Web process interconnect in electronic assemblies
First Claim
1. A method of fabricating an electronic assembly, the method comprising:
- providing a flexible web material, the web material have an aspect ratio of at least 25;
1;
forming contact pads on the web material, the contact pads configured to couple to an external circuitry, the external circuitry being a flexible antenna;
advancing the web material in a process line; and
placing integrated circuit elements onto the web material, each of the integrated circuit elements electrically coupled to at least one of the contact pads.
5 Assignments
0 Petitions
Accused Products
Abstract
Apparatuses and methods for forming displays are claimed. One embodiment of the invention relates to depositing a plurality of blocks onto a substrate and is coupled to a flexible layer having interconnect deposited thereon. Another embodiment of the invention relates to forming a display along a length of a flexible layer wherein a slurry containing a plurality of elements with circuit elements thereon washes over the flexible layer and slides into recessed regions or holes found in the flexible layer. Interconnect is then deposited thereon. In another embodiment, interconnect is placed on the flexible layer followed by a slurry containing a plurality of elements.
243 Citations
10 Claims
-
1. A method of fabricating an electronic assembly, the method comprising:
-
providing a flexible web material, the web material have an aspect ratio of at least 25;
1;forming contact pads on the web material, the contact pads configured to couple to an external circuitry, the external circuitry being a flexible antenna; advancing the web material in a process line; and placing integrated circuit elements onto the web material, each of the integrated circuit elements electrically coupled to at least one of the contact pads. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
-
-
10. A method of fabricating an electronic assembly, the method comprising:
-
providing a flexible web material, the web material have an aspect ratio of at least 25;
1;screen printing contact pads on the web material, the contact pads configured to couple to an external circuitry, the external circuitry being flexible antenna; advancing the web material in a process line; and robotically placing integrated circuit elements onto the web material as an array, each of the integrated circuit elements electrically coupled to at least one of the contact pads.
-
Specification