Direct contact power transfer pad and method of making same
First Claim
Patent Images
1. A power transfer pad, comprising:
- a non-conductive board having a top and a bottom;
a plurality of conductive substrate sections disposed across the top of the non-conductive board;
at least one conducting element disposed on each of the conductive substrate sections wherein the conducting elements define an exposed top surface of the power transfer pad for temporary placement of an electrical device having a positive contact and a negative contact for charging the electrical device;
a plurality of electrical contacts on the bottom of the non-conductive board, wherein each of the electrical contacts on the bottom of the non-conductive board are in electrical communication with one of the conductive substrate sections on the top of the non-conductive board; and
logic circuitry configured to identify the positive contact and the negative contact of the electrical device when the electrical device is placed on the power transfer pad, wherein the positive and negative contacts are identified by determining that a first one of the conductive substrate sections is electrically coupled to the positive contact and a second one of the conductive substrate sections is electrically coupled to the negative contact,the logic circuitry being further configured to cause the plurality of electrical contacts to supply a positive charge to the positive contact via the first one of the conductive substrate sections and to supply a negative charge to the negative contact via the second one of the conductive substrate sections.
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Abstract
A power transfer pad, having: a non-conductive board having a top and a bottom; a plurality of conductive substrate sections disposed across the top of the non-conductive board; at least one conducting element disposed on each of the conductive substrate sections; a plurality of electrical contacts on the bottom of the non-conductive board, wherein each of the electrical contacts on the bottom of the non-conductive board are in electrical communication with one of the conductive substrate sections on the top of the non-conductive board.
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Citations
43 Claims
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1. A power transfer pad, comprising:
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a non-conductive board having a top and a bottom; a plurality of conductive substrate sections disposed across the top of the non-conductive board; at least one conducting element disposed on each of the conductive substrate sections wherein the conducting elements define an exposed top surface of the power transfer pad for temporary placement of an electrical device having a positive contact and a negative contact for charging the electrical device; a plurality of electrical contacts on the bottom of the non-conductive board, wherein each of the electrical contacts on the bottom of the non-conductive board are in electrical communication with one of the conductive substrate sections on the top of the non-conductive board; and logic circuitry configured to identify the positive contact and the negative contact of the electrical device when the electrical device is placed on the power transfer pad, wherein the positive and negative contacts are identified by determining that a first one of the conductive substrate sections is electrically coupled to the positive contact and a second one of the conductive substrate sections is electrically coupled to the negative contact, the logic circuitry being further configured to cause the plurality of electrical contacts to supply a positive charge to the positive contact via the first one of the conductive substrate sections and to supply a negative charge to the negative contact via the second one of the conductive substrate sections. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32)
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33. A charging plate structure having a top surface for temporary placement of an electrical device to be charged, comprising:
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a non-conductive board having a top and a bottom; a plurality of conductive substrate sections disposed across the top of the non-conductive board, with each conductive substrate section having an upper surface defining a respective charging area; non-conductive material overlying the non-conductive board laterally between the conductive substrate sections to insulate the conductive substrate sections from each other across the top of the non-conductive board; a plurality of conducting elements disposed across the charging areas to define the top surface for temporary placement of an electrical device to be charged, with each conducting element projecting upward from the upper surface of a respective conductive substrate section; non-conductive material overlying the upper surfaces of the conductive substrate sections laterally between the upwardly projecting conducting elements to insulate the conducting elements from each other laterally across and between adjacent charging areas; and logic circuitry configured to identify a positive contact and a negative contact on the electrical device when the electrical device is placed on the top surface of the charging plate, wherein the positive and negative contacts are identified by determining that a first one of the conductive substrate sections is electrically coupled to the positive contact and a second one of the conductive substrate sections is electrically coupled to the negative contact, the logic circuitry being further configured to cause the first one of the conductive substrate sections to supply a positive charge to the positive contact and to cause the second one of the conductive substrate sections to supply a negative charge to the negative contact. - View Dependent Claims (34, 35, 36, 37, 38, 39)
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40. A power transfer device for charging an electrical device that includes a positive charging contact and a negative charging contact, comprising:
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a charging plate that includes a plurality of conductive substrate sections, each of the plurality of conductive substrate sections being electrically isolated from other ones of the plurality of conductive substrate sections; and logic circuitry configured to control a supply of power to each of the plurality of conductive substrate sections; wherein the plurality of conductive substrate sections are configured such that when the electrical device is positioned on the power transfer pad, the positive charging contact is electrically coupled to a first one of the plurality of conductive substrate sections and the negative charging contact is electrically coupled to a second one of the plurality of conductive substrate sections; wherein the logic circuitry is configured to identify that the positive charging contact is electrically coupled to the first one of the plurality of conductive substrate sections and that the negative charging contact is electrically coupled to the second one of the plurality of conductive substrate section, and in response cause the first one of the plurality of conductive substrate sections to supply a positive charge to the positive charging contact and the second one of the plurality of conductive substrate sections to supply a negative charge to the negative charging contact. - View Dependent Claims (41, 42, 43)
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Specification