Snap lid camera module

• US 7,425,750 B2
• Filed: 08/17/2005
• Issued: 09/16/2008
• Est. Priority Date: 12/08/1999
• Status: Expired due to Term

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Webster, Steven, Glenn, Thomas P.
• Primary Examiner(s): THAI, LUAN C
• Application Number:
  US11/206,513
• Publication Number:
  US 20060027740A1
• Time in Patent Office: 1,126 Days
• Field of Search: 257/433, 257/434, 257/81, 257/84, 438/64, 438/48, 438/54, 438/69, 250/216, 250/239
• US Class Current: 257/434
• CPC Class Codes: B29C 2043/023 having a plurality of grooves
• CPC Class Codes: B29C 33/0022 Multi-cavity moulds B29C33/301 takes precedence
• CPC Class Codes: B29C 43/36 Moulds for making articles of definite length, i.e. discrete articles
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 27/14632 Wafer-level processed structures
• CPC Class Codes: H01L 27/14683 Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof not peculiar thereto H01L21/00
• CPC Class Codes: H01L 27/14687 Wafer level processing
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01032 : Germanium [Ge]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/16152 : Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/16153 : Cap enclosing a plurality of side-by-side cavities [e.g. E-shaped cap]
• CPC Class Codes: H01L 2924/181 : Encapsulation

Abstract

An image sensor package includes a molding having a locking feature. The package further includes a snap lid having a tab, where the tab is attached to the locking feature of the molding. To form the image sensor package, a window is placed in a pocket of the molding. The snap lid is secured in place. Once secured, the snap lid presses against a peripheral region of an exterior surface of the window. The window is sandwiched between the molding and the snap lid and held in place.

Claims

1. A camera module, comprising:

a substrate;

an image sensor comprising an active area for receiving light, said image sensor being coupled to a first surface of said substrate;

a molding coupled to said first surface of said substrate, said molding comprising a rectangular bar extending from said molding; and

a snap lid snapped onto said molding.

2. The camera module of claim 1 wherein said camera module is mounted on a larger substrate.

3. The camera module of claim 1 wherein said camera module is electrically connected to a larger substrate.

4. The camera module of claim 1 further comprising a means for electrically connecting said camera module to a larger substrate.

5. The camera module of claim 4 wherein said means for electrically connecting is coupled to a second surface of said substrate.

6. The camera module of claim 1 further comprising an adhesive layer coupling said molding to said substrate.

7. The camera module of claim 6 wherein said molding is attached to a periphery of said first surface of said substrate by said adhesive layer.

8. The camera module of claim 1 wherein bond pads of said image sensor are coupled to traces of said substrate.

9. The cameral module of claim 1 further comprising bond wires coupling bond pads of said image sensor to traces of said substrate.

12. The camera module of claim 1 wherein said snap lid comprises a plurality of alignment notches.

13. The camera module of claim 1 wherein said snap lid comprises:

a compression ring section comprising a central aperture; and

a snap extending from said compression ring section.

14. The camera module of claim 13 further comprising a window sandwiched between said molding and said snap lid, a central region of said window being exposed through said central aperture.

15. The camera module of claim 14 wherein said molding comprising a first pocket comprising a shelf, said shelf supporting a peripheral region of an interior surface of said window.

16. The camera module of claim 15 wherein said first pocket further comprises sides having a width substantially the same as a width of sides of said window.

17. The camera module of claim 13 wherein said rectangular bar comprises a lip, said snap comprising an inwardly extending tab in abutting contact with said lip.

18. The camera module of claim 13 wherein said snap further comprises a taper.

10. A camera module, comprising:

a substrate;

an image sensor comprising an active area for receiving light, said image sensor being coupled to a first surface of said substrate;

a molding coupled to said first surface of said substrate, said molding comprising a first pocket comprising a shelf;

a snap lid snapped onto said molding; and

a window between said snap lid and said molding, said shelf supporting a peripheral region of an interior surface of said window.

11. The camera module of claim 10 further comprising an adhesive layer attaching said molding to said substrate, wherein said window, said molding, said adhesive layer, and said substrate form an enclosure around said image sensor.

19. A camera module comprising:

a substrate;

an image sensor comprising an active area for receiving light, said image sensor being coupled to said substrate;

bond wires coupling bond pads of said image sensor to traces of said substrate;

a molding comprising a first pocket comprising a shelf;

an adhesive layer coupling said molding to said substrate;

a window comprising an interior surface and an exterior surface, a peripheral region of said interior surface being supported by said shelf;

a snap lid snapped onto said molding, said snap lid comprising a compression ring section comprising a second pocket comprising a shelf, said shelf of said second pocket contacting a peripheral region of said exterior surface of said window; and

a means for electrically connecting said camera module to a larger substrate.