Connection structure for connecting semiconductor element and wiring board, and semiconductor device

• US 7,420,282 B2
• Filed: 10/17/2005
• Issued: 09/02/2008
• Est. Priority Date: 10/18/2004
• Status: Active Grant

• Current Assignee: Shenzhen Torey Microelectronic Technology Co., Ltd.
• Original Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Inventors: Nakamura, Nakae, Iwane, Tomohiko
• Primary Examiner(s): CLARK, SHEILA V
• Application Number:
  US11/250,513
• Publication Number:
  US 20060081999A1
• Time in Patent Office: 1,051 Days
• Field of Search: 257/778, 257/698, 257/700, 257/701, 257/779, 257/786, 257/693, 257/666, 257/690, 257/784
• US Class Current: 257/778
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16237 the bump connector connecting to a bonding area disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73203 Bump and layer connectors
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 23/49838 Geometry or layout
• CPC Class Codes: H01L 23/4985 Flexible insulating substrates H01L23/49572 and H01L23/49855 take precedence
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01025 Manganese [Mn]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/0105 Tin [Sn]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H05K 2201/10674 : Flip chip
• CPC Class Codes: H05K 3/3452 : Solder masks

Abstract

In a connection structure of the present invention, the wiring board including a solder resist covering part which covers the wiring pattern with solder resist, the solder resist covering part having a solder resist opening or solder resist openings which expose(s) the wiring board connection terminals therethrough, and the solder resist opening or the solder resist openings surrounding at least one part of the solder resist covering part. Therefore, the wiring patterns are not unnecessarily exposed. That is, without disadvantageous contact between each wiring pattern and the semiconductor element, the semiconductor element can be mounted on the wiring board, and thus, the semiconductor device is reliable.

Claims

1. A connection structure for electrically connecting a plurality of semiconductor element connection terminals of a semiconductor element with a plurality of wiring board connection terminals of a wiring pattern provided on a wiring board,

the wiring patter including:

a plurality of inner leads respectively having the wiring board connection terminals, and outer leads respectively connected to the inner leads,

each end of the inner leads opposite to another ends which are connected with the outer leads aligning along an outer circumference of an area where the semiconductor element is mounted, and

the wiring board including;

a solder resist covered peripheral part which covers the inner leads with solder resist, and a solder resist covered center part which covers the area where the semiconductor element is mounted with the solder resist,

the solder resist covered peripheral part having a solder resist opening/solder resist openings which expose(s) the wiring board connection terminals respectively provided at the ends of the inner leads which are opposite to the another ends connected with the outer leads, and

the solder resist covered center part covering the ends of the inner leads which are opposite to the another ends connected with the outer leads.

2. The connection structure as set forth in claim 1, wherein a surface of each semiconductor element connection terminal and a surface of each wiring board connection terminal are respectively made from gold.

3. The connections structure as set forth in claim 1, wherein the surface of each semiconductor element connection terminal and the surface of each wiring board connection terminal are respectively made from tin and from gold, or vice versa.

4. The connection structure as set forth in claim 1, wherein the solder resist opening/the solder resist openings is/are sealed with an insulating resin.

5. The connection structure as set forth in claim 1, wherein at least one surface of the semiconductor element which faces the wiring board except the semiconductor element connection terminals is covered with an insulating layer.

6. The connection structure as set forth in claim 1, wherein at least one of distances from a boundary between the solder resist and each solder resist opening to a part of the wiring board connection terminal faced to the corresponding semiconductor element connection terminal is about 0.01 to 0.15 mm.

7. The connection structure as set forth in claim 1, wherein the solder resist opening/the solder resist openings expose(s) the plurality of wiring board connection terminals therethrough.

8. The connection structure as set forth in claim 1, wherein each wiring board connection terminal of the inner leads and a surface of the wiring board which is adjacent to the corresponding wiring board connection terminal are exposed through the solder resist opening(s).

9. The connection structure as set forth in claim 1, wherein each wiring board connection terminal of the inner leads and each surface of the wiring board which is adjacent to the corresponding wiring board connection terminals are exposed through the solder resist opening(s).

10. A wiring board for mounting a semiconductor element thereon, the wiring board comprising:

an insulating substrate;

a wiring pattern provided on the insulating substrate,

the wiring pattern including a plurality of inner leads respectively having wiring board connection terminals of the wiring pattern, and outer leads respectively connected with the inner leads, each end of the inner leads opposite to another ends which are connected with the outer leads aligning along an outer circumference of an area where the semiconductor element is mounted;

a solder resist covered peripheral part which covers the inner leads with solder resist; and

a solder resist covered center part, which is on the insulating substrate and covers the area where the semiconductor element is mounted with the solder resist, the solder resist covered peripheral part having a solder resist opening/solder resist openings which expose(s) the wiring board connection terminals respectively provided at the ends of the inner leads which are opposite to the another ends connected with the outer leads, and the solder resist covered center part covering the ends of the inner leads which are opposite to the another ends connected with the outer leads.

11. The wiring board as set forth in claim 10, wherein at least one of the distances from a boundary between the solder resist and each solder resist opening to a part of the wiring board connection terminal faced to the corresponding semiconductor element connection terminal is about 0.01 to 0.15 mm.

12. The wiring board as set forth in claim 10, wherein the solder resist opening/the solder resist openings expose(s) the plurality of wiring board connection terminals therethrough.

13. The wiring board as set forth in claim 10, wherein each wiring board connection terminal of the inner leads and a surface of the wiring board which is adjacent to the corresponding wiring board connection terminal are exposed through the solder resist opening(s).

14. The wiring board as set forth in claim 10, wherein the inner lead(s) exposed through the solder resister opening(s) include(s) a part connected with the semiconductor element connection terminals and a part not connected with the semiconductor element connection terminals, and

a length of the part connected with the semiconductor element connection terminals is equal to or longer than the part not connected with the semiconductor element connection terminals.

15. A semiconductor device, wherein a semiconductor element is mounted on the wiring board as set forth in claim 10.

16. A semiconductor device, wherein a semiconductor element is mounted on the wiring board as set forth in claim 14.