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Waferscale package system

  • US 7,414,310 B2
  • Filed: 02/02/2006
  • Issued: 08/19/2008
  • Est. Priority Date: 02/02/2006
  • Status: Active Grant
First Claim
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1. A waferscale package system comprising:

  • forming a protection structure comprises;

    forming a wafer,fabricating a device element on the wafer,forming a waferscale spacer around the device element and having a thickness greater than a width thereof and greater than the thickness of the device element, andattaching a waferscale cap to the waferscale spacer to cover the device element;

    attaching a carrier to the protection structure;

    electrically connecting the wafer outside the waferscale spacer to the carrier with bond wires; and

    molding an encapsulant around the protection structure to the carrier.

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