Semiconductor device manufacturing method
First Claim
1. A method of manufacturing a semiconductor device, comprising:
- providing a semiconductor substrate comprising a front surface, a back surface, a first insulation film disposed on the front surface and a pad electrode disposed on the first insulation film;
attaching a support body to the front surface;
forming an opening in the semiconductor substrate and adjacent the pad electrode by etching the semiconductor substrate from the back surface, the opening having a bottom and a sidewall;
forming a second insulation film that is disposed on the back surface and extends into the opening;
etching the first and second insulation films disposed at the bottom of the opening to expose part of the pad electrode;
forming an organic protection layer that is disposed on the back surface and extends into the opening so as to cover a portion of the second insulation film corresponding to a boundary between the sidewall and the bottom of the opening; and
forming a wiring layer that is disposed on the back surface and extends into the opening so as to be in contact with the exposed pad electrode, part of the wiring layer being disposed on the organic protection layer.
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Accused Products
Abstract
The invention is directed to improvement of reliability of a chip size package type semiconductor device in a manufacturing method thereof. A support body is formed on a front surface of a semiconductor substrate with a first insulation film therebetween. Then, a part of the semiconductor substrate is selectively etched from its back surface to form an opening, and then a second insulation film is formed on the back surface. Next, the first insulation film and the second insulation film at a bottom of the opening are selectively etched, to expose pad electrodes at the bottom of the opening. Then, a third resist layer is selectively formed on a second insulation film at boundaries between sidewalls and the bottom of the opening on the back surface of the semiconductor substrate. Furthermore, a wiring layer electrically connected with the pad electrodes at the bottom of the opening and extending onto the back surface of the semiconductor substrate is selectively formed corresponding to a predetermined pattern.
27 Citations
6 Claims
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1. A method of manufacturing a semiconductor device, comprising:
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providing a semiconductor substrate comprising a front surface, a back surface, a first insulation film disposed on the front surface and a pad electrode disposed on the first insulation film; attaching a support body to the front surface; forming an opening in the semiconductor substrate and adjacent the pad electrode by etching the semiconductor substrate from the back surface, the opening having a bottom and a sidewall; forming a second insulation film that is disposed on the back surface and extends into the opening; etching the first and second insulation films disposed at the bottom of the opening to expose part of the pad electrode; forming an organic protection layer that is disposed on the back surface and extends into the opening so as to cover a portion of the second insulation film corresponding to a boundary between the sidewall and the bottom of the opening; and forming a wiring layer that is disposed on the back surface and extends into the opening so as to be in contact with the exposed pad electrode, part of the wiring layer being disposed on the organic protection layer. - View Dependent Claims (2, 3, 4, 5, 6)
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Specification