PAEK-based microfluidic device with integrated electrospray emitter
First Claim
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1. A polyaryl-ether-ketone (PAEK) microfluidic device, comprising:
- a substrate composed of a PAEK material, said substrate having at least one microchannel formed in a surface thereof;
a cover plate capable of being bonded to said PAEK substrate, said cover plate having a surface arranged over the surface of said substrate, said cover plate in combination with the microchannel defining a conduit for conveying a sample, said respective surfaces of said PAEK substrate and said cover plate being adhesion enhancement-treated surfaces;
an electrospray emitter representing an integrated and protruding portion of said PAEK substrate and said cover plate, said electrospray emitter being in fluid communication with said conduit; and
a layer of a solvent-resistant adhesive applied on at least one of said adhesion enhancement-treated surfaces to bond said respective surfaces of said PAEK substrate and said cover plate together.
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Abstract
A polyaryl-ether-ketone (PAEK)-based microfluidic device having an integrated electrospray emitter is disclosed. Bonding of at least one PAEK substrate forming the microfluidic device is accomplished using a solvent-resistant adhesive, such as a polyimide-based adhesive, in combination with an adhesion enhancement treatment. By providing the PAEK-based microfluidic device with an integrated electrospray emitter, efficient and effective analysis of fluid samples is enabled.
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12 Claims
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1. A polyaryl-ether-ketone (PAEK) microfluidic device, comprising:
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a substrate composed of a PAEK material, said substrate having at least one microchannel formed in a surface thereof; a cover plate capable of being bonded to said PAEK substrate, said cover plate having a surface arranged over the surface of said substrate, said cover plate in combination with the microchannel defining a conduit for conveying a sample, said respective surfaces of said PAEK substrate and said cover plate being adhesion enhancement-treated surfaces; an electrospray emitter representing an integrated and protruding portion of said PAEK substrate and said cover plate, said electrospray emitter being in fluid communication with said conduit; and a layer of a solvent-resistant adhesive applied on at least one of said adhesion enhancement-treated surfaces to bond said respective surfaces of said PAEK substrate and said cover plate together. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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Specification