Mirror and mirror layer for optical modulator and method

• US 7,417,783 B2
• Filed: 07/01/2005
• Issued: 08/26/2008
• Est. Priority Date: 09/27/2004
• Status: Expired due to Fees

• Current Assignee: Snaptrack Incorporated (Qualcomm, Inc.)
• Original Assignee: IDC, LLC
• Inventors: Chui, Clarence, Sampsell, Jeffrey B.
• Primary Examiner(s): Thompson; Timothy J
• Application Number:
  US11/173,551
• Publication Number:
  US 20060077518A1
• Time in Patent Office: 1,152 Days
• Field of Search: 359/291, 359/290, 359/223, 359/224, 359/318, 345/108
• US Class Current: 359/291
• CPC Class Codes: G02B 26/001 based on interference in an adjustable optical cavity interference filters G02B5/28; devices or arrangements using multiple reflections in spectrometry or monochromators G01J3/26
• CPC Class Codes: G02B 26/0841 the reflecting element being moved or deformed by electrostatic means

Abstract

Described herein are systems, devices, and methods relating to packaging electronic devices, for example, microelectromechanical systems (MEMS) devices, including optical modulators such as interferometric optical modulators. The interferometric modulator disclosed herein comprises a movable mirror. Some embodiments of the disclosed movable mirror exhibit a combination of improved properties compared to known mirrors, including reduced moving mass, improved mechanical properties, and reduced etch times.

Claims

1. A microelectromechanical systems mirror comprising a mirror body, the mirror body comprising a first surface and a second surface opposite from the first surface, wherein

the first surface of the mirror body comprises a reflective surface,

the mirror body is substantially rigid,

the mirror body being movable within a microelectromechanical systems device and secured therein by a connector extending between the second surface of the mirror body and a mechanical layer, and

the mirror body comprises a plurality of cavities.

2. The microelectromechanical systems mirror of claim 1, wherein the mirror body further comprises a reflective layer, and wherein the reflective surface comprises a surface of the reflective layer.

3. The microelectromechanical systems mirror of claim 1, wherein the mirror body comprises aluminum or aluminum alloy.

4. The microelectromechanical systems mirror of claim 1, wherein the reflective surface is an aluminum or aluminum alloy surface.

5. The microelectromechanical systems mirror of claim 1, wherein at least one cavity is at least in part defined by a layer of a body material substantially parallel to the reflective surface.

10. The microelectromechanical systems mirror of claim 1, wherein the plurality of cavities is defined at least in part by one or more structures comprising elements that are substantially perpendicular to the reflective surface.

12. The microelectromechanical systems mirror of claim 10, wherein at least some of the cavities form a substantially square grid.

13. The microelectromechanical systems mirror of claim 10, wherein at least some of the cavities form a substantially hexagonal grid.

14. The microelectromechanical systems mirror of claim 10, further comprising a connector contact area on the mirror body.

6. A microelectromechanical systems mirror comprising a mirror body, wherein

a surface of the mirror body comprises a reflective surface,

the mirror body is substantially rigid,

the mirror body being movable within a microelectromechanical systems device,

the mirror body comprises a plurality of cavities, and

the plurality of cavities are at least in part defined by a plurality of layers of a body material, wherein each layer of body material is substantially parallel to the reflective surface.

7. The microelectromechanical systems mirror of claim 6, further comprising a spacer disposed between and secured to adjacent layers of the body material.

8. The microelectromechanical systems mirror of claim 6, further comprising a plurality of pins extending through and secured to the layers of the body material.

9. A microelectromechanical systems mirror comprising a mirror body, wherein

a surface of the mirror body comprises a reflective surface,

the mirror body is substantially rigid,

the mirror body being movable within a microelectromechanical systems device,

the mirror body comprises a plurality of cavities, and

the mirror body is porous.

11. A microelectromechanical systems mirror comprising a mirror body, wherein

a surface of the mirror body comprises a reflective surface,

the mirror body is substantially rigid,

the mirror body being movable within a microelectromechanical systems device,

the mirror body comprises a plurality of cavities,

the plurality of cavities are defined at least in part by one or more structures comprising elements that are substantially perpendicular to the reflective surface, and

the structures comprise a plurality of pins.