substrate portion, wherein the cantilevered arrangements are in proximity to the at least one ion trapping region.

5. The invention according to claim 1, wherein the first electrode layer, second electrode layer, third electrode layer, fourth electrode layer or the substrate are comprised of gallium arsenide.

6. The invention according to claim 1, wherein the first, second, third or fourth insulator layers are comprised of aluminum gallium arsenide.

7. The invention according to claim 1, wherein a portion of the first, second, third or fourth electrode systems are comprised of a material selected from the gold, nickel, germanium, and combinations thereof.

8. The invention according to claim 1, wherein a radiofrequency potential is applied to either the first, second, third or fourth electrode systems, wherein the radiofrequency potential is in the range of about 1 to about 50 volts at a drive frequency in the range of about 1 to about 50 megahertz.

9. The invention according to claim 1, wherein a static potential is applied to either the first, second, third or fourth electrode systems, wherein the static potential is in the range of about −

10 to about +10 volts.

10. The invention according to claim 1, wherein the at least one ion is loaded into the at least one ion trapping region by photoionization laser pulsing.

11. The invention according to claim 10, wherein the at least one ion loaded into the at least one ion trapping region is Doppler laser cooled.

12. The invention according to claim 1, wherein the third aperture formed between an end portion of the first electrode layer and an end portion of the second electrode layer has a length of about 10 to about 100 μ

m, and wherein the fifth aperture formed between an end portion of the third electrode layer and an end portion of the fourth electrode layer has a length of about 10 to about 100 μ

m.

13. The invention according to claim 12, wherein the third and fifth apertures have an equidistant length.

14. The invention according to claim 1, wherein a radiofrequency potential is applied to either the first and fourth electrode systems or the second and third electrode systems, wherein the radiofrequency potential is in the range of about 1 to about 50 volts at a drive frequency in the range of about 1 to about 50 megahertz.

15. The invention according to claim 1, wherein a static potential is applied to either the first and fourth electrode layers or the second and third electrode layers, wherein the static potential is in the range of about −

10 to about +10 volts.

16. The invention according to claim 1, wherein a radiofrequency potential is applied to the first and fourth electrode systems and a static potential is applied to the second and third electrode systems, wherein the radiofrequency potential is in the range of about 1 to about 50 volts at a drive frequency in the range of about 1 to about 200 megahertz, wherein the static potential is in the range of about −

10 to about +10 volts.

17. The invention according to claim 1, wherein a radiofrequency potential is applied to the second and third electrode systems and a static potential is applied to the first and fourth electrode systems, wherein the radiofrequency potential is in the range of about 1 to about 50 volts at a drive frequency in the range of about 1 to about 200 megahertz, wherein the static potential is in the range of about −

10 to about +10 volts.

18. The invention according to claim 1, wherein the ion trap device is operably associated with a quantum computer.

19. A method of making an ion trap device, comprising:

providing a substrate layer comprised of a conductive material;

disposing a first insulator layer on the substrate layer;

disposing a first membrane layer comprised of a conductive material on the first insulator layer;

disposing a second insulator layer on the first membrane layer;

disposing a second membrane layer on the second insulator layer;

back etching a bottom surface of the substrate layer to form a wedge portion defining a first substrate portion and a second spaced and opposed substrate portion, wherein a portion of a lower surface of the first insulator layer is exposed;

plasma etching a top surface of the second membrane layer to expose a portion of the first membrane layer;

plasma etching a portion of the first and second membrane layers and first and second insulator layers to expose a top surface of the substrate layer;

disposing an electrical contact member on spaced and opposed locations of the first and second membrane layers and the substrate layer;

plasma etching through an axis of the first and second membrane layers and the first and second insulator layers to define first, second, third and fourth membrane portions and first, second, third and fourth insulator portions, wherein an area defining a second aperture is formed between spaced and opposed first and second insulator portions, wherein an area defining a third aperture is formed between spaced and opposed first and second membrane portions;

wherein an area defining a fourth aperture is formed between spaced and opposed third and fourth insulator portions, and wherein an area defining a fifth aperture is formed between spaced and opposed third and fourth membrane portions; and

acid etching end portions of the first, second, third and fourth insulator portions such that the first, second, third and fourth membrane layers, respectively, are in a cantilever arrangement therewith.

20. The invention according to claim 19, wherein the first, second, third, fourth, and fifth apertures are substantially axially aligned so as to define the at least one ion trapping region selectively operable to receive at least one ion introduced therein.

21. The invention according to claim 20, wherein the first, second, third and fourth membrane portions are selectively operable to form the ion trap in the ion trapping region when a voltage is applied to the first, second, third and fourth membrane portions.

22. The invention according to claim 20, wherein the first and third membrane portions are in a cantilevered arrangement with the first substrate portion and the second and fourth membrane portions are in a cantilevered arrangement with the second substrate portion, wherein the cantilevered arrangements are in proximity to the at least one ion trapping region.

23. The invention according to claim 19, wherein the first and second substrate portions each include an angled wedge portion extending from a bottom surface to a top surface thereof, wherein the angled wedge portions are spaced and opposed to one another.

24. The invention according to claim 19, wherein the first membrane layer, second membrane layer, or the substrate are comprised of gallium arsenide.

25. The invention according to claim 19, wherein the first or second insulator layers are comprised of aluminum gallium arsenide.

26. The invention according to claim 19, wherein the electrical contact member is comprised of a material selected from the gold, nickel, germanium, and combinations thereof.

27. The invention according to claim 19, wherein a radiofrequency potential is applied to either the first, second, third or fourth membrane portions, wherein the radiofrequency potential is in the range of about 1 to about 50 volts at a drive frequency in the range of about 1 to about 200 megahertz.

28. The invention according to claim 19, wherein a static potential is applied to either the first, second, third or fourth membrane portions, wherein the static potential is in the range of about −

10 to about +10 volts.

29. The invention according to claim 19, wherein the at least one ion is loaded into the at least one ion trapping region by photoionization laser pulsing.

30. The invention according to claim 29, wherein the at least one ion loaded into the at least one ion trapping region is Doppler laser cooled.

31. The invention according to claim 19, wherein the third aperture formed between an end portion of the first membrane portion and an end portion of the second membrane portion has a length of about 10 to about 100 μ

m, and wherein the fifth aperture formed between an end portion of the third membrane portion and an end portion of the fourth membrane portion has a length of about 10 to about 100 μ

m.

32. The invention according to claim 31, wherein the third and fifth apertures have an equidistant length.

33. The invention according to claim 19, wherein a radiofrequency potential is applied to either the first and fourth membrane portions or the second and third membrane portions, wherein the radiofrequency potential is in the range of about 1 to about 200 volts at a drive frequency in the range of about 1 to about 200 megahertz.

34. The invention according to claim 19, wherein a static potential is applied to either the first and fourth membrane portions or the second and third membrane portions, wherein the static potential is in the range of about −

10 to about +10 volts.

35. The invention according to claim 19, wherein a radiofrequency potential is applied to the first and fourth membrane portions and a static potential is applied to the second and third membrane portions, wherein the radiofrequency potential is in the range of about 1 to about 50 volts at a drive frequency in the range of about 1 to about 200 megahertz, wherein the static potential is in the range of about −

10 to about +10 volts.

36. The invention according to claim 19, wherein a radiofrequency potential is applied to the second and third membrane portions and a static potential is applied to the first and fourth membrane portions, wherein the radiofrequency potential is in the range of about 1 to about 50 volts at a drive frequency in the range of about 1 to about 200 megahertz, wherein the static potential is in the range of about −

10 to about +10 volts.

37. The invention according to claim 19, wherein the ion trap device is operably associated with a quantum computer.

38. A semiconductor-chip-based ion trap device for trapping at least one ion, comprising:

a first electrode assembly having at least three segmented cantilevered electrodes, with each cantilevered electrode segment having stacked upper and lower electrode members spaced apart by an insulating layer, with each electrode member having a proximate end with a contact pad and a distal end; and

a second electrode assembly identical or substantially identical to the first electrode assembly and arranged in opposition thereto with the electrode distal ends in proximity to one another to form a gap that defines a free-space ion-trap region wherein the at least one ion is trapped when an electrical potential is applied to the first and second electrode assemblies.

39. The ion trap device of claim 38, wherein the electrical potential includes a static electrical potential and an oscillating electrical potential.

40. The ion trap device of claim 38, wherein the oscillating electrical potential is applied to the upper electrodes in one of the electrode assemblies and to the lower electrodes of the other electrode assembly.

41. The ion trap device of claim 39, wherein the electric potential includes a radiofrequency potential in the range from about 1 volt to about 50 volts at a drive frequency in the range from about 1 MHz to about 200 MHz.

42. The ion trap device of claim 41, wherein the electric potential includes a static potential in the range from about −

10 volts to about +10 volts.

43. The ion trap device of claim 42, wherein the separation between electrode members in the first and second electrode assemblies that forms said gap is in the range from about 20 μ

m to about 100 μ

m.

44. The ion trap device of claim 38, wherein adjacent electrode segments are separated by a distance in the range from about 5 μ

m to about 40 μ

m.

45. The ion trap device of claim 44, wherein each electrode segment has a width in the range from about 40 μ

m to about 300 μ

m.

46. The ion trap device of claim 38, wherein the upper and lower electrodes are spaced apart by a distance in the range from about 1 μ

m to about 20 μ

m.

47. The ion trap device of claim 38, wherein the electrode members are formed from GaAs and the insulating layers separating the electrode members are formed from AlGaAs.

48. The ion trap device of claim 38, wherein the upper and lower electrodes have a thickness in the range from about 1 μ

m to about 10 μ

m.

49. The ion trap device of claim 38, wherein the first and second opposing electrode assemblies are supported by a respective first and second doped semiconductor substrate segments.

50. The ion trap device of claim 38, wherein each of the first and second opposing electrode assemblies has four segmented cantilevered electrodes.

51. The ion trap device of claim 38, wherein the ion trap region has one or more zones that trap the at least one ion, wherein the ion trap zones are defined by the number of electrode members in the first and second electrode assemblies, and wherein the at least one ion is moveable between the ion trap zones by adjusting the electrical potential.

52. The ion trap device of claim 51, wherein each ion trap zone is defined by three pairs of opposing electrode segments.

53. The ion trap device of claim 38, wherein the first and second electrode assemblies are formed from a monolithic semiconductor structure.

54. A method of trapping at least one ion, comprising:

providing opposing first and second electrode assemblies, with each assembly having at least three segmented cantilevered electrodes, with each cantilevered electrode segment having stacked upper and lower electrode members spaced apart by an insulating layer, with each electrode member having a proximate end with a contact pad and a distal end, with the first and second assemblies arranged in opposition with the electrode distal ends in proximity to one another to form a gap that defines a free-space ion-trap region wherein the at least one ion is trapped when an electrical potential is applied to the first and second electrode assemblies;

introducing the at least one ion into the ion-trap region; and

applying said electrical potential so as to trap the at least one ion in the ion-trap region.

55. The method of claim 54, further comprising:

forming the first and second electrode assemblies from a monolithic semiconductor structure.

56. The method of claim 54, wherein said introducing of the at least one ion into the ion-trap region includes performing photo-ionization of atoms to form ions, and laser cooling at least one of the ions.

57. The method of claim 54, wherein applying said electrical potential includes applying a static electric potential to some of the electrode members and an oscillating electrical potential to at least some of the other electrode members.

58. The method of claim 54, wherein the ion-trap region includes two or more zones, and including moving the at least one ion between the two or more zones by varying the electrical potential.

59. The method of claim 54, including forming electrode members from GaAs and forming the insulating layers separating the electrode members from AlGaAs.

63. The method of claim 59, including supporting the first and second opposing electrode assemblies with respective first and second doped semiconductor substrate segments.

66. The method of claim 59, including connecting the electrodes to an electrical source adapted to provide said electrical potential to the first and second electrode assemblies.

67. The method of claim 59, further including one or more of the steps of:

forming the separation between electrode members in the first and second electrode assemblies that forms said gap to be in the range from about 20 μ

m to about 100 μ

m;

forming the adjacent electrode segments so that they are separated by a distance in the range from about 5 μ

m to about 40 μ

m;

forming each electrode segment to have a width in the range from about 40 μ

m to about 300 μ

m;

forming the upper and lower electrodes so as to be are spaced apart by a distance in the range from about 1 μ

m to about 20 μ

m; and

forming the upper and lower electrodes to have a thickness in the range from about 1 μ

m to about 10 μ

m.

60. A method of fabricating an ion trap device for trapping at least one ion, comprising:

forming a first electrode assembly having at least three segmented cantilevered electrodes, including providing each cantilevered electrode segment with stacked upper and lower electrode members spaced apart by an insulating layer, with each electrode member having a proximate end with a contact pad and a distal end; and

forming a second electrode assembly identical or substantially identical to the

first electrode assembly so as to be arranged in opposition thereto with the electrode distal ends in proximity to one another to form a gap that defines a free-space ion-trap region wherein the at least one ion is trapped when an electrical potential is applied to the first and second electrode assemblies.

61. The method of claim 60, including forming the first and second electrode assemblies from a monolithic semiconductor structure having alternating insulating and conductive layers.

62. The method of claim 61, including forming the insulating layers from AlGaAs and forming the conducting layers from GaAs.

64. The method of claim 62, including performing plasma etching of the monolithic semiconductor structure in forming the first and second electrode assemblies.

65. The method of claim 64, including performing acid etching of the monolithic semiconductor structure in forming the first and second electrode assemblies.