Electronics module assembly
First Claim
1. An electronics module assembly to be received and retained within a chassis having a plurality of slots, each said slot having a height dimension, said electronics module assembly comprising:
- a host module configured to be detachably received and retained in one of said slots of said chassis, said host module having a height corresponding with said height dimension of said slots of said chassis; and
at least two sub-modules configured to be detachably received and retained by said host module, said at least two sub-modules each having a height less than said height dimension of said slot of said chassis, said at least two sub-modules having a position guide rail to be detachably received and retained in a position guide slot of said chassis so that said at least two sub-modules with said host module may be utilized in a single said slot of said chassis.
3 Assignments
0 Petitions
Accused Products
Abstract
An electronics module assembly for detachably retaining a pair of electronic sub-modules in a single slot of a chassis. A host module of the electronics module assembly is configured to be detachably received and retained in a slot of the chassis. The host module has a height corresponding with a height of the slot of the chassis. A pair of sub-modules are configured to be detachably received and retained in the host module. The combined height of the sub-modules is no greater than the height dimension of the slot of the chassis. Therefore, where there was once only room for one electronics module in a single slot of the chassis, a pair of sub-modules with the host module may now be utilized in the single slot of the chassis.
14 Citations
20 Claims
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1. An electronics module assembly to be received and retained within a chassis having a plurality of slots, each said slot having a height dimension, said electronics module assembly comprising:
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a host module configured to be detachably received and retained in one of said slots of said chassis, said host module having a height corresponding with said height dimension of said slots of said chassis; and at least two sub-modules configured to be detachably received and retained by said host module, said at least two sub-modules each having a height less than said height dimension of said slot of said chassis, said at least two sub-modules having a position guide rail to be detachably received and retained in a position guide slot of said chassis so that said at least two sub-modules with said host module may be utilized in a single said slot of said chassis. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. An electronic module assembly to be received and retained within a chassis having a plurality of slots, each said slot having a height dimension, said electronics module assembly comprising:
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a host module configured to be detachably received and retained in one of said slots of said chassis, said host module having a height corresponding with said height dimension of said slots of said chassis and a position guide rail to be received by a position guide slot of said chassis; and at least one sub-module configured to be detachably received and retained by said host module, said sub-module having a position guide rail and a height less than said height dimension of said slot of said chassis, wherein more than one sub-module with said host module may be utilized in a single said slot of said chassis and wherein said position guide rail of said host module aligns with said position guide rail of said sub module. - View Dependent Claims (12)
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13. A method of loading electronics modules in slots of a chassis, said method comprising the following steps:
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detachably receiving and retaining a pair of sub-modules in a host module, said sub-modules having position guide rails and a combined height dimension corresponding with a height of one of said slots of said chassis; and detachably receiving and retaining said host module and said position guide rails in said one slot of said chassis, said host module having a height dimension corresponding with said height of said one slot, wherein more than one sub-module with said host module may be utilized in said one slot of said chassis. - View Dependent Claims (14, 15, 16, 17, 18)
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19. A method of loading electronics modules in slots of a chassis, said method comprising the following steps:
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detachably receiving and retaining a pair of sub-modules in a host module, said sub-modules having position guide rails and a combined height dimension corresponding with a height of one of said slots of said chassis; detachably receiving and retaining said host module and said position guide rails in said one slot of said chassis, said host module having a height dimension corresponding with said height of said one slot, wherein more than one sub-module with said host module may be utilized in said one slot of said chassis; and detaching said host module from said slot of said chassis in order to remove each said sub-module of said pair of sub-modules substantially simultaneously.
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20. A method of loading electronics modules in slots of a chassis, said method comprising the following steps:
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detachably receiving and retaining a pair of sub-modules in a host module, said sub-modules having position guide rails and a combined height dimension corresponding with a height of one of said slots of said chassis; detachably receiving and retaining said host module and said position guide rails in said one slot of said chassis, said host module having a height dimension corresponding with said height of said one slot, wherein more than one sub-module with said host module may be utilized in said one slot of said chassis; and aligning a guide rail of said host module with a guide rail of said sub-modules.
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Specification