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Methods of sensing temperature of an electronic device workpiece

  • US 7,419,299 B2
  • Filed: 02/06/2004
  • Issued: 09/02/2008
  • Est. Priority Date: 02/27/1998
  • Status: Expired due to Fees
First Claim
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1. A temperature sensing apparatus fabrication method comprising:

  • forming a cavity in an electronic device workpiece;

    providing a temperature sensing device within the cavity and in a configuration to sense temperature of the electronic device workpiece;

    supporting the temperature sensing device using the electronic device workpiece;

    providing an electrical interconnect upon a surface of the electronic device workpiece; and

    electrically coupling the electrical interconnect with the temperature sensing device.

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