Apparatus and methods for a physical layout of simultaneously sub-accessible memory modules

• US 7,414,875 B2
• Filed: 12/19/2005
• Issued: 08/19/2008
• Est. Priority Date: 05/08/2003
• Status: Active Grant

• Current Assignee: Mirion Technologies Incorporated (American Capital Limited)
• Original Assignee: Mirion Technologies Incorporated (American Capital Limited)
• Inventors: Jeddeloh, Joseph M., Lee, Terry R.
• Primary Examiner(s): Nguyen; Viet Q
• Application Number:
  US11/311,948
• Publication Number:
  US 20060215434A1
• Time in Patent Office: 974 Days
• Field of Search: 365/230.03, 365/63
• US Class Current: 365/63
• CPC Class Codes: G11C 5/02 Disposition of storage elements, e.g. in the form of a matrix array
• CPC Class Codes: H05K 1/0298 Multilayer circuits
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 2201/09972 Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

A layout for simultaneously sub-accessible memory modules is disclosed. In one embodiment, a memory module includes a printed circuit board having a plurality of sectors, each sector being electrically isolated from the other sectors and having a multi-layer structure. At least one memory device is attached to each sector, the memory devices being organized into a plurality of memory ranks. A driver is attached to the printed circuit board and is operatively coupled to the memory ranks. The driver is adapted to be coupled to a memory interface of the computer system. Because the sectors are electrically-isolated from adjacent sectors, the memory ranks are either individually or simultaneously, or both individually and simultaneously accessible by the driver so that one or more memory devices on a particular sector may be accessed at one time. In an alternate embodiment, the printed circuit board includes a driver sector electrically isolated from the other sectors and having a multi-layer structure, the driver being attached to the driver sector.

Claims

1. A memory module having a memory interface, comprising:

a plurality of memory devices organized into at least four memory ranks, each memory rank having a set of memory devices being electrically isolated from each other, at least one memory rank being located on a first side of the memory module and at least another memory rank being located on a second side of the memory module; and

at least four drivers, each respective drivers operatively coupled to at least one of the memory devices in a respective one of the memory ranks, the driver being adapted to be coupled to the memory interface, wherein the memory ranks are either individually or simultaneously, or both individually and simultaneously accessible by the driver so that one or more memory devices in one or more memory ranks may be accessed at one time.

2. The memory module according to claim 1 further comprising a driver sector electrically isolated from the memory ranks, the driver being coupled to the driver sector.

3. The memory module according to claim 1 wherein:

the at least two memory ranks comprises four memory ranks, each memory rank further comprising four memory devices; and

the at least one driver comprises a single driver.

4. The memory module according to claim 1 wherein the set of memory devices being electrically isolated in each memory rank are electrically isolated on a carrier substrate having a multi-layer structure and further includes a connector edge adapted for insertion into a motherboard.

5. The memory module according to claim 4 wherein the multi-layer structure of the carrier substrate includes first, second, third, and fourth signal layers, first and second ground layers, and first and second power supply layers.

6. The memory module according to claim 5 wherein the multi-layer structure of the carrier substrate includes first, second, third, and fourth signal layers, a ground layer, and a power supply layer.

7. The memory module according to claim 1 wherein the driver comprises a hub including a plurality of driver chips.

8. The memory module according to claim 1 wherein the driver is adapted to receive electrical signals from the memory interface.

9. The memory module according to claim 1 wherein the driver is adapted to receive optical signals from the memory interface.

10. The memory module according to claim 1 wherein the driver is adapted to receive RF signals from the memory interface.

11. A computer system, comprising:

a central processing unit;

a system memory;

a bus bridge coupled to the central processing unit and the system memory and adapted to allow communication between the central processing unit and the system memory, wherein the system memory includes at least one memory module comprising;

a plurality of memory devices organized into at least two memory ranks, each memory rank having a set of memory devices being electrically isolated from each other; and

at least one driver operatively coupled to at least one of the memory devices in a respective one of the memory ranks and to the bus bridge, wherein the memory ranks are either individually or simultaneously, or both individually and simultaneously accessible by the driver so that one or more memory devices in one or more memory ranks may be accessed at one time.

12. The computer system according to claim 11 wherein at least one memory rank comprises the first side of the memory module and at least another memory rank comprises a second side of the memory module.

13. The computer system according to claim 12 wherein:

the at least two memory ranks comprises four memory ranks, each memory rank further comprising four memory devices; and

the at least one driver comprises four drivers, each driver being attached to at least one memory device of each of the memory ranks.

14. The computer system according to claim 11 wherein the at least one module further comprises a driver sector electrically isolated from the memory ranks, the driver being attached to the driver sector.

15. The computer system according to claim 11 wherein:

the at least two memory ranks comprises four memory ranks, each memory rank further comprising four memory devices; and

the at least one driver comprises a single driver.

16. The computer system according to claim 11 wherein the set of memory devices being electrically-isolated in each of the memory ranks are electrically isolated on a carrier substrate having a multi-layer structure, and further having a connector edge to insert into a motherboard.

17. The computer system according to claim 16 wherein the multi-layer structure of the carrier substrate includes first, second, third, and fourth signal layers, first and second ground layers, and first and second power supply layers.

18. The computer system according to claim 16 wherein the multi-layer structure of the carrier substrate includes first, second, third, and fourth signal layers, a ground layer, and a power supply layer.

19. The computer system according to claim 11 wherein the driver comprises a hub including a plurality of driver chips.

20. The computer system according to claim 11, further comprising a display coupled to the bus bridge.

21. The computer system according to claim 11, further comprising a user input device coupled to the bus bridge.

22. The computer system according to claim 11 wherein the at least one driver is adapted to receive electrical signals from the bus bridge.

23. The computer system according to claim 11 wherein the at least one driver is adapted to receive optical signals from the bus bridge.

24. The computer system according to claim 11 wherein the at least one driver is adapted to receive RF signals from the bus bridge.

25. A method of accessing and processing data in a system memory coupled to a data bus of a computer system, comprising:

providing a memory module having a plurality of memory devices divided into a plurality of memory ranks, each memory rank comprising a set memory devices being electrically-isolated;

receiving a plurality of command signals and a plurality of address signals into a plurality of driver chips via the bus;

processing the plurality of command signals and plurality of address signals; and

simultaneously accessing two or more memory devices of one or more memory rank based on the plurality of command signals and plurality of address signals.

26. The method according to claim 25 wherein receiving a plurality of command signals and a plurality of address signals via the bus comprises receiving a plurality of command signals and a plurality of address signals into a driver chip.

27. The method according to claim 25 wherein processing the plurality of command signals and plurality of address signals comprises processing the plurality of command signals and plurality of address signals using a plurality of a driver chips.

28. The method according to claim 25 wherein processing the plurality of command signals and plurality of address signals comprises multiplexing the plurality of command signals and plurality of address signals.

29. The method according to claim 25 wherein simultaneously accessing two or more memory devices of one or more memory ranks based on the plurality of command signals and plurality of address signals comprises simultaneously writing to two or more memory devices.

30. The method according to claim 25 wherein simultaneously accessing two or more memory devices of one or more memory ranks based on the plurality of command signals and plurality of address signals comprises simultaneously reading from two or more memory devices.

31. The method according to claim 25 wherein accessing one or more memory devices of a particular memory rank comprises individually accessing one or more memory devices being electrically-isolated from each other, and further comprising accessing one or more memory devices of another memory rank being electrically-isolated from each other.

32. The method according to claim 25 wherein receiving a plurality of command signals and a plurality of address signals via the bus comprises receiving a plurality electrical signals.

33. The method according to claim 25 wherein receiving a plurality of command signals and a plurality of address signals via the bus comprises receiving a plurality optical signals.

34. The method according to claim 25 wherein receiving a plurality of command signals and a plurality of address signals via the bus comprises receiving a plurality RF signals.

35. A memory module having a memory interface, comprising:

a plurality of memory devices organized into at least two memory ranks, each memory rank having a set of memory devices being electrically isolated from each other;

a driver sector electrically isolated from the at least two memory ranks; and

at least one driver coupled to the driver sector and operatively coupled to at least one of the memory devices in a respective one of the memory ranks, the driver being adapted to be coupled to the memory interface, wherein the memory ranks are either individually or simultaneously, or both individually and simultaneously accessible by the driver so that one or more memory devices in one or more memory ranks may be accessed at one time.

36. The memory module according to claim 35 wherein at least one memory rank comprises a first side of the memory module and at least another memory rank comprises a second side of the memory module.

37. The memory module according to claim 35 wherein:

the at least two memory ranks comprises four memory ranks, each memory rank further comprising four memory devices; and

the at least one driver comprises a single driver.

38. The memory module according to claim 35 wherein the set of memory devices being electrically isolated in each memory rank are electrically isolated on a carrier substrate having a multi-layer structure and further includes a connector edge adapted for insertion into a motherboard.

39. The memory module according to claim 38 wherein the multi-layer structure of the carrier substrate includes first, second, third, and fourth signal layers, first and second ground layers, and first and second power supply layers.

40. The memory module according to claim 39 wherein the multi-layer structure of the carrier substrate includes first, second, third, and fourth signal layers, a ground layer, and a power supply layer.

41. The memory module according to claim 35 wherein the driver comprises a hub including a plurality of driver chips.

42. The memory module according to claim 35 wherein the driver is adapted to receive electrical signals from the memory interface.

43. The memory module according to claim 35 wherein the driver is adapted to receive optical signals from the memory interface.

44. The memory module according to claim 35 wherein the driver is adapted to receive RF signals from the memory interface.

45. A memory module having a memory interface, comprising:

a plurality of memory devices organized into at least four memory ranks, each memory rank having at least four memory devices being electrically isolated from each other; and

a single driver operatively coupled to at least one of the memory devices in a respective one of the memory ranks, the driver being adapted to be coupled to the memory interface, wherein the memory ranks are either individually or simultaneously, or both individually and simultaneously accessible by the driver so that one or more memory devices in one or more memory ranks may be accessed at one time.

46. The memory module according to claim 45 wherein at least one memory rank comprises a first side of the memory module and at least another memory rank comprises a second side of the memory module.

47. The memory module according to claim 45 wherein the set of memory devices being electrically isolated in each memory rank are electrically isolated on a carrier substrate having a multi-layer structure and further includes a connector edge adapted for insertion into a motherboard.

48. The memory module according to claim 47 wherein the multi-layer structure of the carrier substrate includes first, second, third, and fourth signal layers, first and second ground layers, and first and second power supply layers.

49. The memory module according to claim 48 wherein the multi-layer structure of the carrier substrate includes first, second, third, and fourth signal layers, a ground layer, and a power supply layer.

50. The memory module according to claim 45 wherein the driver comprises a hub including a plurality of driver chips.

51. The memory module according to claim 45 wherein the driver is adapted to receive electrical signals from the memory interface.

52. The memory module according to claim 45 wherein the driver is adapted to receive optical signals from the memory interface.

53. The memory module according to claim 45 wherein the driver is adapted to receive RF signals from the memory interface.

54. A memory module having a memory interface, comprising:

a plurality of memory devices organized into at least two memory ranks, each memory rank having a set of memory devices being electrically isolated from each other; and

at least one driver operatively coupled to at least one of the memory devices in a respective one of the memory ranks, the driver being adapted to be coupled to receive optical signals from the memory interface, wherein the memory ranks are either individually or simultaneously, or both individually and simultaneously accessible by the driver so that one or more memory devices in one or more memory ranks may be accessed at one time.

55. The memory module according to claim 54 wherein the set of memory devices being electrically isolated in each memory rank are electrically isolated on a carrier substrate having a multi-layer structure and further includes a connector edge adapted for insertion into a motherboard.

56. The memory module according to claim 55 wherein the multi-layer structure of the carrier substrate includes first, second, third, and fourth signal layers, first and second ground layers, and first and second power supply layers.

57. The memory module according to claim 56 wherein the multi-layer structure of the carrier substrate includes first, second, third, and fourth signal layers, a ground layer, and a power supply layer.

58. A memory module having a memory interface, comprising:

a plurality of memory devices organized into at least two memory ranks, each memory rank having a set of memory devices being electrically isolated from each other; and

at least one driver operatively coupled to at least one of the memory devices in a respective one of the memory ranks, the driver being adapted to be coupled to receive RF signals from the memory interface, wherein the memory ranks are either individually or simultaneously, or both individually and simultaneously accessible by the driver so that one or more memory devices in one or more memory ranks may be accessed at one time.

59. The memory module according to claim 58 wherein the set of memory devices being electrically isolated in each memory rank are electrically isolated on a carrier substrate having a multi-layer structure and further includes a connector edge adapted for insertion into a motherboard.

60. The memory module according to claim 59 wherein the multi-layer structure of the carrier substrate includes first, second, third, and fourth signal layers, first and second ground layers, and first and second power supply layers.

61. The memory module according to claim 60 wherein the multi-layer structure of the carrier substrate includes first, second, third, and fourth signal layers, a ground layer, and a power supply layer.

62. A method of accessing and processing data in a system memory coupled to a data bus of a computer system, comprising:

providing a memory module having a plurality of memory devices divided into a plurality of memory ranks, each memory rank comprising a set memory devices being electrically-isolated;

receiving a plurality of command signals and a plurality of address signals via the bus;

processing the plurality of command signals and plurality of address signals; and

simultaneously writing to two or more memory devices of one or more memory rank based on the plurality of command signals and plurality of address signals.

63. The method according to claim 62 wherein receiving a plurality of command signals and a plurality of address signals via the bus comprises receiving a plurality of command signals and a plurality of address signals into a driver chip.

64. The method according to claim 62 wherein processing the plurality of command signals and plurality of address signals comprises multiplexing the plurality of command signals and plurality of address signals.

65. The method according to claim 62 wherein simultaneously accessing two or more memory devices of one or more memory ranks based on the plurality of command signals and plurality of address signals comprises simultaneously reading from two or more memory devices.

66. The method according to claim 62 wherein accessing one or more memory devices of a particular memory rank comprises individually accessing one or more memory devices being electrically-isolated from each other, and further comprising accessing one or more memory devices of another memory rank being electrically-isolated from each other.

67. The method according to claim 62 wherein receiving a plurality of command signals and a plurality of address signals via the bus comprises receiving a plurality electrical signals.

68. The method according to claim 67 wherein receiving a plurality of command signals and a plurality of address signals via the bus comprises receiving a plurality optical signals.

69. A method of accessing and processing data in a system memory coupled to a data bus of a computer system, comprising:

providing a memory module having a plurality of memory devices divided into a plurality of memory ranks, each memory rank comprising a set memory devices being electrically-isolated;

receiving a plurality of command signals and a plurality of address signals via the bus;

processing the plurality of command signals and plurality of address signals; and

simultaneously reading from two or more memory devices of one or more memory rank based on the plurality of command signals and plurality of address signals.

70. The method according to claim 69 wherein receiving a plurality of command signals and a plurality of address signals via the bus comprises receiving a plurality of command signals and a plurality of address signals into a driver chip.

71. The method according to claim 69 wherein processing the plurality of command signals and plurality of address signals comprises multiplexing the plurality of command signals and plurality of address signals.

72. The method according to claim 69 wherein accessing one or more memory devices of a particular memory rank comprises individually accessing one or more memory devices being electrically-isolated from each other, and further comprising accessing one or more memory devices of another memory rank being electrically-isolated from each other.

73. The method according to claim 69 wherein receiving a plurality of command signals and a plurality of address signals via the bus comprises receiving a plurality electrical signals.

74. The method according to claim 73 wherein receiving a plurality of command signals and a plurality of address signals via the bus comprises receiving a plurality optical signals.

75. A method of accessing and processing data in a system memory coupled to a data bus of a computer system, comprising:

providing a memory module having a plurality of memory devices divided into a plurality of memory ranks, each memory rank comprising a set memory devices being electrically-isolated;

receiving a plurality of command signals and a plurality of address signals via the bus, wherein the signals include a plurality of optical signals;

processing the plurality of command signals and plurality of address signals; and

simultaneously accessing two or more memory devices of one or more memory rank based on the plurality of command signals and plurality of address signals.

76. The method according to claim 75 wherein receiving a plurality of command signals and a plurality of address signals via the bus comprises receiving a plurality of command signals and a plurality of address signals into a driver chip.

77. The method according to claim 75 wherein processing the plurality of command signals and plurality of address signals comprises multiplexing the plurality of command signals and plurality of address signals.

78. The method according to claim 75 wherein accessing one or more memory devices of a particular memory rank comprises individually accessing one or more memory devices being electrically-isolated from each other, and further comprising accessing one or more memory devices of another memory rank being electrically-isolated from each other.

79. A method of accessing and processing data in a system memory coupled to a data bus of a computer system, comprising:

providing a memory module having a plurality of memory devices divided into a plurality of memory ranks, each memory rank comprising a set memory devices being electrically-isolated;

receiving a plurality of command signals and a plurality of address signals via the bus, wherein the signals include a plurality of RF signals;

processing the plurality of command signals and plurality of address signals; and

simultaneously accessing two or more memory devices of one or more memory rank based on the plurality of command signals and plurality of address signals.

80. The method according to claim 79 wherein receiving a plurality of command signals and a plurality of address signals via the bus comprises receiving a plurality of command signals and a plurality of address signals into a driver chip.

81. The method according to claim 79 wherein processing the plurality of command signals and plurality of address signals comprises multiplexing the plurality of command signals and plurality of address signals.

82. The method according to claim 79 wherein accessing one or more memory devices of a particular memory rank comprises individually accessing one or more memory devices being electrically-isolated from each other, and further comprising accessing one or more memory devices of another memory rank being electrically-isolated from each other.