Lithographic apparatus and device manufacturing method

• US 7,411,652 B2
• Filed: 09/22/2004
• Issued: 08/12/2008
• Est. Priority Date: 09/22/2003
• Status: Expired due to Fees

• Current Assignee: ASML Holding NV, ASML Netherlands BV (ASML Holding NV)
• Original Assignee: ASML Holding NV, ASML Netherlands BV (ASML Holding NV)
• Inventors: Bleeker, Arno Jan, Franken, Dominicus Jacobus Petrus Adrianus, Troost, Kars Zeger, Kochersperger, Peter C.
• Primary Examiner(s): NGUYEN, HUNG
• Application Number:
  US10/946,333
• Publication Number:
  US 20050068510A1
• Time in Patent Office: 1,420 Days
• Field of Search: 355/53, 355/55, 355/67, 355 72- 76, 430/5, 430/20, 430/30, 359291-292
• US Class Current: 355/53
• CPC Class Codes: G03F 7/70283 Mask effects on the imaging process
• CPC Class Codes: G03F 7/70291 Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
• CPC Class Codes: G03F 7/703 Non-planar pattern areas or non-planar masks, e.g. curved masks or substrates
• CPC Class Codes: G03F 7/707 Chucks, e.g. chucking or un-chucking operations or structural details
• CPC Class Codes: G03F 7/70783 Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight

Abstract

One or more patterning arrays are mounted to a mounting plate via height adjustment structures that enable the flatness of the active surfaces of the patterning arrays to be controlled. The height adjustment structures may comprise an array of piezoelectric actuators or screws. Alternatively, the backside of the patterning means may be polished to optical flatness and bonded by crystal bonding to an optically flat surface of a rigid mounting body.

Claims

1. A lithographic apparatus, comprising:

an illumination system that supplies a beam of radiation;

a patterning array of individually controllable elements having an active surface, the active surface being configured to pattern the beam;

a mounting plate on which said patterning array is mounted;

an adjustment structure that elevates or deforms at least a portion of the active surface of said patterning array, wherein the adjustment structure comprises an array of vertically extensible adjusters in contact with a side opposite of the active surface of said patterning array; and

a projection system that projects the patterned beam onto a target portion of a substrate.

2. The apparatus of claim 1, wherein said adjustment structure comprises:

a level sensor to detect unflatness in the patterning array; and

a feedback loop to control the elevation or deformation applied to the patterning array.

3. The apparatus of claim 1, wherein said adjustment structure comprises an array of piezoelectric elements.

4. The apparatus of claim 1, wherein said adjustment structure comprises an array of fasteners passing through threaded holes in the mounting plate that bear against the patterning array.

5. The apparatus of claim 1, further comprising:

a plurality of the patterning arrays provided on a common mounting member, and

respective adjustment structures, whereby the adjustment structures allow the plurality of the patterning arrays to be mutually leveled.

6. The apparatus of claim 1, further comprising:

a detection device configured to detect focus aberrations of the lithographic apparatus and produce a control signal therefrom, wherein the adjustment structure is configured to utilize the control signal to perform the elevation or deformation.

12. The lithographic apparatus of claim 1, wherein the adjustment structure elevates or de-elevates the portion of the active surface to a new plane parallel with a plane of the patterning array.

13. The lithographic apparatus of claim 1, wherein the adjustment structure deforms the portion of the active surface of the patterning array to produce a non-planar surface.

7. A device manufacturing method, comprising:

elevating or deforming an active surface of a patterning array of individually controllable elements using an array of vertically extensible adjusters in contact with a side opposite of the active surface of said patterning array;

patterning a beam of radiation using the active surface of the patterning array; and

projecting the patterned beam onto a target portion of a substrate.

8. The method of claim 7, further comprising:

measuring a focus aberration of the patterned beam at the substrate; and

performing the elevating or the deforming step based on the measured focus aberration.

9. The method of claim 8, providing at least some correction for the measured focus aberration based on the elevating or the deforming step.

10. The method of claim 7, further comprising:

detecting unflatness of the active surface of the patterning array; and

performing the elevating or the deforming step based on the detected unflatness.

11. The method of claim 10, further comprising reducing the detected unflatness of the active surface based on the elevating or the deforming.

14. A lithographic apparatus, comprising:

an illumination system configured to supply a beam of radiation;

a patterning array of individually controllable elements having an active surface, the active surface being configured to pattern the beam;

a mounting plate on which the patterning array is mounted;

an adjustment structure configured to (i) elevate or de-elevate at least a portion of the active surface of the patterning array to a new plane parallel to a plane of the patterning array or (ii) deform at least a portion of the active surface of the patterning array to produce a non-planar surface, wherein the adjustment structure comprises an array of vertically extensible adjusters in contact with a side opposite of the active surface of the patterning array; and

a projection system that projects the patterned beam onto a target portion of a substrate.