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Method of fabricating a multi-post structures on a substrate

  • US 7,425,465 B2
  • Filed: 05/15/2006
  • Issued: 09/16/2008
  • Est. Priority Date: 05/15/2006
  • Status: Active Grant
First Claim
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1. A method of forming a post structure assembly, comprising:

  • bonding a first substrate to a second substrate, wherein the bonding is achieved without a bonding layer;

    patterning the second substrate, wherein the patterning leaves a first portion of material of the second substrate and a second portion of material of the second substrate and removes material between the first and second portions of the second substrate, the first potion forming a plurality of structures and the second portion forming an assembly that is a unitary structure having a plurality of apertures therein; and

    separating the second portion of the second substrate from the first substrate, wherein the second portion does not include the structures.

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