Circuit board, device mounting structure, device mounting method, and electronic apparatus

• US 7,411,295 B2
• Filed: 09/24/2004
• Issued: 08/12/2008
• Est. Priority Date: 04/02/2004
• Status: Expired due to Fees

• Current Assignee: Fujitsu Limited
• Original Assignee: Fujitsu Limited
• Inventors: Suehiro, Mitsuo
• Primary Examiner(s): Williams; Alexander O
• Application Number:
  US10/948,231
• Publication Number:
  US 20050224971A1
• Time in Patent Office: 1,418 Days
• Field of Search: 257/737, 257/E23.079, 257/E23.004, 257/E23.173, 257/E23.177, 257/E27.112, 257/786, 257/738, 257/668, 257/700, 257/701, 257/758, 257/203, 257/211, 257/208, 257/774
• US Class Current: 257/737
• CPC Class Codes: H01L 2224/10165 Alignment aids
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/81052 Detaching bump connectors, e.g. after testing
• CPC Class Codes: H01L 2224/81136 involving guiding structures, e.g. spacers or supporting members
• CPC Class Codes: H01L 2224/8114 Guiding structures outside the body
• CPC Class Codes: H01L 2224/812 Applying energy for connecting
• CPC Class Codes: H01L 2224/81234 using means for applying energy being within the device, e.g. integrated heater
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 23/50 for integrated circuit devices, e.g. power bus, number of leadsH01L23/482 - H01L23/498 take precedence
• CPC Class Codes: H01L 24/799 Apparatus for disconnecting
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 24/98 Methods for disconnecting semiconductor or solid-state bodies
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01023 Vanadium [V]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 2924/351 : Thermal stress
• CPC Class Codes: H05K 1/111 : Pads for surface mounting, e.g. lay-out
• CPC Class Codes: H05K 2201/09236 : Parallel layout
• CPC Class Codes: H05K 2201/09736 : Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
• CPC Class Codes: H05K 2201/10015 : Non-printed capacitor
• CPC Class Codes: H05K 2201/10734 : Ball grid array [BGA]; Bump grid array
• CPC Class Codes: H05K 2203/0195 : Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
• CPC Class Codes: H05K 3/3436 : having an array of bottom contacts, e.g. pad grid array or ball grid array components
• CPC Class Codes: H05K 3/3494 : Heating methods for reflowing of solder using integral heating means H05K1/0212
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product

Abstract

A circuit board has a metal pattern that is formed on a surface of the circuit board to be connected with bumps in two-dimensional arrangement for mounting an electronic device that has the bumps. A plurality of the bumps which has even electrical potentials is electrically connected by the metal pattern on the surface of the circuit pattern.

Claims

1. A circuit board having a mounting area to be mounted with an electronic component that has plural solder bumps that are two-dimensionally arranged, said circuit board comprising:

plural metal strip-shaped patterns, each of which extends in parallel in a first direction, exposes on a surface of said circuit board, and crosses from an inside to an outside of the mounting area, part of each metal pattern located in the mounting area being electrically connectable to plural corresponding solder bumps,

wherein at least one outermost patterns among the plural metal patterns has a part that is located outside the mounting area, and bends in a second direction orthogonal to the first direction to form two side surfaces used for an alignment between the electronic component and the mounting area in the first and second directions in mounting the electronic component on the mounting area of the circuit board.

2. The circuit board according to claim 1, wherein the at least one of the pair of outermost patterns has a U shape.

3. The circuit board according to claim 1, wherein the plural metal patterns are formed on both front and back surfaces of said circuit board.

4. The circuit board according to claim 1, wherein each metal pattern has a part that is located outside the mounting area, and serves as a heating terminal used to melt the plural corresponding solder bumps on the mounting area through heat conduction, and as an inspection terminal used to inspect an electric connection condition between the plural corresponding solder bumps and the metal pattern.

5. An electronic apparatus comprising:

a circuit board according to claim 1; and

an electronic component mounted on the circuit board.