Field-effect transistor and method for manufacturing the same
First Claim
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1. A method for manufacturing a field-effect transistor, comprising the steps of:
- forming a source electrode and a drain electrode each containing hydrogen or deuterium;
forming an oxide semiconductor layer, the electrical resistance of the oxide semiconductor layer being decreased if hydrogen or deuterium is added; and
causing hydrogen or deuterium to diffuse from the source electrode and the drain electrode to the oxide semiconductor layer.
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Abstract
A method for manufacturing a field-effect transistor includes the steps of forming a source electrode and a drain electrode each containing hydrogen or deuterium; forming an oxide semiconductor layer in which the electrical resistance is decreased if hydrogen or deuterium is added; and, causing hydrogen or deuterium to diffuse from the source electrode and the drain electrode to the oxide semiconductor layer.
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Citations
14 Claims
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1. A method for manufacturing a field-effect transistor, comprising the steps of:
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forming a source electrode and a drain electrode each containing hydrogen or deuterium; forming an oxide semiconductor layer, the electrical resistance of the oxide semiconductor layer being decreased if hydrogen or deuterium is added; and causing hydrogen or deuterium to diffuse from the source electrode and the drain electrode to the oxide semiconductor layer. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A field-effect transistor comprising:
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an oxide semiconductor layer, the electrical resistance of the oxide semiconductor layer being decreased if hydrogen or deuterium is added, wherein the concentration of hydrogen or deuterium in regions in the oxide semiconductor layer in contact with a source electrode and a drain electrode is higher than the average concentration of hydrogen or deuterium in the oxide semiconductor layer. - View Dependent Claims (8, 9, 10, 11, 12, 13, 14)
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Specification