Fix mounted earphone jack

• US 7,424,126 B2
• Filed: 05/27/2004
• Issued: 09/09/2008
• Est. Priority Date: 05/27/2004
• Status: Active Grant

• Current Assignee: Symbol Technologies, LLC (Zebra Technologies Corporation)
• Original Assignee: Symbol Technologies, Inc. (Zebra Technologies Corporation)
• Inventors: Bauer, David M., Sicari, Nancy, Jules, Adelson
• Primary Examiner(s): Ensey; Brian
• Application Number:
  US10/855,910
• Publication Number:
  US 20050265573A1
• Time in Patent Office: 1,566 Days
• Field of Search: 381/384, 381/370, 381/374, 381/183, 381/71.6, 381/74, 455/572, 455/607, 379/185, 368/93, 16/25, 439/281, 439/358, 439/607
• US Class Current: 381/384
• CPC Class Codes: H04M 1/05 specially adapted for use on head, throat or breast
• CPC Class Codes: H04M 1/6058 involving the use of a headset accessory device connected to the portable telephone

Abstract

An earphone jack, comprising an attachment assembly including a pin connector for insertion into an earpiece receptacle of a mobile unit, a cord, a portion of the cord being molded to the attachment assembly, the cord being conductively connected to the pin connector and an earphone connector coupled to the cord.

Claims

1. An earphone jack, comprising:

an attachment assembly including a pin connector for insertion into an earpiece receptacle of a mobile unit, the attachment assembly further including a clip to semi-permanently attach the attachment assembly to the mobile unit;

a cord, a portion of the cord being molded to the attachment assembly, the cord being conductively connected to the pin connector; and

an earphone connector including a first end electrically coupled to the cord and a second end having a structure adapted to couple directly to an earphone.

2. The earphone jack of claim 1, wherein the attachment assembly further includes a via through which a screw is placed to semi-permanently attach the attachment assembly to the mobile unit.

3. The earphone jack of claim 1, wherein the attachment assembly further includes a fitted molded portion for insertion into a recess of the mobile unit.

4. The earphone jack of claim 1, wherein the earphone connector is releaseably attached to an earphone.

5. The earphone jack of claim 1, wherein the attachment assembly is a molded material which, when attached to the mobile unit, follows a contour of the mobile unit.

6. The earphone jack of claim 1, wherein the attachment assembly further includes a gasket which seals an area of attachment between the attachment assembly and the mobile unit.

7. The earphone jack of claim 1, wherein the attachment assembly comprises a molded plastic material.

8. A mobile computing device, comprising:

a housing to contain the computing components of the mobile computing device, the housing including a earpiece receptacle;

an attachment assembly including a pin connector for insertion into the earpiece receptacle, the attachment assembly further including a clip to semi-permanently attach the attachment assembly to the mobile unit;

a cord molded to the attachment assembly, the cord being conductively connected to the pin connector; and

an earphone connector including a first end electrically coupled to the cord and a second end having a structure adapted to couple directly to an earphone.

9. The mobile computing device of claim 8, further comprising:

an earphone coupled to the earphone connector for receiving audio signals from the computing components.

10. The mobile computing device of claim 9, wherein the coupling between the earphone and the earphone connector is a quick release coupling.

11. The mobile computing device of claim 8 having an IP (International Protection Rating) of 54.

12. The mobile computing device of claim 8, wherein the housing further includes a threaded via and the attachment assembly includes a via, wherein a screw is placed through the via of the attachment assembly and threaded into the threaded via of the housing to semi-permanently couple the attachment assembly to the housing.

13. The mobile computing device of claim 8, wherein the housing further includes a recess and the attachment assembly includes a fined molded portion which fits into the recess.

14. An attachment assembly for an earphone jack, comprising:

a pin connector to insert into a earpiece receptacle of a mobile unit;

a connection assembly to semi-permanently couple the attachment assembly to a housing of the mobile unit, wherein, when the attachment assembly is coupled to the housing, an area of attachment is sealed from penetration of environmental contaminants, wherein the connection assembly includes a via for insertion of a screw to semi-permanently couple the attachment assembly to the housing, wherein the connection assembly includes a fitted molded portion for insertion into a recess of the housing.

15. The attachment assembly of claim 14, further comprising:

a gasket material facilitating the sealing of the attachment area.

16. The attachment assembly of claim 14, further comprising:

a cord coupling assembly to integrally couple a cord to the attachment assembly.