Arrangement and method for cooling a power semiconductor

• US 7,423,881 B2
• Filed: 02/21/2006
• Issued: 09/09/2008
• Est. Priority Date: 02/24/2005
• Status: Expired due to Fees

• Current Assignee: Oce Printing Systems GmbH (Canon Inc.)
• Original Assignee: Oce Printing Systems GmbH (Canon Inc.)
• Inventors: Eibl, Martin
• Primary Examiner(s): Thompson; Gregory D
• Application Number:
  US11/358,514
• Publication Number:
  US 20060187695A1
• Time in Patent Office: 931 Days
• Field of Search: None
• US Class Current: 361/719
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/0203 Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 2201/09309 Core having two or more power planes; Capacitive laminate of two power planes
• CPC Class Codes: H05K 2201/10015 Non-printed capacitor
• CPC Class Codes: H05K 2201/10022 Non-printed resistor
• CPC Class Codes: H05K 2201/1003 Non-printed inductor
• CPC Class Codes: H05K 2201/10166 Transistor
• CPC Class Codes: H05K 2201/10174 Diode
• CPC Class Codes: H05K 2201/10522 Adjacent components
• CPC Class Codes: H05K 7/209 Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20909 takes precedence

Abstract

In an arrangement and a method for cooling a power semiconductor in which at least one power semiconductor is electrically and thermally conductively connected to at least one passive electric component. Further, a cooling element is thermally conductively connected to at least a part of the surface of the passive electrical component and/or the electrically and thermally conductive connection.

Claims

1. An arrangement for cooling a power semiconductor, comprising:

at least one power semiconductor and at least one passive electrical component;

at least one electrical terminal of the power semiconductor being thermally connected to an electrical terminal of the passive electrical component via an electrical connection; and

a cooling element thermally directly connected to at least a part of a surface of the passive electrical component but only indirectly thermally connected to said power semiconductor through said electrical connection.

2. The arrangement according to claim 1 wherein the electrically conductive connection between the electrical terminal of the power semiconductor and the electrical terminal of the passive electrical component is established with a circuit board conductor of a printed circuit.

3. The arrangement according to claim 2 wherein the power semiconductor and the passive electrical component are directly arranged on the printed circuit for establishing at least the electrical connection between the power semiconductor and the passive electrical component.

4. The arrangement according to claim 2 wherein the circuit board conductor electrically connects the power semiconductor to the passive electrical component as well as thermally connects the power semiconductor to the passive electrical component.

5. The arrangement according to claim 1 wherein the passive electrical component comprises an inductor, a capacitor, or an ohmic resistor.

6. The arrangement according to claim 1 wherein said cooling element is designed to dissipate heat of both the power semiconductor and the passive component If the passive component is generating heat.

7. The arrangement according to claim 1 wherein an electric power loss of the power semiconductor is higher than an electric power loss of the passive electrical component.

8. The arrangement according to claim 1 wherein the cooling element comprises a cooling body formed of an aluminum extruded section.

9. The arrangement according to claim 1 wherein the cooling element comprises a Peltier element or a semiconductor cooling element.

10. The arrangement according to claim 1 wherein between a part of the surface of the passive electrical component and the cooling element a thermally conductive leveling layer is arranged as said direct thermal connection.

11. The arrangement according to claim 1 wherein at least the power semiconductor is a component which is mounted on a surface of a circuit board.

12. The arrangement according to claim 1 wherein the electrical connection is established with aid of a low-ohmic circuit board conductor.

13. The arrangement according to claim 1 wherein the passive electrical component is arranged near the power semiconductor at a distance in a range of 0 mm to 20 mm.

14. The arrangement according to claim 1 wherein the cooling element is arranged on an upper side of the passive electrical component relative to a mounting plane of the passive electrical component.

15. The arrangement according to claim 1 wherein the passive electrical component has at least a surface area with a relatively high electrical conductivity.

16. The arrangement according to claim 1 wherein the arrangement contains at least a second passive electrical component, the cooling element being connected to at least said part of the surface of the passive electrical component as well as to at least a part of the a surface of the second passive electrical component.

17. A method for cooling a power semiconductor, comprising the steps of:

transferring at least a part of a power loss generated in the power semiconductor as heat via an electrically and thermally conductive connection between at least one electrical terminal of the power semiconductor and an electrical terminal of a passive electrical component; and

dissipating at least part of the heat transferred to the passive electrical component with a cooling element directly thermally connected to the passive electrical component but only indirectly thermally connected to said power semiconductor through said electrically and thermally conductive connection.

18. An arrangement for cooling a power semiconductor, comprising:

at least one power semiconductor and at least one inductor arranged within 20 mm or less of the power semiconductor;

at least one electrical terminal of the power semiconductor being electrically and thermally connected to an electrical terminal of the inductor via an electrical connection; and

a cooling element directly thermally connected to the inductor but only indirectly thermally connected to said power semiconductor through said electrical connection.

19. A method for cooling a power semiconductor, comprising the steps of:

transferring at least a part of a power loss generated in the power semiconductor as heat via an electrically and thermally conductive connection between at least one electrical terminal of the power semiconductor and an electrical terminal of an inductor, the inductor being arranged within 20 mm or less of the power semiconductor; and

dissipating at least part of the heat transferred to the inductor with a cooling element directly thermally connected to the inductor but only indirectly thermally connected to said power semiconductor through said electricall and thermally conductive connection.