Image sensor system for monitoring condition of electrode for electrochemical process tools

• US 7,416,648 B2
• Filed: 05/12/2005
• Issued: 08/26/2008
• Est. Priority Date: 05/12/2005
• Status: Expired due to Fees

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Chiou, Wen-Chih, Chan, Cheng Hsun, Chen, Ying-Ho
• Primary Examiner(s): Bell; Bruce F
• Application Number:
  US11/127,361
• Publication Number:
  US 20060254927A1
• Time in Patent Office: 1,202 Days
• Field of Search: 205/297, 204/297.01, 204/297.06, 204/297.07, 204/297.08
• US Class Current: 204/297.08
• CPC Class Codes: B23H 5/08 Electrolytic grinding
• CPC Class Codes: B24B 37/04 designed for working plane surfaces
• CPC Class Codes: B24B 49/12 involving optical means
• CPC Class Codes: H01L 21/67288 Monitoring of warpage, curvature, damage, defects or the like

Abstract

A system for use in manufacturing semiconductor devices, is provided. The system includes an electrochemical processing tool and an image sensor. The electrochemical processing tool includes an electrode located at a central region of a platen. The electrode is adapted for contacting a wafer workpiece during certain processing of the wafer workpiece using the tool. At least part of the electrode is viewable from above the platen when the electrochemical processing tool is operably assembled. The image sensor is capable of capturing an image of the viewable part of the electrode. The image sensor is positioned above the platen. The image sensor is adapted to be aimed at the electrode when an image of the electrode is to be taken with the image sensor.

Claims

1. A system for use in manufacturing semiconductor devices, the system comprising:

an electrochemical processing tool comprising an electrode located at a central region of a platen, the electrode being adapted for contacting a wafer workpiece during certain processing of the wafer workpiece using the tool, and at least part of the electrode being viewable from above the platen when the electrochemical processing tool is operably assembled; and

an image sensor capable of capturing an image of the viewable part of the electrode, the image sensor being positioned above the platen, and the image sensor adapted to be aimed at the electrode when an image of the electrode is to be taken with the image sensor.

2. The system of claim 1, wherein the electrochemical processing tool comprises an electrochemical mechanical polishing tool, wherein the electrode is an anode electrode having a plurality of conductive members, and wherein the conductive members are adapted to make physical contact with the wafer workpiece when the electrode is used for processing the wafer workpiece.

3. The system of claim 2, wherein the image sensor is attached to a movable polishing head.

4. The system of claim 2, wherein the image sensor is attached to a fixed structural frame portion that supports at least part of the tool.

5. The system of claim 1, wherein the image sensor comprises a charged-coupled device (CCD) camera or a CMOS camera.

6. The system of claim 1, further comprising an image processor system.

7. The system of claim 6, wherein the image processor system comprises software adapted to determine whether an image of the electrode reveals damage to the electrode that exceeds predetermined criteria.

8. The system of claim 6, wherein the image processor system comprises software adapted to compare a latest image of the electrode to certain standards.

9. The system of claim 6, wherein the image sensor and the image processor system are integral parts of the electrochemical processing tool.

10. The system of claim 6, wherein the image sensor and the image processor system are parts of a stand-alone sensor system operable independent of the electrochemical processing tool.

11. The system of claim 1, wherein the image sensor is electrically connected to electronic devices of the electrochemical processing tool and wherein the image sensor is adapted to feed image signals into the electronic devices of the electrochemical processing tool.

12. The system of claim 1, wherein the electrochemical processing tool comprises an electrochemical plating tool.

13. The system of claim 1, further comprising a movable cover adapted to protect at least part of the image sensor from contamination.

14. The system of claim 1, further comprising a washing system adapted to clean at least part of the image sensor.

15. The system of claim 1, wherein the image sensor is fixed.

16. The system of claim 1, wherein the image sensor is movable.

17. The system of claim 1, further comprising a movable shutter adapted to shield at least part of the image sensor.

18. The system of claim 1, wherein the image sensor is part of a stand-alone, free-standing system with its own image processing system to evaluate the image.

19. An electrode inspection apparatus for an electrochemical processing tool, the apparatus comprising:

an image sensor adapted to be mounted on or adjacent to the electrochemical processing tool above a viewable electrode of the electrochemical processing tool, and the image sensor being adapted to selectively obtain images of the viewable electrode;

a platen comprising an opening, wherein the viewable electrode is exposed through the opening; and

an image processor communicably coupled to the image sensor so that the image processor may receive image signals of the viewable electrode from the image sensor, and the image processor comprising code to evaluate and process the image signals received from the image sensor.

20. The electrode inspection apparatus of claim 19, wherein the image sensor comprises a charge-coupled device (CCD) camera or a CMOS camera.