Method of manufacturing a structural health monitoring layer
First Claim
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1. A method of fabricating a sensing layer, comprising:
- providing a flexible substrate, the flexible substrate having a dielectric layer and conductive leads exposed on the dielectric layer, the conductive leads extending to an edge of the dielectric layer;
providing a first flexible nonconductive cover layer having holes therethrough;
affixing the first cover layer to the flexible substrate so as to overlay the conductive leads, wherein the first cover layer is affixed so as to align the holes with the conductive leads, thereby exposing at least a portion of the conductive leads through the first cover layer;
placing strain sensing elements through the holes in the first cover layer and onto the conductive leads; and
depositing an adhesive within the holes so as to surround the sensing elements with the adhesive.
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Abstract
Methods of manufacturing a diagnostic layer containing an array of sensing elements. The sensing elements, associated wires, and any accompanying circuit elements, are incorporated various layers of a thin, flexible substrate. This substrate can then be affixed to a structure so that the array of sensing elements can analyze the structure in accordance with structural health monitoring techniques. The substrate can also be designed to be incorporated into the body of the structure itself, such as in the case of composite structures.
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Citations
32 Claims
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1. A method of fabricating a sensing layer, comprising:
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providing a flexible substrate, the flexible substrate having a dielectric layer and conductive leads exposed on the dielectric layer, the conductive leads extending to an edge of the dielectric layer; providing a first flexible nonconductive cover layer having holes therethrough; affixing the first cover layer to the flexible substrate so as to overlay the conductive leads, wherein the first cover layer is affixed so as to align the holes with the conductive leads, thereby exposing at least a portion of the conductive leads through the first cover layer; placing strain sensing elements through the holes in the first cover layer and onto the conductive leads; and depositing an adhesive within the holes so as to surround the sensing elements with the adhesive. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A method of manufacturing an embedded sensor layer, comprising:
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providing a flexible substrate having conductive traces deposited on a dielectric medium, and holes in the dielectric material exposing portions of the conductive traces, the conductive traces extending to an edge of the flexible substrate and exposed on an outer surface of the dielectric medium; placing strain sensing elements in the holes and in electrical communication with the exposed portions of the conductive traces; depositing a nonconductive adhesive within the holes so as to at least partially surround the sensing elements, and so as to affix the sensing elements to the flexible substrate; and attaching the flexible substrate and the sensing elements to a structure so as to facilitate the monitoring of the structural health of the structure by the sensing elements. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31)
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32. A method of fabricating a sensing layer, comprising:
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providing a flexible substrate, the flexible substrate having a dielectric layer and conductive leads exposed on the dielectric layer, the conductive leads extending to an edge of the dielectric layer; providing a first flexible nonconductive cover layer having holes therethrough; affixing the first cover layer to the flexible substrate so as to overlay the conductive leads, wherein the first cover layer is affixed so as to align the holes with the conductive leads, thereby exposing at least a portion of the conductive leads through the first cover layer; placing sensor/actuators through the holes in the first cover layer and onto the conductive leads; and depositing an adhesive within the holes so as to surround the sensor/actuators with the adhesive.
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Specification