Socket for testing semiconductor package

• US 7,419,378 B2
• Filed: 11/14/2007
• Issued: 09/02/2008
• Est. Priority Date: 11/14/2006
• Status: Expired due to Fees

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Kim, Jung-Hyeon, Yu, Se-Jun, Ha, Seoung-Su, Kang, Jin-Won
• Primary Examiner(s): HYEON, HAE M
• Application Number:
  US11/940,044
• Publication Number:
  US 20080113524A1
• Time in Patent Office: 293 Days
• Field of Search: 439 38- 40, 439/950, 439/305
• US Class Current: 439/39
• CPC Class Codes: G01R 1/0466 concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
• CPC Class Codes: G01R 1/0483 Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips for IC's with connecting points around the edges only G01R1/0433
• CPC Class Codes: H01R 11/30 End pieces held in contact by a magnet
• CPC Class Codes: H01R 12/7076 for connection between PCB and component, e.g. display
• CPC Class Codes: H01R 13/2407 characterized by the resilient means

Abstract

Example embodiments of the present invention include a socket for testing a semiconductor package. The socket comprises a body having a through hole. A lower magnet is disposed in a lower region of the through hole, and a first type magnetic pole of the lower magnet is directed upward. An upper magnet is disposed in an upper region of the through hole, wherein the first type magnetic pole of the upper magnet is directed toward the lower magnet. The upper and lower magnets are structured to absorb a shock wave which is generated when the semiconductor package is arranged for testing. A conductive medium is disposed between the lower magnet and the upper magnet to electrically couple contactors of the semiconductor package to a base substrate of the socket.

Claims

1. A socket for testing a semiconductor package, the socket comprising:

a body including a through hole;

a first magnet disposed in a first region of the through hole such that a first type magnetic pole of the first magnet is directed in a first direction;

a second magnet disposed in a second region of the through hole such that the first type magnetic pole of the second magnet is directed in a second direction; and

a conductive medium disposed between the first magnet and the second magnet.

2. The socket of claim 1, wherein the first direction is opposite to the second direction, the conductive medium electrically couples the first magnet to the second magnet, and the first magnet is structured to absorb a shock wave by repelling the second magnet responsive to the semiconductor package being arranged for testing.

3. The socket of claim 2, further comprising a first conductive cushion disposed on a surface of the first magnet, the cushion being structured to further absorb the shock wave, and to electrically couple a base substrate of the socket to a contactor of the semiconductor package.

4. The socket of claim 3, further comprising a second conductive cushion which is disposed on a first surface of the second magnet.

5. The socket of claim 4, wherein the first surface of the second magnet is an upper surface and the second conductive cushion is adhered to the upper surface of the second magnet or a lower surface of the first magnet by a first conductive adhesive film.

6. The socket of claim 5, further comprising a third conductive cushion adhered to a second surface of the second magnet by a second conductive adhesive film, the third conductive cushion being electrically coupled to the base substrate using a substrate contactor.

7. The socket of claim 3, wherein the first conductive cushion is adhered to the first magnet by a conductive adhesive film.

8. The socket of claim 7, wherein the first conductive cushion is formed substantially in the shape of a trapezoid.

9. The socket of claim 7, wherein the first conductive cushion is formed substantially in the shape of a frustum of a cone.

10. The socket of claim 1, wherein the first magnet is flexible.

11. The socket of claim 1, wherein the conductive medium includes at least one conductive wire which is coupled to the first magnet and the second magnet.

12. The socket of claim 1, wherein the conductive medium includes a conductive cushion disposed between the first magnet and the second magnet.

13. The socket of claim 1, wherein the body further includes a protrusion which protrudes inward toward the center of the through hole and secures a position of the second magnet.

14. The socket of claim 1, further comprising an upper plate which is disposed on an upper surface of the body and includes a hole which is aligned with the through hole and is narrower than the through hole.

15. The socket of claim 1, further comprising a lower plate which is disposed on a lower surface of the body and includes a hole which is aligned with the through hole and is narrower than the through hole.

16. A socket for testing a semiconductor package, the socket comprising:

a body including a through hole;

a lower magnet disposed in a lower region of the through hole such that a first type magnetic pole of the lower magnet is directed upward;

an upper magnet disposed in an upper region of the through hole such that the first type magnetic pole of the upper magnet is directed toward the lower magnet;

an upper conductive cushion which is disposed on an upper surface of the upper magnet;

a lower conductive cushion which is disposed on a lower surface of the lower magnet; and

a conductive medium disposed between the lower magnet and the upper magnet.

17. The socket of claim 16, wherein the upper conductive cushion is adhered to the upper magnet by a conductive adhesive film.

18. The socket of claim 16, wherein the upper conductive cushion is formed substantially in the shape of a trapezoid, a lower face of which is larger than an upper face thereof.

19. The socket of claim 16, wherein the upper conductive cushion is formed substantially in the shape of a frustum of a cone.

20. The socket of claim 16, wherein the conductive medium includes at least one conductive wire which is coupled to the lower magnet and the upper magnet.

21. The socket of claim 16, wherein the conductive medium includes a central conductive cushion which is adhered to an upper surface of the lower magnet or to a lower surface of the upper magnet.

22. The socket of claim 21, wherein the central conductive cushion is adhered to the upper surface of the lower magnet or the lower surface of the upper magnet by a conductive adhesive film.

23. A socket for testing a semiconductor package, the socket comprising:

a body including a through hole;

a lower magnet disposed in a lower region of the through hole such that a first type magnetic pole of the lower magnet is directed upward;

a flexible upper magnet disposed in an upper region of the through hole such that the first type magnetic pole of the upper magnet is directed toward the lower magnet; and

a conductive medium disposed between the lower magnet and the upper magnet.

24. The socket of claim 23, wherein a lower conductive cushion is disposed on a lower surface of the lower magnet.

25. The socket of claim 23, wherein the conductive medium includes at least one conductive wire which is coupled to the lower magnet and the upper magnet.

26. The socket of claim 23, wherein the conductive medium includes a central conductive cushion which is adhered to an upper surface of the lower magnet or to a lower surface of the upper magnet by a conductive adhesive film.