Methods of sensing temperature of an electronic device workpiece
First Claim
1. A temperature sensing apparatus fabrication method comprising:
- forming a cavity in an electronic device workpiece;
providing a temperature sensing device within the cavity and in a configuration to sense temperature of the electronic device workpiece;
supporting the temperature sensing device using the electronic device workpiece;
providing an electrical interconnect upon a surface of the electronic device workpiece; and
electrically coupling the electrical interconnect with the temperature sensing device.
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Abstract
The present invention includes electronic device workpieces, methods of semiconductor processing and methods of sensing temperature of an electronic device workpiece. In one aspect, the invention provides an electronic device workpiece including: a substrate having a surface; a temperature sensing device borne by the substrate; and an electrical interconnect formed upon the surface of the substrate, the electrical interconnect being electrically coupled with the temperature sensing device. In another aspect, a method of sensing temperature of an electronic device workpiece includes: providing an electronic device workpiece; supporting a temperature sensing device using the electronic device workpiece; providing an electrical interconnect upon a surface of the electronic device workpiece; electrically coupling the electrical interconnect with the temperature sensing device; and sensing temperature of the electronic device workpiece using the temperature sensing device.
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Citations
41 Claims
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1. A temperature sensing apparatus fabrication method comprising:
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forming a cavity in an electronic device workpiece; providing a temperature sensing device within the cavity and in a configuration to sense temperature of the electronic device workpiece; supporting the temperature sensing device using the electronic device workpiece; providing an electrical interconnect upon a surface of the electronic device workpiece; and electrically coupling the electrical interconnect with the temperature sensing device. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 15, 16, 17, 18)
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14. A temperature sensing apparatus fabrication method comprising:
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providing an electronic device workpiece; forming a plurality of temperature sensing devices over the electronic device workpiece, the temperature sensing devices being configured to sense temperature in three dimensions of the electronic device workpiece. - View Dependent Claims (19, 20, 21, 22, 23)
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24. A temperature sensing apparatus fabrication method comprising:
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supporting a temperature sensing device using an electronic device workpiece; providing the temperature sensing device in a temperature sensing relationship with the electronic device workpiece; providing an electrical interconnect upon a surface of the electronic device workpiece; and electrically coupling the electrical interconnect with the temperature sensing device comprising wire bonding the electrical interconnect and the temperature sensing device. - View Dependent Claims (25, 26, 27, 28, 29, 30, 31, 32)
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33. A temperature sensing method comprising:
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supporting a plurality of temperature sensing devices using a wafer, and wherein the temperature sensing devices are individually in a temperature sensing relationship with respect to the wafer; exposing the wafer and the temperature sensing devices to process conditions effective to form at least one electronic device; and sensing temperature of the wafer in three dimensions of the wafer using the temperature sensing devices during the exposing. - View Dependent Claims (34, 35, 36, 37, 38)
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39. A temperature sensing apparatus fabrication method comprising:
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providing an electronic device workpiece; forming a temperature sensing device over the electronic device workpiece, the forming including providing the temperature sensing device in a temperature sensing relation with the electronic device workpiece; providing an electrical interconnect upon the electronic device workpiece; electrically coupling the electrical interconnect with the temperature sensing device; and wherein the electrically coupling comprises wire bonding the electrical interconnect and the temperature sensing device.
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40. A temperature sensing apparatus fabrication method comprising:
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forming a cavity in an electronic device workpiece; supporting a temperature sensing device using the electronic device workpiece, the supporting comprising providing the temperature sensing device within the cavity in a temperature sensing relationship with the electronic device workpiece; providing an electrical interconnect upon a surface of the electronic device workpiece; and electrically coupling the electrical interconnect with the temperature sensing device. - View Dependent Claims (41)
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Specification