Multi-chip module structure with power delivery using flexible cables

• US 7,425,760 B1
• Filed: 10/12/2005
• Issued: 09/16/2008
• Est. Priority Date: 10/13/2004
• Status: Active Grant

• Current Assignee: Oracle America, Inc. (Oracle Corporation)
• Original Assignee: Sun Microsystems Incorporated (Oracle Corporation)
• Inventors: Guenin, Bruce M., Nettleton, Nyles I.
• Primary Examiner(s): NGO, NGAN V
• Application Number:
  US11/250,100
• Time in Patent Office: 1,070 Days
• Field of Search: 257/698, 257/724, 257/E23.003, 257/E23.078, 257/E23.079, 438/110
• US Class Current: 257/698
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 23/48 Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/72 Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
• CPC Class Codes: H01L 25/0652 the devices being arranged next and on each other, i.e. mixed assemblies
• CPC Class Codes: H01L 25/0655 the devices being arranged next to each other
• CPC Class Codes: H01L 25/162 the devices being mounted on two or more different substrates
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01027 Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01074 Tungsten [W]
• CPC Class Codes: H01L 2924/01075 Rhenium [Re]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/1532 the connection portion being formed on the die mounting surface of the substrate
• CPC Class Codes: H01L 2924/19104 : on the semiconductor or solid-state device, i.e. passive-on-chip
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/351 : Thermal stress
• CPC Class Codes: H05K 1/0263 : High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board H05K1/0293 takes precedence
• CPC Class Codes: H05K 1/147 : at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit H05K1/148 takes precedence

Abstract

One embodiment of the present invention provides an integrated circuit module. This module includes a semiconductor die with an active face, upon which active circuitry and signal pads reside, and a back face opposite the active face. The module uses a flexible cable to deliver electrical power to the active face of the semiconductor die from a power distribution board located above the active face of the semiconductor die. This flexible cable provides electrical power to the semiconductor die without interfering with the alignment and heat removal functions of the module.

Claims

1. An integrated circuit module, comprising:

a semiconductor die with an active face upon which active circuitry and signal pads reside, and a back face opposite the active face;

a bridge chip mounted to the semiconductor die in the integrated circuit module using a mounting, interconnect, and communication structure;

wherein the bridge chip is positioned so that a free end is proximate to a neighboring semiconductor chip, and

wherein the bridge chip supports proximity communication between the semiconductor die in the integrated circuit module and the neighboring semiconductor chip; and

a flexible cable that delivers electrical power to the active face of the semiconductor die from a power distribution board located above the active face of the semiconductor die;

wherein the flexible cable provides electrical power to the semiconductor die and does not interfere with alignment and heat removal functions for the module.

2. The integrated circuit module of claim 1, wherein the use of the flexible cable for power delivery facilitates the layout of arrays of multiple semiconductor dies in a single layer.

3. The integrated circuit module of claim 1,

wherein the integrated circuit module further comprises a carrier chip;

wherein the back face of the semiconductor die is attached to the carrier chip; and

wherein the semiconductor die is electrically interconnected with the carrier chip.

4. The integrated circuit module of claim 3,

wherein the carrier chip is mounted on top of a cooling plate;

wherein the integrated circuit module further includes a thermal interface material between the carrier chip and the cooling plate;

wherein the thermal interface material ensures a thermal connection between the carrier chip or semiconductor die and the cooling plate; and

wherein heat is transferred from the semiconductor die and/or the carrier chip to the cooling plate.

5. The integrated circuit module of claim 4,

wherein the integrated circuit module further comprises a spring assembly that applies force to the semiconductor die and/or the carrier chip to ensure intimate contact and thermal conductivity between the carrier chip and the cooling plate;

and

wherein lateral forces are applied to the semiconductor die and/or the carrier chip to ensure contact with a set of alignment structures.

6. The integrated circuit module of claim 1,

wherein the flexible cable comprises both a flexible portion and a rigid portion;

wherein the flexible portion of the flexible cable has sufficient flexibility that it will not impede the alignment process of the semiconductor die; and

wherein the flexible cable comprises sufficient metal so that the electrical impedance will minimize voltage drop across the length of the flexible cable.

7. The integrated circuit module of claim 6, further comprising an integrated circuit which is integrated into the rigid portion of the flexible cable to enhance the functionality and performance of the semiconductor die;

and

wherein another rigid portion of the flexible cable is mounted to the semiconductor die.

8. The integrated circuit module of claim 7, wherein the integrated circuit which is integrated into the rigid portion of the flexible cable provides voltage conversion for the semiconductor die.

9. The integrated circuit module of claim 6,

wherein the flexible cable connects to the power distribution board using a connector;

and

wherein the connector allows the integrated circuit module to be mechanically inserted or removed from an array of multiple modules;

whereby mechanical insertion and removal eliminate a need to connect the flexible cable to the power distribution board using soldering operations.

10. The integrated circuit module of claim 1, wherein the power distribution board includes openings for optical fibers or electrical wires that facilitate communication between the semiconductor die and devices located about the power distribution board.

11. A computer system that includes an integrated circuit module, comprising:

a semiconductor die;

a flexible cable; and

a bridge chip mounted to the semiconductor die in the computer system using a mounting, interconnect, and communication structure, and

wherein the bridge chip is positioned so that a free end is proximate to a neighboring semiconductor chip;

wherein the bridge chip supports proximity communication between the semiconductor die in the integrated circuit module and the neighboring semiconductor chip;

wherein the semiconductor die includes an active face upon which active circuitry and signal pads reside, and a back face opposite the active face;

wherein the flexible cable delivers electrical power to the active face of the semiconductor die from a power distribution board located above the active face of the semiconductor die; and

wherein the flexible cable provides electrical power to the semiconductor die and does not interfere with alignment and heat removal functions for the module.

12. The computer system of claim 11, wherein the use of the flexible cable for power delivery facilitates the layout of arrays of multiple semiconductor dies in a single layer.

13. The computer system of claim 11,

wherein the computer system further comprises a carrier chip;

wherein the back face of the semiconductor die is attached to the carrier chip; and

wherein the semiconductor die is electrically interconnected with the carrier chip.

14. The computer system of claim 13,

wherein the carrier chip is mounted on top of a cooling plate;

wherein the computer system further includes a thermal interface material between the carrier chip and the cooling plate;

wherein the thermal interface material ensures a thermal connection between the carrier chip or semiconductor die and the cooling plate; and

wherein heat is transferred from the semiconductor die and/or the carrier chip to the cooling plate.

15. The computer system of claim 14, wherein the computer system further comprises a spring assembly that applies force to the semiconductor die and/or the carrier chip to ensure intimate contact and thermal conductivity between the carrier chip and the cooling plate;

and

wherein lateral forces are applied to the semiconductor die and/or the carrier chip to ensure contact with a set of alignment structures.

16. The computer system of claim 11,

wherein the flexible cable comprises both a flexible portion and a rigid portion;

wherein the flexible portion of the flexible cable has sufficient flexibility that it will not impede the alignment process of the semiconductor die; and

wherein the flexible cable comprises sufficient metal so that the electrical impedance will minimize the voltage drop across the length of the flexible cable.

17. The computer system of claim 16, further comprising an integrated circuit which is integrated into the rigid portion of the flexible cable to enhance the functionality and performance of the semiconductor die;

and

wherein another rigid portion of the flexible cable is mounted to the semiconductor die.

18. The computer system of claim 17, wherein the integrated circuit which is integrated into the rigid portion of the flexible cable provides voltage conversion for the semiconductor die.

19. The computer system of claim 16,

wherein the flexible cable connects to the power distribution board using a connector;

and

wherein the connector allows the integrated circuit module to be mechanically inserted or removed from an array of multiple modules;

whereby mechanical insertion and removal eliminate a need to connect the flexible cable to the power distribution board using soldering operations.

20. A method for manufacturing an integrated circuit module, comprising:

arranging a flexible cable to deliver power to the active face of a semiconductor die from a power distribution board located above the active face of the semiconductor die, wherein the semiconductor die includes an active face upon which active circuitry and signal pads reside, and a back face opposite the active face;

mounting a bridge chip to the semiconductor die in the integrated circuit module using a mounting, interconnect, and communication structure;

positioning the bridge chip so that a free end is proximate to a neighboring semiconductor chip;

wherein the bridge chip supports proximity communication between the semiconductor die in the integrated circuit module and the neighboring semiconductor chip; and

wherein the flexible cable provides electrical power to the semiconductor die and does not interfere with alignment and heat removal functions for the module.