Immersion exposure method and apparatus, and manufacturing method of a semiconductor device
First Claim
1. An immersion exposure method of carrying out an exposure process in a state that liquid is at least partly filled between a substrate to be exposed and a projection optical system of an exposure apparatus to carry out the exposure process, comprising:
- carrying out a process of making a large contact angle between the liquid and at least an outer peripheral portion of a main surface of the substrate when compared with a contact angle between the liquid and an area adjacent to the outer peripheral portion of the substrate, the area being a part of a surface of a substrate supporting side of a substrate support member to support the substrate included in the exposure apparatus; and
carrying out the exposure process.
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Accused Products
Abstract
There is disclosed an immersion exposure method of carrying out an exposure process in a state that liquid is at least partly filled between a substrate to be exposed and a projection optical system of an exposure apparatus carrying out the exposure process, comprising carrying out a process of making large a contact angle to the liquid with at least outer peripheral portion of a main surface of the substrate compared with a contact angle to the liquid with an area adjacent to the outer peripheral portion of the substrate, which area is a part of a surface of a substrate supporting side of a substrate support member supporting the substrate included in the exposure apparatus, and carrying out the exposure process.
18 Citations
20 Claims
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1. An immersion exposure method of carrying out an exposure process in a state that liquid is at least partly filled between a substrate to be exposed and a projection optical system of an exposure apparatus to carry out the exposure process, comprising:
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carrying out a process of making a large contact angle between the liquid and at least an outer peripheral portion of a main surface of the substrate when compared with a contact angle between the liquid and an area adjacent to the outer peripheral portion of the substrate, the area being a part of a surface of a substrate supporting side of a substrate support member to support the substrate included in the exposure apparatus; and carrying out the exposure process. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. An immersion exposure method of carrying out an exposure process in a state that liquid is at least partly filled between a substrate to be exposed and a projection optical system of an exposure apparatus to carry out the exposure process, comprising:
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providing an absorption layer contacting with the liquid at a first angle on a main surface of a side to be exposed of the substrate; providing a resist layer on the absorption layer and on a surface facing the projection optical system; providing a top coat layer contacting with the liquid at a second angle and covering the resist layer, the top coat layer being provided on the surface facing the projection optical system; supporting the substrate provided with the absorption layer, the resist layer, and the top coat layer by a substrate support member included in the exposure apparatus, and providing an auxiliary member contacting with the liquid at an angle smaller than the first angle at an area adjacent to the outer peripheral portion of the substrate, the area being a part of a surface layer of the substrate supporting side of the substrate support member; carrying out the exposure process with respect to the substrate; and developing a pattern exposed to the resist layer by the exposure process. - View Dependent Claims (9, 10, 11)
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12. An immersion exposure apparatus, comprising:
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a substrate support member to support a substrate which is exposed to a pattern by an exposure process; and a projection optical system to project the pattern to the substrate, wherein the apparatus is configured to carry out the exposure process after carrying out a process of making a large contact angle between the liquid and at least an outer peripheral portion of a main surface of the substrate when compared with a contact angle between the liquid and an area adjacent to the outer peripheral portion of the substrate, the area being a part of a surface of a substrate supporting side of a substrate support member to support the substrate included in the exposure apparatus; and the apparatus carrying out the exposure process in a state that liquid is at least partly filled between the substrate and the projection optical system, and a surface outside the outer peripheral portion of the substrate supported by the substrate support member, the surface being a part of a surface of a substrate supporting side of the substrate support member, is set to a state that a contact angle of the liquid becomes small continuously or intermittently from the outer peripheral portion of the substrate toward the surface outside the outer peripheral portion. - View Dependent Claims (13, 14)
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15. A manufacturing method of a semiconductor device, carrying out an exposure process in a state that liquid is at least partly filled between a semiconductor substrate to be exposed and a projection optical system of an exposure apparatus carrying out the exposure process, comprising:
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carrying out a process of making a large contact angle between the liquid and at least an outer peripheral portion of a main surface of the semiconductor substrate when compared with a contact angle between the liquid and an area adjacent to the outer peripheral portion of the semiconductor substrate, the area being a part of a surface of a substrate supporting side of a substrate support member to support the semiconductor substrate included in the exposure apparatus; and forming a pattern on the main surface of the semiconductor substrate by carrying out the exposure process. - View Dependent Claims (16, 17, 18)
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19. A manufacturing method of a semiconductor device, carrying out an exposure process in a state that liquid is at least partly filled between a semiconductor substrate to be exposed and a projection optical system of an exposure apparatus to carry out the exposure process, comprising:
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forming an absorption layer contacting with the liquid at a first angle on a main surface of a side to be exposed of the semiconductor substrate; providing a resist layer on the absorption layer and on a surface facing the projection optical system; providing a top coat layer contacting with the liquid at a second angle and covering the resist layer, the top coat layer being provided on the surface facing the projection optical system; supporting the semiconductor substrate provided with the absorption layer, the resist layer, and the top coat layer by a substrate support member included in the exposure apparatus, and providing an auxiliary member contacting with the liquid at an angle smaller than the first angle at an area adjacent to the outer peripheral portion of the semiconductor substrate, the area being a part of a surface layer of the substrate supporting side of the substrate support member; exposing a pattern onto the resist layer by carrying out the exposure process with respect to the semiconductor substrate; and forming the pattern on the main surface of the semiconductor substrate by developing the pattern. - View Dependent Claims (20)
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Specification