Ink ejection nozzle arrangement with layered actuator mechanism

• US 7,419,244 B2
• Filed: 02/15/2007
• Issued: 09/02/2008
• Est. Priority Date: 10/16/1998
• Status: Expired due to Fees

• Current Assignee: Memjet Technology Ltd. (Memjet Limited)
• Original Assignee: Silverbrook Research Pty Limited
• Inventors: Silverbrook, Kia
• Primary Examiner(s): Nguyen; Thinh H
• Application Number:
  US11/706,323
• Publication Number:
  US 20070182784A1
• Time in Patent Office: 565 Days
• Field of Search: 347 40- 44
• US Class Current: 347/40
• CPC Class Codes: B41J 2/04528 aiming at warming up the head
• CPC Class Codes: B41J 2/04541 Specific driving circuit
• CPC Class Codes: B41J 2/04543 Block driving
• CPC Class Codes: B41J 2/04553 detecting ambient temperature
• CPC Class Codes: B41J 2/04563 detecting head temperature; Ink temperature
• CPC Class Codes: B41J 2/04573 Timing; Delays
• CPC Class Codes: B41J 2/04585 controlling heads based on thermal bent actuators
• CPC Class Codes: B41J 2/04588 using a specific waveform
• CPC Class Codes: B41J 2/04591 Width of the driving signal being adjusted
• CPC Class Codes: B41J 2/04596 Non-ejecting pulses
• CPC Class Codes: B41J 2/04598 Pre-pulse
• CPC Class Codes: B41J 2/14427 Structure of ink jet print heads with thermal bend detached actuators
• CPC Class Codes: B41J 2/1623 bonding and adhesion
• CPC Class Codes: B41J 2/1626 etching
• CPC Class Codes: B41J 2/1628 dry etching
• CPC Class Codes: B41J 2/1631 photolithography
• CPC Class Codes: B41J 2/1632 machining
• CPC Class Codes: B41J 2/1635 dividing the wafer into individual chips
• CPC Class Codes: B41J 2/1639 sacrificial molding
• CPC Class Codes: B41J 2/1642 thin film formation by CVD [chemical vapor deposition]
• CPC Class Codes: B41J 2/1646 : thin film formation by sputtering
• CPC Class Codes: B41J 2/1648 : Production of print heads with thermal bend detached actuators
• CPC Class Codes: B41J 2/175 : Ink supply systems ; Circuit parts therefor
• CPC Class Codes: B41J 2/17513 : Inner structure
• CPC Class Codes: B41J 2/17553 : Outer structure
• CPC Class Codes: B41J 2002/14491 : Electrical connection
• CPC Class Codes: B41J 2202/21 : Line printing

Abstract

An ink ejection nozzle arrangement is provided for an inkjet printer. The arrangement includes a wafer assembly defining an ink supply channel. A nozzle chamber structure is mounted to the wafer assembly, and defines a nozzle chamber for receiving ink from the ink supply channel and an ink ejection port through which ink in the nozzle chamber can be ejected. An anchor extends from the wafer assembly in a location external to the nozzle chamber. An elongate thermal actuator mechanism extends from the anchor and into the nozzle chamber. The thermal actuator mechanism includes an elongate arm which terminates in a free end within the nozzle chamber and a pair of layers of conductive material located on either side of the elongate arm. One of the layers is connected to a current supply so that the free end of the arm can be moved to eject ink in the nozzle chamber through the ink ejection port as a result of differential thermal expansion.

Claims

1. An ink ejection nozzle arrangement for an inkjet printer, the arrangement comprising:

a wafer assembly defining an ink supply channel, and the wafer assembly defining a plurality of spaced apart groups of ink supply channels and a plurality of groups of the ink ejection nozzle arrangements in fluid communication with respective ink supply channel groups;

a nozzle chamber structure mounted to the wafer assembly, and defining a nozzle chamber for receiving ink from the ink supply channel and an ink ejection port through which ink in the nozzle chamber can be ejected;

an anchor extending from the wafer assembly in a location external to the nozzle chamber; and

an elongate thermal actuator mechanism extending from the anchor and into the nozzle chamber, the thermal actuator mechanism comprising an elongate arm which terminates in a free end within the nozzle chamber and a pair of layers of conductive material located on either side of the elongate arm, one of the layers being connected to a current supply so that the free end of the arm can be moved to eject ink in the nozzle chamber through the ink ejection port as a result of differential thermal expansion.

2. A printhead as claimed in claim 1, wherein the layers of conductive material are located proximal to the anchor.

3. A printhead as claimed in claim 2, wherein the layers of conductive material abut the anchor.

4. An ink ejection nozzle arrangement as claimed in claim 1, wherein the ink ejection port is in alignment with the ink supply channel.

5. An inkjet printhead as claimed in claim 1, wherein a pit is defined adjacent each nozzle chamber structure for catching ink and thereby impeding spilt ink from spreading across the printhead.

6. A printhead as claimed in claim 1, wherein each group of nozzle arrangements comprises a pair of rows of nozzle arrangements.

7. A printhead as claimed in claim 6, wherein the rows are arranged so that the thermal actuator mechanisms extend outwardly on either side of the nozzle chamber structures which, in turn, are centrally located.

8. A printhead as claimed in claim 7, wherein each row comprises a plurality of linearly arranged sets of nozzle arrangements with adjacent sets being staggered relative to each other along the row.

9. A printhead as claimed in claim 8, wherein the sets form a plurality of ascending or descending steps.

10. A printhead as claimed in claim 1, wherein the thermal actuator mechanisms of one group of nozzle arrangements are interleaved with the thermal actuator mechanisms of an adjacent group of nozzle arrangements.