Fabrication methods and structures for micro-reservoir devices
First Claim
1. A method for making a multi-reservoir device comprising:
- patterning one or more photoresist layers on a substrate;
depositing onto the substrate at least one metal layer by physical vapor deposition;
forming a plurality of reservoir caps and conductive traces from the at least one metal layer by using the one or more photoresist layers in a liftoff process or wet chemical etching such that each reservoir cap is electrically connected to two conductive traces;
removing the one or more photoresist layers using a liftoff process;
forming a plurality of reservoirs in the substrate;
loading each reservoir with reservoir contents; and
sealing each reservoir.
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Accused Products
Abstract
Methods are provided for making a multi-reservoir device comprising (i) patterning one or more photoresist layers on a substrate; (ii) depositing onto the substrate at least one metal layer by a sputtering process to form a plurality of reservoir caps and conductive traces; (iii) removing the photoresist layers using a liftoff process; (iv) forming a plurality of reservoirs in the substrate; (v) loading each reservoir with reservoir contents (such as a drug or sensor); and (vi) sealing each reservoir. Optionally, the reservoir cap comprises a first conductive metal layer coated with one or more protective noble metal films. To enhance the resistance of the substrate (e.g., a silicon substrate) to etching in vivo, the interior sidewalls of the reservoirs optionally can include a protective coating (e.g., gold, platinum, carbon, silicon carbide, silicon dioxide, and platinum silicide), or sidewalls comprising silicon can be doped with boron or another impurity.
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Citations
32 Claims
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1. A method for making a multi-reservoir device comprising:
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patterning one or more photoresist layers on a substrate; depositing onto the substrate at least one metal layer by physical vapor deposition; forming a plurality of reservoir caps and conductive traces from the at least one metal layer by using the one or more photoresist layers in a liftoff process or wet chemical etching such that each reservoir cap is electrically connected to two conductive traces; removing the one or more photoresist layers using a liftoff process; forming a plurality of reservoirs in the substrate; loading each reservoir with reservoir contents; and sealing each reservoir. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 26, 27, 28, 29, 30)
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22. A microfabrication method comprising:
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patterning a bilayer of photoresist on a substrate, wherein the bilayer photoresist comprises an upper layer and a lower layer, the lower layer being disposed on top of the substrate and the upper layer being disposed on top of the lower layer; etching the lower layer away in select areas to form one or more bridges comprising areas of the upper layer over and spaced apart from the substrate, each said bridge having opposing first and second connection regions that are connected to the substrate; depositing onto the substrate at least one metal layer by physical vapor deposition, wherein the one or more bridges provide a shielding effect to produce a metal film or patterned metal feature with a thickness variation within a single metal layer, without etching the metal layer; forming a plurality of reservoir caps and conductive traces from the at least one metal layer by using the one or more photoresist layers in a liftoff process or wet chemical etching such that each reservoir cap is electrically connected to two conductive traces; removing the bilayer photoresist layers using a liftoff process; forming a plurality of reservoirs in the substrate; loading each reservoir with reservoir contents; and sealing each reservoir. - View Dependent Claims (23)
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24. A method for making a multi-reservoir device comprising:
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depositing a layer of a nitride material on a silicon substrate; patterning the nitride layer with photoresist; etching the nitride layer using an RIE process; stripping off the photoresist; anistropically etching the silicon substrate; forming metal traces by depositing and patterning a first metal layer; forming reservoir caps by depositing and patterning a second metal layer atop portions of the first metal layer using a liftoff technique to form a structure; applying a passivation layer onto the structure; etching the passivation layer; and etching the nitride layer from under the reservoir cap. - View Dependent Claims (25, 31, 32)
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Specification