Component with sensitive component structures and method for the production thereof

• US 7,411,291 B2
• Filed: 07/24/2006
• Issued: 08/12/2008
• Est. Priority Date: 02/02/2004
• Status: Active Grant

• Current Assignee: Snaptrack Incorporated (Qualcomm, Inc.)
• Original Assignee: Epcos AG (TDK Corporation)
• Inventors: Ruile, Werner, Leidl, Anton, Kovacs, Günter, Baier, Thomas, Gawlik, Waldemar, Math, Christian
• Primary Examiner(s): Tran; Minh-Loan
• Assistant Examiner(s): AHMED, SELIM U
• Application Number:
  US11/491,594
• Publication Number:
  US 20060284307A1
• Time in Patent Office: 750 Days
• Field of Search: 257/416, 257/723, 257/778, 257/E23.079, 257/E23.169, 257/E23.171, 310/311, 310/313.R, 310/313.B, 310/313.D, 333/193, 333/194, 333/195
• US Class Current: 257/723
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 23/62 Protection against overvoltage, e.g. fuses, shunts
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01068 Erbium [Er]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/1461 MEMS
• CPC Class Codes: H01L 2924/207 Diameter ranges
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding

Abstract

An electrical component has electrically conducting structures placed on an electrically isolating or semiconductive substrate and component structures sensitive to a voltage or an electrical arcing and galvanically separated from one another. To prevent an arcing between the galvanically separated component structures, the component structures are short-circuited with a shunt line having a smaller cross-section than the remaining electrical conductor tracks. The shunt lines can be burnt through by application of an electrical current at any given time, whereby a galvanic separation of the component structures is effected, if necessary, for the function of the component.

Claims

1. An electrical component, comprising:

a substrate selected from at least one of the group consisting of a semiconductive substrate and an electrically isolating substrate;

electrical conductor tracks being at least one of on and in said substrate and having a cross-section;

electrically isolating structures at least one of on and in said substrate;

at least two externally accessible electrical terminals;

at least two component structures selected from at least one of a group consisting of voltage-sensitive component structures and electrical-arcing-endangered component structures;

at least one shunt line having a cross-section smaller than said cross-section of said electrical conductor tracks; and

said substrate, said electrical conductor tracks, said electrically isolating structures, said electrical terminals, and said at least two component structures having a pre-stage state in which said at least one shunt line short-circuits said at least two component structures and is electrically connected with said electrical terminals.

2. The component according to claim 1, wherein all of said component structures are short-circuited with said at least one shunt line.

3. The component according to claim 1, wherein:

said at least one shunt line is a plurality of shunt lines; and

said at least two component structures are short-circuited with said shunt lines.

4. The component according to claim 1, wherein:

said at least one shunt line is a plurality of shunt lines; and

all of said component structures are short-circuited with said shunt lines.

5. The component according to claim 1, wherein:

said at least one shunt line is a plurality of shunt lines;

said at least two component structures is a plurality of component structures; and

said plurality of component structures are short-circuited with said shunt lines.

6. The component according to claim 1, wherein said at least one shunt line has at least one portion with a reduced cross-section.

7. The component according to claim 1, wherein:

said electrical terminals have surfaces;

said electrical conductor tracks connect said component structures to said surfaces of said electrical terminals; and

said surfaces are short-circuited with said at least one shunt line.

8. The component according to claim 1, wherein:

said electrical terminals have surfaces;

said electrical conductor tracks connect all of said component structures to said surfaces of said electrical terminals; and

said surfaces are short-circuited with said at least one shunt line.

9. The component according to claim 1, wherein said at least one shunt line and said conductor tracks are of the same metallization.

10. The component according to claim 1, wherein:

said substrate has a surface; and

said at least one shunt line is on said surface of said substrate.

11. The component according to claim 1, wherein said substrate is of a material having electrical characteristics selected from at least one of the group consisting of pyro-electrical characteristics and piezo-electrical characteristics.

12. The component according to claim 1, wherein said substrate is of a ceramic selected from at least one of the group consisting of an LTCC ceramic and an HTCC ceramic.

13. The component according to claim 7, wherein:

each of said surfaces of said electrical terminals have a wedge-shaped metal surface with a peak;

peaks of two of said surfaces face one another; and

said facing peaks of said two surfaces of said electric terminals are connected to one another through said at least one shunt line.

14. The component according to claim 1, wherein:

said substrate, said electrical conductor tracks, said electrically isolating structures, said electrical terminals, and said at least two component structures form a component;

said component has a housing selected from one of the group consisting of a MEMS component, an SA component, and an FBAR component; and

said at least one shunt line is disposed within said housing.

15. The component according to claim 1, wherein said substrate, said electrical conductor tracks, said electrically isolating structures, said electrical terminals, and said at least two component structures have a ready-stage state in which said at least one shunt line is burnt-through and, thus, is electrically interrupted.

16. An electrical component to be connected to at least two externally accessible electrical terminals, comprising:

a substrate selected from at least one of the group consisting of a semiconductive substrate and an electrically isolating substrate;

electrical conductor tracks at least one of on and in said substrate and having a cross-section;

electrically isolating structures at least one of on and in said substrate;

at least two component structures selected from at least one of a group consisting of voltage-sensitive component structures and electrical-arcing-endangered component structures;

a shunt line having a smaller cross-section than said cross-section of said electrical conductor tracks; and

said substrate, said electrical conductor tracks, said electrically isolating structures, and said at least two component structures having a pre-stage state in which said shunt line short-circuits said at least two component structures and is connected with said electrical terminals.