Fabrication of LTCC T/R modules with multiple cavities and an integrated ceramic ring frame
First Claim
1. A method of fabricating a package for an electronic device with low temperature co-fired ceramic (LTCC) including one or more multi-layer parts having multiple cavities therein for the location of active and passive electronic circuit components, comprising the steps of:
- dividing and stacking a plurality of partially fabricated layers of LTCC material into a predetermined number of stacks, each of the stacks including a predetermined number of LTCC layers based on a respective cavity configuration to be subsequently formed therein;
separately laminating each of the stacks of LTCC layers at a first predetermined pressure into individual sections of laminated LTCC material;
forming desired cavity patterns into each of said sections;
stacking the sections including the cavity patterns formed therein into an assembly of contiguous sections;
placing the assembly in a lamination fixture; and
isostatically laminating the assembly of the sections at a second predetermined pressure into a composite LTCC structure;
wherein said layers of LTCC tape comprise at least 20 layers of about 5 mil thick tape.
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Accused Products
Abstract
A method of fabricating a transmit/receive (T/R) module utilizing low temperature co-fired ceramic (LTCC) material in place of high temperature co-fired ceramic (HTCC) material and utilizing a combination of multiple lamination steps which also include forming a ceramic frame, as opposed to a metal ring frame, in the process. Brazing metallization is also utilized to attach heat sinks and lids as well as pin connectors. The formation of the pin connectors is provided on the side surface of the T/R module with a side printing process.
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Citations
19 Claims
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1. A method of fabricating a package for an electronic device with low temperature co-fired ceramic (LTCC) including one or more multi-layer parts having multiple cavities therein for the location of active and passive electronic circuit components, comprising the steps of:
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dividing and stacking a plurality of partially fabricated layers of LTCC material into a predetermined number of stacks, each of the stacks including a predetermined number of LTCC layers based on a respective cavity configuration to be subsequently formed therein; separately laminating each of the stacks of LTCC layers at a first predetermined pressure into individual sections of laminated LTCC material; forming desired cavity patterns into each of said sections; stacking the sections including the cavity patterns formed therein into an assembly of contiguous sections; placing the assembly in a lamination fixture; and isostatically laminating the assembly of the sections at a second predetermined pressure into a composite LTCC structure; wherein said layers of LTCC tape comprise at least 20 layers of about 5 mil thick tape. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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Specification