High efficiency inductor, method for manufacturing the inductor, and packaging structure using the inductor
First Claim
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1. An inductor comprising:
- a substrate comprising;
a plurality of vertically formed via holes;
a plurality of vertical conductive portions filling each of the via holes; and
a plurality of first horizontal conductive portions and a plurality of second horizontal conductive portions , wherein each of the first and second horizontal conductive portions connect two of the vertical conductive portions at a top and a bottom of the substrate, respectively; and
wherein one of the vertical conductive portions is connected to two other vertical conductive portions, wherein the two other vertical conductive portions are separated from each other at the top and the bottom of the substrate, wherein the vertical conductive portions and the first and second horizontal conductive portions form a single coil structure; and
an electrode portion formed in a first end and a second end of the coil structure.
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Abstract
An inductor is provided which includes a plurality of via holes vertically passing through a substrate, the substrate having insulating properties, vertical conductive portions filling the via holes, and horizontal conductive portions connecting each individual vertical conductive portions at the top and the bottom of the substrate to form a single coil structure with the vertical conductive portions.
21 Citations
16 Claims
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1. An inductor comprising:
a substrate comprising; a plurality of vertically formed via holes; a plurality of vertical conductive portions filling each of the via holes; and a plurality of first horizontal conductive portions and a plurality of second horizontal conductive portions , wherein each of the first and second horizontal conductive portions connect two of the vertical conductive portions at a top and a bottom of the substrate, respectively; and wherein one of the vertical conductive portions is connected to two other vertical conductive portions, wherein the two other vertical conductive portions are separated from each other at the top and the bottom of the substrate, wherein the vertical conductive portions and the first and second horizontal conductive portions form a single coil structure; and an electrode portion formed in a first end and a second end of the coil structure. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A packaging structure comprising:
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a base substrate on which a device is formed; an upper substrate hermetically sealing the device and covering the base substrate, comprising at least four via holes, vertically formed and disposed in two rows along the upper substrate; a plurality of vertical conductive portions packed in the via holes; a plurality of first horizontal conductive portions, pairing two of the vertical conductive portions located in an independent row and across from each other, and electrically connecting the two vertical conductive portions to a first side of the upper substrate; a plurality of second horizontal conductive portions pairing two of the vertical conductive portions located in an independent row and diagonally across from each other, and electrically connecting the two vertical conductive portions to a second side of the upper substrate, and forming a single coil structure with the vertical conductive portions and the first horizontal conductive portions; and an electrode portion which electrically connects the coil structure to the device. - View Dependent Claims (8, 9, 10, 11, 12, 13, 14, 15, 16)
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Specification