Transformer isolator for digital power supply
First Claim
Patent Images
1. A system for providing voltage isolation, comprising:
- a first chip containing functional circuitry;
a second chip containing functional circuitry;
at least one RF isolation link interconnecting the first and the second chip, the RF isolation link providing voltage isolation between the first chip and the second chip, wherein the RF isolation link further comprises;
a first transformer on the first chip;
a second transformer on the second chip;
a transmitter associated with the first transformer for transmitting an RF carrier onto the RF isolation link;
a receiver associated with the second transformer for receiving an RF carrier onto the RF isolation link.
2 Assignments
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Accused Products
Abstract
A system for providing voltage isolation includes the first and second chips, each containing functional circuitry. The chips are interconnected via at least one RF isolation link that provides voltage isolation between the first chip and the second chip.
161 Citations
49 Claims
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1. A system for providing voltage isolation, comprising:
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a first chip containing functional circuitry; a second chip containing functional circuitry; at least one RF isolation link interconnecting the first and the second chip, the RF isolation link providing voltage isolation between the first chip and the second chip, wherein the RF isolation link further comprises; a first transformer on the first chip; a second transformer on the second chip; a transmitter associated with the first transformer for transmitting an RF carrier onto the RF isolation link; a receiver associated with the second transformer for receiving an RF carrier onto the RF isolation link. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A system for providing voltage isolation, comprising:
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a first chip containing functional circuitry; a second chip containing functional circuitry; and at least one RF isolation link interconnecting the first and the second chip, the RF isolation link providing voltage isolation between the first chip and the second clip, wherein the RF isolation link further comprises; a first transformer on the first chip; a second transformer on the second chip; a first transceiver circuitry associated with the first transformer for transmitting and receiving an RF carrier onto the at least one RF isolation link; second transceiver circuitry associated with the second transformer for transmitting and receiving an RF carrier onto the at least one RF isolation link.
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12. An apparatus for providing voltage isolation, comprising:
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a chip containing functional circuitry; and a portion of at least one RF isolation link interconnecting the chip with an external chip and the second chip, the RF isolation link providing voltage isolation between the chip and the external chip, wherein the portion of the at least one RF isolation link comprises; a transmitter responsive to a logical data signal and an RF carrier signal for generating a transmitter output; and an integrated transformer for electromagnetically coupling the transmitter output onto an external link providing a connection to a second integrated transformer and associated receiver on a second chip. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19)
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20. A system for providing voltage isolation, comprising:
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a first chip containing functional circuitry, said first chip including; a first transmitter responsive to a logical data signal and an RF carrier signal for generating a transmitter output, wherein the transmitter outputs the RF carrier as the transmitter output responsive to a logical “
1”
logical data signal and shuts down the RF carrier as the transmitter output responsive to a logical “
0”
logical data signal;a first amplifier stage for amplifying a received signal; a first detector coupled to the amplifier stage for detecting the presence or absence of the RF carrier signal in an amplified received signal from the amplifier stage, wherein the presence of the RF carrier signal indicates a received logical “
1” and
the absence of the RF carrier signal indicates a logical “
0;
”a first transformer for electromagnetically coupling the transmitter to an external link and for electromagnetically coupling the external link to the amplifier stage; a second chip containing functional circuitry; a second transmitter responsive to a logical data signal and an RF carrier signal for generating a transmitter output, wherein the transmitter outputs the RF carrier as the transmitter output responsive to a logical “
1”
logical data signal and shuts down the RE carrier as the transmitter output responsive to a logical “
0”
logical data signal;a second amplifier stage for amplifying a received signal; a second detector coupled to the amplifier stage for detecting the presence or absence of the RF carrier signal in an amplified received signal from the amplifier stage, wherein the presence of the RF carrier signal indicates a received logical “
1” and
the absence of the RF carrier signal indicates a logical “
0;
”a second transformer for electromagnetically coupling the transmitter to an external link and for electromagnetically coupling the external link to the amplifier stage; and wherein the first transformer and the second transformer provide voltage isolation between the first chip and the second chip. - View Dependent Claims (21, 22)
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23. A system for providing voltage isolation, comprising:
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a chip containing functional circuitry, said first chip including; a transmitter responsive to a logical data signal and an RF carrier signal for generating a transmitter output, wherein the transmitter outputs the RF carrier as the transmitter output responsive to a logical “
1”
logical data signal and shuts down the RF carrier as the transmitter output responsive to a logical “
0”
logical data signal;a first transformer for electromagnetically coupling the transmitter to an external link; a second chip containing functional circuitry; an amplifier stage for amplifying a received signal on the external link; a receiver coupled to the amplifier stage for detecting the presence or absence of the RF carrier signal in an amplified received signal from the amplifier stage, wherein the presence of the RF carrier signal indicates a received logical “
1” and
the absence of the RF carrier signal indicates a logical “
0;
”a second transformer for electromagnetically coupling the received signal on the external link to the amplifier stage; and wherein the first transformer and the second transformer provide voltage isolation between the first chip and the second chip. - View Dependent Claims (24, 25)
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26. A system of a circuit package, comprising:
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a first die containing functional circuitry; a second die containing functional circuitry; and at least one RF isolation link interconnecting the first and the second die, the RF isolation link providing voltage isolation between the first die and the second die, wherein the RF isolation link further comprises; a first transformer on the first die; a second transformer on the second die; a transmitter associated with the first transformer for transmitting an RF carrier onto the RF isolation link; a receiver associated with the second transformer for receiving an RF carrier onto the RF isolation link. - View Dependent Claims (27, 28, 29, 30, 31, 32, 33, 34)
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35. A circuit package, comprising:
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a first die containing functional circuitry; a second die containing functional circuitry; and at least one RF isolation link interconnecting the first and the second die, the RF isolation link providing voltage isolation between the first die and the second die, wherein the RF isolation link further comprises; a first transformer on the first chip; a second transformer on the second chip; first transceiver circuitry associated with the first transformer for transmitting and receiving an RF carrier onto the at least one RF isolation link; second transceiver circuitry associated with the second transformer for transmitting and receiving an RF carrier onto the at least one RF isolation link.
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36. An integrated circuit with high voltage isolation interface, comprising:
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a semiconductor substrate; a functional circuit integrally formed on said substrate for processing at least a single bit of digital data; an isolator integrally formed on said substrate for interfacing with said functional circuit for allowing external data from a potentially high voltage circuit relative to said functional circuit to be input across said isolator to said functional circuit or for allowing data to be output from said functional circuit across said isolator to said potentially high voltage circuit, wherein said isolator comprises; a first conductive element formed on said semiconductor substrate and conducively interfaced with said functional circuit; a second conductive element formed on said semiconductor substrate and providing a conductive interface to the exterior of said semiconductor substrate; and said first conductive element electrically isolated from said second conductive element to allow only electromagnetic coupling there between, such that a portion of the electromagnetic spectral energy can be coupled there across. - View Dependent Claims (37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49)
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Specification