Power composite integrated semiconductor device and manufacturing method thereof

• US 7,416,932 B2
• Filed: 04/19/2007
• Issued: 08/26/2008
• Est. Priority Date: 05/20/2004
• Status: Expired due to Fees

• Current Assignee: DENSO Corporation
• Original Assignee: DENSO Corporation
• Inventors: Itou, Hiroyasu
• Primary Examiner(s): WOJCIECHOWICZ, EDWARD JOSEPH
• Application Number:
  US11/785,619
• Publication Number:
  US 20070187841A1
• Time in Patent Office: 495 Days
• Field of Search: 438/197, 438/149, 438/151, 438/653, 438/656, 438/666, 438/685, 438/687, 438/688
• US Class Current: 438/197
• CPC Class Codes: H01L 2224/02166 Collar structures
• CPC Class Codes: H01L 2224/023 Redistribution layers [RDL] for bonding areas
• CPC Class Codes: H01L 2224/04042 Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
• CPC Class Codes: H01L 2224/05073 Single internal layer
• CPC Class Codes: H01L 2224/05147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/05166 Titanium [Ti] as principal constituent
• CPC Class Codes: H01L 2224/05187 Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2224/05552 in top view
• CPC Class Codes: H01L 2224/05553 being rectangular
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/05567 the external layer being at least partially embedded in the surface
• CPC Class Codes: H01L 2224/05624 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/05644 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/0603 Bonding areas having different sizes, e.g. different heights or widths
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48463 the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
• CPC Class Codes: H01L 2224/48624 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/48644 : Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48724 : Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/48744 : Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48824 : Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/48844 : Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/49111 : the connectors connecting two common bonding areas, e.g. Litz or braid wires
• CPC Class Codes: H01L 2224/49171 : Fan-out arrangements
• CPC Class Codes: H01L 2224/49175 : Parallel arrangements
• CPC Class Codes: H01L 2224/49431 : on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/85375 : having an external coating, e.g. protective bond-through coating
• CPC Class Codes: H01L 24/03 : Manufacturing methods
• CPC Class Codes: H01L 24/05 : of an individual bonding area
• CPC Class Codes: H01L 24/06 : of a plurality of bonding areas
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0001 : Technical content checked by a classifier
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/00015 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed as prior art
• CPC Class Codes: H01L 2924/0002 : Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01007 : Nitrogen [N]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01022 : Titanium [Ti]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01073 : Tantalum [Ta]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/04941 : TiN
• CPC Class Codes: H01L 2924/04953 : TaN
• CPC Class Codes: H01L 2924/05042 : Si3N4
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/14 : Integrated circuits

Abstract

A high-reliability power composite integrated semiconductor device uses thick copper electrodes as current collecting electrodes of a power device portion to resist wire resistance needed for reducing ON-resistance. Furthermore, wire bonding connection of the copper electrodes is secured, and also the time-lapse degradation under high temperature which causes diffusion of copper and corrosion of copper is suppressed. Still furthermore, direct bonding connection can be established to current collecting electrodes in the power device portion, and also established to a bonding pad formed on the control circuit portion in the control circuit portion. A pad area at the device peripheral portion which has been hitherto needed is reduced, so that the area of the device is saved, and the manufacturing cost is reduced.

Claims

1. A method of manufacturing a semiconductor device that includes a power device portion having a power device formed therein and a control circuit portion having a control circuit formed therein, the power device portion and the control circuit portion being disposed on a surface layer portion of one silicon substrate, characterized in that:

the power device portion and the control circuit portion are wire-connected by first wires formed of aluminum or aluminum alloy disposed on the silicon substrate so as to perform desired control;

silicon nitride film serving as insulating film for coating and protecting the first wires on the silicon substrate is formed so as to be opened at the power device portion so that each of an input and an output can collect current on the first wires and also opened at at least a portion for taking out the input/output of the control circuit at the control circuit portion;

current collecting electrodes that are formed of thick-film copper electrodes connected to the first wires at the lower side through a first barrier layer and each of the current collecting electrodes has a structure that the upper surface and whole side surface thereof are coated with aluminum film or aluminum alloy film through a second barrier layer are arranged at opening portions for current collection in the power device portion;

a bonding pad that is formed of a thick-film copper electrode through the first barrier layer and has a structure that the upper surface and whole side surface thereof are coated with aluminum film or aluminum alloy film through a second barrier layer is disposed on the silicon nitride film in the control circuit portion;

in order to take out the input/output of the control circuit, wires for connecting the first wires to the bonding pad are constructed through the opening formed in the silicon nitride film by second wires that are achieved by laminating the four layers of the first barrier layer, a thin copper wire layer, the second barrier layer and the aluminum film or aluminum alloy film; and

thick polyimide resin film serving as a protection film for coating and protecting the uppermost surface of the silicon substrate is formed so as to be opened at only portions needed to perform bonding connection in areas where the current collecting electrodes and the bonding pad are formed.

2. The manufacturing method of the semiconductor device according to claim 1, wherein titanium, titanium nitride, titanium tungsten or laminate film thereof is used for forming the first barrier layer, and the film thickness thereof is set to 50 to 300 nm.

3. The manufacturing method of the semiconductor device according to claim 1, wherein the thick-film copper electrodes in the power device portion and the control circuit portion are formed according to electroplating by using as a seed layer copper thin film continuously formed on the first baffler layer under vacuum and using a mask.

4. The manufacturing method of the semiconductor device according to claim 3, wherein a film thickness of the copper thin film is set to 0.1 to 1.0 μ

m.

5. The manufacturing method of the semiconductor device according to claim 3, wherein the thin film copper wire layer is formed of the copper thin film.

6. The manufacturing method of the semiconductor device according to claim 1, wherein titanium, titanium nitride, titanium tungsten or the laminate film thereof is used for the second barrier layer, and the film thickness thereof is set to 50 to 300 nm.

7. The manufacturing method of the semiconductor device according to claim 1, wherein the film thickness of the aluminum film or aluminum alloy film is set to 0.8 to 1.5 μ

m, and the aluminum film or aluminum alloy is continuously formed on the second barrier layer under vacuum.

8. The manufacturing method of the semiconductor device according to claim 1, wherein the film thickness of the polyimide resin film is set to 5 to 15 μ

m.