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Method of manufacturing a structural health monitoring layer

  • US 7,413,919 B2
  • Filed: 11/14/2005
  • Issued: 08/19/2008
  • Est. Priority Date: 06/20/2003
  • Status: Active Grant
First Claim
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1. A method of fabricating a sensing layer, comprising:

  • providing a flexible substrate, the flexible substrate having a dielectric layer and conductive leads exposed on the dielectric layer, the conductive leads extending to an edge of the dielectric layer;

    providing a first flexible nonconductive cover layer having holes therethrough;

    affixing the first cover layer to the flexible substrate so as to overlay the conductive leads, wherein the first cover layer is affixed so as to align the holes with the conductive leads, thereby exposing at least a portion of the conductive leads through the first cover layer;

    placing strain sensing elements through the holes in the first cover layer and onto the conductive leads; and

    depositing an adhesive within the holes so as to surround the sensing elements with the adhesive.

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