Trench FET with improved body to gate alignment
First Claim
1. A method of forming a field effect transistor, comprising:
- forming trenches in a semiconductor region of a first conductivity type;
partially filling each trench with one or more materials;
performing a dual-pass angled implant to implant dopants of a second conductivity type into the semiconductor region through an upper surface of the semiconductor region and through upper trench sidewalls not covered by the one or more material;
performing a high temperature process to drive the implanted dopants deeper into mesa region thereby forming body regions of the second conductivity type between adjacent trenches; and
forming source regions of the first conductivity type in each body region.
8 Assignments
0 Petitions
Accused Products
Abstract
A field effect transistor is formed as follows. Trenches are formed in a semiconductor region of a first conductivity type. Each trench is partially filled with one or more materials. A dual-pass angled implant is carried out to implant dopants of a second conductivity type into the semiconductor region through an upper surface of the semiconductor region and through upper trench sidewalls not covered by the one or more material. A high temperature process is carried out to drive the implanted dopants deeper into the mesa region thereby forming body regions of the second conductivity type between adjacent trenches. Source regions of the first conductivity type are then formed in each body region.
35 Citations
44 Claims
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1. A method of forming a field effect transistor, comprising:
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forming trenches in a semiconductor region of a first conductivity type; partially filling each trench with one or more materials; performing a dual-pass angled implant to implant dopants of a second conductivity type into the semiconductor region through an upper surface of the semiconductor region and through upper trench sidewalls not covered by the one or more material; performing a high temperature process to drive the implanted dopants deeper into mesa region thereby forming body regions of the second conductivity type between adjacent trenches; and forming source regions of the first conductivity type in each body region. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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19. A method of forming a field effect transistor, comprising:
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forming trenches in a semiconductor region of a first conductivity type; filling the trenches with a dielectric material; recessing the dielectric material to a first depth within each trench; performing a dual-pass angled implant to implant dopants of a second conductivity type into mesa regions between adjacent trenches through upper trench sidewalls not covered by the recessed dielectric material; after the dual-pass angled implant, further recessing the recessed dielectric material; and performing a high temperature process to drive the implanted dopants deeper into the mesa region to thereby form a body region of the second conductivity type in the semiconductor region. - View Dependent Claims (20, 21, 22, 23, 24, 25, 26)
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27. A method of forming a shielded gate field effect transistor, comprising:
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forming trenches in a semiconductor region of a first conductivity type; filling a bottom portion of each trench with a shield electrode, the shield electrodes being insulated from the semiconductor region; filling a remaining portion of each trench with a dielectric material; recessing the dielectric material to a first depth within each trench; performing a dual-pass angled implant to implant dopants of a second conductivity type into mesa regions between adjacent trenches through upper trench sidewalls not covered by the recessed dielectric material; after the dual-pass angled implant, further recessing the recessed dielectric material; and performing a high temperature process to drive the implanted dopants deeper into the mesa region to thereby form a body region of the second conductivity type in the semiconductor region. - View Dependent Claims (28, 29, 30, 31, 32, 33, 34, 35)
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36. A method of forming a shielded gate field effect transistor, comprising:
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forming trenches in a semiconductor region of a first conductivity type; forming a shield dielectric layer lining sidewalls and bottom of each trench; filling each trench with a conductive material; recessing the conductive material to a first depth within each trench; performing a dual-pass angled implant to implant dopants of a second conductivity type into mesa regions between adjacent trenches through upper trench sidewalls not covered by the recessed conductive material; after the dual-pass angled implant, further recessing the conductive material into each trench, a remaining portion of each conductive material forming a shield electrode in each trench; and performing a high temperature process to drive the implanted dopants deeper into the mesa region to thereby form a body region of the second conductivity type in the semiconductor region. - View Dependent Claims (37, 38, 39, 40, 41, 42, 43, 44)
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Specification