Method of singulating electronic devices
First Claim
Patent Images
1. A method of singulating electronic devices, comprising:
- aligning a saw blade over a lid street disposed on a lid substrate, said lid substrate disposed over a device substrate having an electronic device disposed on said device substrate, said electronic device having a bond pad, wherein said lid street is disposed over said bond pad;
bonding said lid substrate to said electronic device substrate utilizing a gas plasma treatment on a surface of a lid bond ring surface and/or a device bond ring surface;
sawing partially through said lid street to form a trench in said lid street after said lid substrate is bonded to said electronic device substrate, said trench having a trench bottom in said lid substrate; and
subsequently removing said trench bottom by exposing said lid substrate and said trench bottom to a blanket etch whereby said bond pad is exposed and said lid street is formed.
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Abstract
A method of singulating electronic devices, including aligning a saw blade over a lid street disposed on a lid substrate that is disposed over a device substrate. An electronic device that includes a bond pad is disposed on the device substrate, wherein the lid street is disposed over the bond pad. In addition, the method also includes sawing partially through the lid street to form a trench in the lid street. The trench includes a trench bottom in the lid substrate.
32 Citations
31 Claims
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1. A method of singulating electronic devices, comprising:
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aligning a saw blade over a lid street disposed on a lid substrate, said lid substrate disposed over a device substrate having an electronic device disposed on said device substrate, said electronic device having a bond pad, wherein said lid street is disposed over said bond pad; bonding said lid substrate to said electronic device substrate utilizing a gas plasma treatment on a surface of a lid bond ring surface and/or a device bond ring surface; sawing partially through said lid street to form a trench in said lid street after said lid substrate is bonded to said electronic device substrate, said trench having a trench bottom in said lid substrate; and subsequently removing said trench bottom by exposing said lid substrate and said trench bottom to a blanket etch whereby said bond pad is exposed and said lid street is formed. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A method of singulating electronic devices, comprising:
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step for bonding a lid substrate to a device substrate utilizing a gas plasma treatment on a surface of a lid bond ring surface and/or a device bond ring surface, said lid substrate disposed over said device substrate, said device substrate having an electronic device disposed on said device substrate, said electronic device having a bond pad; step for aligning a saw blade over a lid street disposed in said lid substrate; step for sawing partially through said lid street to form a trench in said lid street after said lid substrate is bonded to said electronic device substrate, said trench having a trench bottom in said lid substrate; and step for removing said trench bottom by exposing said lid substrate and said trench bottom to a blanket etch whereby said bond pad is exposed and said lid street is formed. - View Dependent Claims (19, 20)
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21. A method, comprising:
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aligning a lid wafer to a device wafer, said lid wafer having a plurality of lids disposed thereon and a plurality of lid street regions disposed between said plurality of lids, said device wafer having a plurality of devices disposed thereon, each device having a plurality of bond pads disposed around a periphery of said device, wherein said plurality of lid street regions are disposed over said plurality of bond pads; bonding said lid wafer to said device wafer; sawing partially through said lid wafer to form a trench in said lid street region after bonding said lid wafer to said device wafer, said trench having a trench bottom; and subsequently removing said trench bottom by exposing said lid substrate and said trench bottom to a blanket etch whereby said bond pad is exposed and said lid street is formed. - View Dependent Claims (22, 23)
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24. A method of singulating electronic devices, comprising:
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bonding a lid substrate to a device substrate utilizing a gas plasma treatment on a surface of a lid bond ring surface and/or a device bond ring surface, said lid substrate having at least one lid street disposed thereon, said device substrate having two or more electronic devices disposed thereon, each device having a bond pad, wherein said at least one lid street is disposed over said bond pad; sawing partially through said lid street toward a lid bonding surface to form a trench in said lid street, said trench having a trench bottom in said lid substrate; and subsequently removing said trench bottom by exposing said lid substrate and said trench bottom to a blanket lid material removal process whereby said bond pad is exposed. - View Dependent Claims (25, 26, 27, 28, 29, 30)
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31. A method of singulating electronic devices, comprising:
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aligning a saw blade over a lid substrate, said lid substrate bonded to a device substrate having an electronic device disposed on said device substrate, said electronic device having a bond pad; sawing partially through said lid substrate toward a lid bonding surface to form a trench in said lid substrate, said trench having a trench bottom in said lid substrate, wherein a lid street is partially formed, said lid street disposed over said bond pad; subsequently removing said trench bottom by exposing said lid substrate and said trench bottom to a blanket etch whereby said bond pad is exposed and said lid street is formed.
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Specification