Methods and systems for rapid prototyping of high density circuits

• US 7,419,630 B2
• Filed: 04/22/2005
• Issued: 09/02/2008
• Est. Priority Date: 04/22/2005
• Status: Active Grant

• Current Assignee: National Technology & Engineering Solutions Of Sandia LLC (Honeywell International Inc.)
• Original Assignee: Sandia Corporation (Martin Marietta Corporation)
• Inventors: Chavez, Bart D., Palmer, Jeremy A., Gallegos, Phillip L., Davis, Donald W., Medina, Francisco R., Wicker, Ryan B.
• Primary Examiner(s): Yao; Sam Chuan
• Assistant Examiner(s): Brown, II; David N
• Application Number:
  US10/907,979
• Publication Number:
  US 20060237879A1
• Time in Patent Office: 1,229 Days
• Field of Search: 425/174, 425/375, 264/401, 264/603, 264/255
• US Class Current: 264/401
• CPC Class Codes: B29C 64/112 using individual droplets, e.g. from jetting heads
• CPC Class Codes: B29C 64/135 the energy source being concentrated, e.g. scanning lasers or focused light sources
• CPC Class Codes: B29C 64/40 Structures for supporting 3D objects during manufacture and intended to be sacrificed after completion thereof
• CPC Class Codes: B33Y 10/00 Processes of additive manufacturing
• CPC Class Codes: B33Y 70/00 Materials specially adapted for additive manufacturing

Abstract

A preferred embodiment provides, for example, a system and method of integrating fluid media dispensing technology such as direct-write (DW) technologies with rapid prototyping (RP) technologies such as stereolithography (SL) to provide increased micro-fabrication and micro-stereolithography. A preferred embodiment of the present invention also provides, for example, a system and method for Rapid Prototyping High Density Circuit (RPHDC) manufacturing of solderless connectors and pilot devices with terminal geometries that are compatible with DW mechanisms and reduce contact resistance where the electrical system is encapsulated within structural members and manual electrical connections are eliminated in favor of automated DW traces. A preferred embodiment further provides, for example, a method of rapid prototyping comprising: fabricating a part layer using stereolithography and depositing thermally curable media onto the part layer using a fluid dispensing apparatus.

Claims

1. A method of rapid prototyping a part, the method comprising:

fabricating a first part layer in a stereolithography apparatus;

registering the first part layer on a direct-write apparatus;

depositing a first trace of direct-write compatible media onto the first part layer;

curing the first trace of direct-write compatible media deposited on the first part layer;

registering the first part layer on the stereolithography apparatus; and

fabricating a second part layer on top of the first part layer.

2. The method of claim 1 further comprising curing the first part layer, prior to depositing the direct-write compatible media.

3. The method of claim 1 further comprising creating an electrical interconnect.

4. The method of claim 1 further comprising building three-dimensional (3D) circuits.

5. The method of claim 1, wherein fabricating a second part layer includes encapsulating the direct-write compatible media.

6. The method of claim 1 further comprising:

registering the second part layer on the direct-write apparatus;

depositing a second trace of direct-write compatible media onto the second part layer such that the second trace and the first trace are operatively connected;

curing the second trace of direct-write compatible media;

registering the second part layer in the rapid prototyping apparatus; and

fabricating a third part layer on top of the second part layer.

7. The method of claim 1 further comprising inserting one or more pilot devices into the part.

8. The method of claim 1, wherein the step of curing is accomplished with a device selected from the group consisting of:

a ultraviolet light source, a particle bombarder, a chemical sprayer, a radiation impinger, an ink jet, an oven, a fan, a pump, a curing device, a drying device that incorporates convection, conduction and/or radiation heat transfer and any combination thereof.

9. The method of claim 1, wherein the direct-write compatible media is selected from the group consisting of:

inks, conductive inks, curable inks, curable media, conductive fluids, electronic inks, conductors, insulators, semi-conductive materials, magnetic materials, spin materials, piezoelectric materials, opto-electronic, thermoelectric materials, radio frequency materials, ultraviolet curable resins, controlled reaction materials, precursor fluids, metal-organic liquids, solutions, suspensions, sol-gels, nanoparticles, colloidal fluids, thermoplastics, extrudable materials, thermosets, 2-part epoxy materials and any combination thereof.

10. The method of claim 1, wherein the part layer is fabricated by a material selected from the group consisting of:

a stereolithography resin, a radically polymerizable organic compound, a cationically polymerizable organic compound, a polyether, a polyol compound, an elastomer particle, a curable ink, a photopolymer resin, a photopolymer powdered material, a hydrogel and any combination thereof.