Methods and systems for rapid prototyping of high density circuits
First Claim
1. A method of rapid prototyping a part, the method comprising:
- fabricating a first part layer in a stereolithography apparatus;
registering the first part layer on a direct-write apparatus;
depositing a first trace of direct-write compatible media onto the first part layer;
curing the first trace of direct-write compatible media deposited on the first part layer;
registering the first part layer on the stereolithography apparatus; and
fabricating a second part layer on top of the first part layer.
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Accused Products
Abstract
A preferred embodiment provides, for example, a system and method of integrating fluid media dispensing technology such as direct-write (DW) technologies with rapid prototyping (RP) technologies such as stereolithography (SL) to provide increased micro-fabrication and micro-stereolithography. A preferred embodiment of the present invention also provides, for example, a system and method for Rapid Prototyping High Density Circuit (RPHDC) manufacturing of solderless connectors and pilot devices with terminal geometries that are compatible with DW mechanisms and reduce contact resistance where the electrical system is encapsulated within structural members and manual electrical connections are eliminated in favor of automated DW traces. A preferred embodiment further provides, for example, a method of rapid prototyping comprising: fabricating a part layer using stereolithography and depositing thermally curable media onto the part layer using a fluid dispensing apparatus.
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Citations
10 Claims
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1. A method of rapid prototyping a part, the method comprising:
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fabricating a first part layer in a stereolithography apparatus; registering the first part layer on a direct-write apparatus; depositing a first trace of direct-write compatible media onto the first part layer; curing the first trace of direct-write compatible media deposited on the first part layer; registering the first part layer on the stereolithography apparatus; and fabricating a second part layer on top of the first part layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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Specification