Real-time CMOS imager having stacked photodiodes fabricated on SOI wafer

US 7,419,844 B2
Filed: 03/17/2006
Issued: 09/02/2008
Est. Priority Date: 03/17/2006
Status: Expired due to Fees

First Claim

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1. A method of fabricating a stacked photodiode on a silicon-on-oxide (SOI) wafer, comprising:

preparing a handle wafer, comprising;

preparing a p-type bulk silicon wafer;

implanting and activating a first ion into the p-type silicon layer to form a first N+ layer for a bottom photodiode cathode;

implanting and activating a second ion into the p-type silicon layer on top of the first N+ layer to form a moderately doped p-layer;

forming a layer of p-type epitaxial silicon on the p-type silicon layer and N+ cathode;

implanting and activating a third ion into the p-type epitaxial silicon layer to form a N+ layer for a middle photodiode cathode;

implanting and activating a fourth ion into the p-type epitaxial silicon layer to form a N+ surface layer for a cathode contact for the bottom photodiode;

preparing a donor wafer, comprising;

preparing a silicon donor wafer;

thermally oxidizing the silicon donor wafer to form an oxide layer thereon;

implanting ions to create a defect plane;

preparing the surfaces of the donor wafer and the handle wafer for bonding;

bonding the handle wafer and the donor wafer to form a combined wafer;

curing the combined wafer;

splitting the combined wafer, leaving a top silicon layer on the handle wafer from the donor wafer and burying the oxide layer thereunder as a buried oxide layer, thus forming a silicon-on-oxide structure;

annealing the handle wafer to enhance bonding energy;

forming an N+P junction in the top silicon layer to form a top photodiode cathode;

forming and grounding a P+ region in the top silicon layer to form a top photodiode anode;

opening the buried oxide layer to the N+ cathode of the middle photodiode and the bottom photodiode;

fabricating pixel transistor(s) on the top silicon layer for each photodiode; and

fabricating a CMOS peripheral control circuit.

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Abstract

A CMOS active pixel sensor includes a silicon-on-insulator substrate having a silicon substrate with an insulator layer formed thereon and a top silicon layer formed on the insulator layer. A stacked pixel sensor cell includes a bottom photodiode fabricated on the silicon substrate, for sensing light of a longest wavelength; a middle photodiode fabricated on the silicon substrate, for sensing light of a medium wavelength, which is stacked above the bottom photodiode; and a top photodiode fabricated on the top silicon layer, for sensing light of a shorter wavelength, which is stacked above the middle and bottom photodiodes. Pixel transistor sets are fabricated on the top silicon layer and are associated with each pixel sensor cell by electrical connections which extend between each of the photodiodes and respective pixel transistor(s). CMOS control circuitry is fabricated adjacent to an array of active pixel sensor cells and electrically connected thereto.

236 Citations

23 Claims

1. A method of fabricating a stacked photodiode on a silicon-on-oxide (SOI) wafer, comprising:
- preparing a handle wafer, comprising;
  
  preparing a p-type bulk silicon wafer;
  
  implanting and activating a first ion into the p-type silicon layer to form a first N+ layer for a bottom photodiode cathode;
  
  implanting and activating a second ion into the p-type silicon layer on top of the first N+ layer to form a moderately doped p-layer;
  
  forming a layer of p-type epitaxial silicon on the p-type silicon layer and N+ cathode;
  
  implanting and activating a third ion into the p-type epitaxial silicon layer to form a N+ layer for a middle photodiode cathode;
  
  implanting and activating a fourth ion into the p-type epitaxial silicon layer to form a N+ surface layer for a cathode contact for the bottom photodiode;
  
  preparing a donor wafer, comprising;
  
  preparing a silicon donor wafer;
  
  thermally oxidizing the silicon donor wafer to form an oxide layer thereon;
  
  implanting ions to create a defect plane;
  
  preparing the surfaces of the donor wafer and the handle wafer for bonding;
  
  bonding the handle wafer and the donor wafer to form a combined wafer;
  
  curing the combined wafer;
  
  splitting the combined wafer, leaving a top silicon layer on the handle wafer from the donor wafer and burying the oxide layer thereunder as a buried oxide layer, thus forming a silicon-on-oxide structure;
  
  annealing the handle wafer to enhance bonding energy;
  
  forming an N+P junction in the top silicon layer to form a top photodiode cathode;
  
  forming and grounding a P+ region in the top silicon layer to form a top photodiode anode;
  
  opening the buried oxide layer to the N+ cathode of the middle photodiode and the bottom photodiode;
  
  fabricating pixel transistor(s) on the top silicon layer for each photodiode; and
  
  fabricating a CMOS peripheral control circuit.
- View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
- - 2. The method of claim 1 wherein said fabricating a CMOS peripheral control circuit includes fabricating a CMOS peripheral control circuit on the top silicon layer.
  - 3. The method of claim 2 wherein said fabricating a CMOS peripheral control circuit on the top silicon layer includes thinning the top silicon layer before said fabricating a CMOS peripheral control circuit.
  - 4. The method of claim 1 wherein said fabricating a CMOS peripheral control circuit includes fabricating the CMOS peripheral control circuit on bulk silicon.
  - 5. The method of claim 4 wherein, said fabricating a CMOS peripheral control circuit includes removing the top silicon layer and buried oxide layer, and fabricating the CMOS peripheral control circuit on bulk silicon.
  - 6. The method of claim 1 wherein said implanting and activating a first and third ion into the p-type silicon layer to form a N+ layer includes implanting arsenic or phosphorus ions to a density of between about 1×
    - 10¹⁶cm^−
      
      3to 1×
      
      10²⁰cm^−
      
      3.
  - 7. The method of claim 1 wherein said implanting and activating a second ion into the p-type silicon layer includes implanting boron ions to form a moderately doped p-type layer having a doping density of between about 1×
    - 10¹⁶cm^−
      
      3to 5×
      
      10¹⁸cm^−
      
      3.
  - 8. The method of claim 1 wherein said implanting ions in the donor wafer to create a defect plane includes implanting ions taken from the group of ions consisting of H₂+, H+, Ar+, He+ or Ne+ ions to a depth of between about 0.3 μ
    - m to 1 μ
      
      m below the Si/SiO₂interface, at a dose density of between about 5×
      
      10¹⁵cm^−
      
      2to 5×
      
      10¹⁶cm^−
      
      2.
  - 9. The method of claim 8 wherein said implanting and activating a first and third ion into the p-type silicon layer to form a N+ layer includes implanting arsenic or phosphorus ions to a density of between about 1×
    - 10¹⁶cm^−
      
      3to 1×
      
      10²⁰cm^−
      
      3.
  - 10. The method of claim 8 wherein said implanting and activating a second ion into the p-type silicon layer includes implanting boron ions to form a moderately doped p-type layer having a doping density of between about 1×
    - 10¹⁶cm^−
      
      3to 5×
      
      10¹⁸cm^−
      
      3.
  - 11. The method of claim 1 wherein the bottom photodiode is sensitive to light having a wavelength of between about 600 nm to 750 nm;
    - the middle photodiode is sensitive to light having a wavelength of between about 500 nm to 600 nm; and
      
      the top photodiode is sensitive to light having a wavelength of between about 300 nm to 500 nm.
  - 12. The method of claim 1 which includes forming a layer of thermally grown silicon oxide on the handle wafer.

13. A method of fabricating a stacked photodiode on a silicon-on-oxide (SOI) wafer, comprising:
- preparing a handle wafer, comprising;
  
  preparing a bulk silicon wafer, preparing a bulk silicon wafer, of a p-type having a boron doping density of between about 1×
  
  10¹⁴to 2×
  
  10¹⁵;
  
  implanting and activating a first ion into the p-type silicon layer to form a N+ layer for a bottom photodiode cathode;
  
  implanting and activating a second ion into the p-type silicon layer on top of the first N+ layer to form a moderately doped p-layer;
  
  forming a layer of p-type epitaxial silicon on the p-type silicon layer and N+ cathode;
  
  implanting and activating a third ion into the p-type epitaxial silicon layer to form a N+ layer for a middle photodiode cathode;
  
  implanting and activating a fourth ion into the p-type epitaxial silicon layer to form a N+ surface layer for a cathode contact for the bottom photodiode;
  
  preparing a donor wafer, comprising;
  
  preparing a silicon donor wafer;
  
  thermally oxidizing the silicon donor wafer to form an oxide layer thereon;
  
  implanting ions to create a defect plane;
  
  preparing the surfaces of the donor wafer and the handle wafer for bonding;
  
  bonding the handle wafer and the donor wafer to form a combined wafer;
  
  curing the combined wafer;
  
  splitting the combined wafer, leaving a top silicon layer on the handle wafer from the donor wafer and burying the oxide layer thereunder as a buried oxide layer, thus forming a silicon-on-oxide structure;
  
  annealing the handle wafer to enhance bonding energy;
  
  forming an N+P junction in the top silicon layer to form a top photodiode cathode;
  
  forming and grounding a P+ region in the top silicon layer to form a top photodiode anode;
  
  opening the buried oxide layer to the N+ cathode of the middle photodiode and the bottom photodiode;
  
  fabricating pixel transistor(s) on the top silicon layer for each photodiode;
  
  removing the exposed top silicon layer and buried oxide layer; and
  
  fabricating CMOS peripheral circuits on the bulk silicon substrate.
- View Dependent Claims (14, 15, 16)
- - 14. The method of claim 13 wherein said implanting ions in the donor wafer to create a defect plane includes implanting ions taken from the group of ions consisting of H₂+, H+, Ar+, He+ or Ne+ ions to a depth of between about 0.3 μ
    - m to 1 μ
      
      m below the Si/SiO₂interface, at a dose density of between about 5×
      
      10¹⁵cm^−
      
      2to 5×
      
      10¹⁶cm^−
      
      2.
  - 15. The method of claim 13 wherein the bottom photodiode is sensitive to light having a wavelength of between about 600 nm to 750 nm;
    - the middle photodiode is sensitive to light having a wavelength of between about 500 nm to 600 nm; and
      
      the top photodiode is sensitive to light having a wavelength of between about 300 nm to 500 nm.
  - 16. The method of claim 13 which includes forming a layer of thermally grown silicon oxide on the handle wafer.

17. A method of fabricating a stacked photodiode on a silicon-on-oxide (SOI) wafer, comprising:
- preparing a handle wafer, comprising;
  
  preparing a p-type bulk silicon wafer;
  
  implanting and activating a first ion into the p-type silicon layer to form a N+ layer for a bottom photodiode cathode;
  
  implanting and activating a second ion into the p-type silicon layer on top of the first N+ layer to form a moderately doped p-layer;
  
  forming a layer of p-type epitaxial silicon on the p-type silicon layer and N+ cathode;
  
  implanting and activating a third ion into the p-type epitaxial silicon layer to form a N+ layer for a middle photodiode cathode;
  
  implanting and activating a fourth ion into the p-type epitaxial silicon layer to form a N+ surface layer for a cathode contact for the bottom photodiode;
  
  preparing a donor wafer, comprising;
  
  preparing a silicon donor wafer;
  
  thermally oxidizing the silicon donor wafer to form an oxide layer thereon;
  
  implanting ions in the donor wafer to create a defect plane;
  
  preparing the surfaces of the donor wafer and the handle wafer for bonding;
  
  bonding the handle wafer and the donor wafer to form a combined wafer;
  
  curing the combined wafer;
  
  splitting the combined wafer, leaving a top silicon layer on the handle wafer from the donor wafer and burying the oxide layer thereunder as a buried oxide layer, thus forming a silicon-on-oxide structure;
  
  annealing the handle wafer to enhance bonding energy;
  
  forming an N+P junction in the top silicon layer to form a top photodiode cathode;
  
  forming and grounding a P+ region in the top silicon layer to form a top photodiode anode;
  
  opening the buried oxide layer to the N+ cathode of the middle photodiode and the bottom photodiode;
  
  fabricating pixel transistors on the top silicon layer for each photodiode; and
  
  fabricating CMOS peripheral circuits on the top silicon layer.
- View Dependent Claims (18, 19, 20, 21, 22, 23)
- - 18. The method of claim 17 wherein said fabricating a CMOS peripheral control circuit on the top silicon layer includes thinning the top silicon layer before said fabricating a CMOS peripheral control circuit.
  - 19. The method of claim 17 wherein said implanting and activating a first and thirds ion into the p-type silicon layer to form a N+ layer includes implanting arsenic or phosphorus ions to a density of between about 1×
    - 10¹⁶cm^−
      
      3to 1×
      
      10²⁰cm^−
      
      3.
  - 20. The method of claim 17 wherein said implanting and activating a second ion into the p-type silicon layer includes implanting boron ions to form a moderately doped p-type layer having a doping density of between about 1×
    - 10¹⁶cm^−
      
      3to 5×
      
      10¹⁸cm^−
      
      3.
  - 21. The method of claim 17 wherein said implanting ions in the donor wafer to create a defect plane includes implanting ions taken from the group of ions consisting of H₂+, H+, Ar+, He+ or Ne+ ions to a depth of between about 0.3 μ
    - m to 1 μ
      
      m below the Si/SiO₂interface, at a dose density of between about 5×
      
      10¹⁵cm^−
      
      2to 5×
      
      10¹⁶cm^−
      
      2.
  - 22. The method of claim 17 wherein the bottom photodiode is sensitive to light having a wavelength of between about 600 nm to 750 nm;
    - the middle photodiode is sensitive to light having a wavelength of between about 500 nm to 600 nm; and
      
      the top photodiode is sensitive to light having a wavelength of between about 300 nm to 500 nm.
  - 23. The method of claim 17 which includes forming a layer of thermally grown silicon oxide on the handle wafer.

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Current Assignee
Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
Original Assignee
Sharp Laboratories of America Incorporated (Hon Hai Precision Industry Co., Ltd.)
Inventors
Hsu, Sheng Teng, Tweet, Douglas J., Maa, Jer-shen, Lee, Jong-Jan
Primary Examiner(s)
Huynh, Andy

Application Number

US11/384,110
Publication Number

US 20070218578A1
Time in Patent Office

900 Days
Field of Search

438/48, 257/291, 257/292, 257/E27.133, 257/E27.134
US Class Current

438/48
CPC Class Codes

H01L 27/14647 Multicolour imagers having ...

Real-time CMOS imager having stacked photodiodes fabricated on SOI wafer

First Claim

2 Assignments

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Abstract

236 Citations

23 Claims

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Real-time CMOS imager having stacked photodiodes fabricated on SOI wafer

First Claim

2 Assignments

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0 Petitions

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Accused Products

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Abstract

236 Citations

23 Claims

Specification

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Solutions

Use Cases

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